Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, PoE+, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, PoE+, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65W/35W TDP) and Intel Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× SODIMM slots. Features integrated Intel® UHD Graphics 770/730, 1× PCI Slo, 5× 2.5GbE + 1× GbE LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DVI-D, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO expansion port, remote power control, rugged -25?°C…+70?°C fanless operation, 8–48?V DC input, wall-mount chassis 240×225×90?mm, 3.58?kg, UL certified, PoE+, Neousys

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, PoE+, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, PoE+, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65W/35W TDP) and Intel Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× SODIMM slots. Features integrated Intel UHD Graphics 770/730, 1× PCI Slo, 5× 2.5GbE + 1× GbE LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DVI-D, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO expansion port, remote power control, rugged -25?°C…+70?°C fanless operation, 8–48?V DC input, wall-mount chassis 240×225×90?mm, 3.58?kg, PoE+, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, PoE+, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65W/35W TDP) and Intel Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× SODIMM slots. Features integrated Intel UHD Graphics 770/730, 1× PCI Slo, 5× 2.5GbE + 1× GbE LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DVI-D, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO expansion port, remote power control, rugged -25?°C…+70?°C fanless operation, 8–48?V DC input, wall-mount chassis 240×225×90?mm, 3.58?kg, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65W/35W TDP) and Intel Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× SODIMM slots. Features integrated Intel UHD Graphics 770/730, 1× PCI Slo, 5× 2.5GbE + 1× GbE LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DVI-D, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO expansion port, remote power control, rugged -25?°C…+70?°C fanless operation, 8–48?V DC input, wall-mount chassis 240×225×90?mm, 3.58?kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Ultra-low-profile embedded computer supporting Intel 14th/13th/12th Gen Core™ i9/i7/i5/i3 processors (LGA1700, 35/65?W TDP), Intel® Q670E chipset, up to 64?GB DDR5-4800 via 2× SODIMM. Integrated Intel UHD Graphics 770/730, 2× 2.5GbE + 1× GbE, USB 3.2 Gen2x2 Type-C, 6× USB 3.2, 2× USB 2.0, 1× VGA, 1× DVI-D, 1× DP, 2× RS-232/422/485, 2× RS-232, Audio, 2× 2.5" SATA (RAID 0/1), 1× M.2 Gen4 NVMe, 1× mini-PCIe, 1× M.2 B-Key with SIM, 1× MezIO® slot, ignition control optional, rugged ?25?°C…+70?°C fanless, ultra-low-profile chassis 240×225×78?mm, 3.35?kg.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

Machine vision controller with Intel 6th-Gen Core i7/i5 LGA1151 CPU support, Intel Q170 chipset, up to 32 GB DDR4-2133, integrated Intel HD Graphics 530, 4x PoE+ Gigabit ports, 4x USB 3.1, 4x USB 2.0, 6x GbE, 2x DisplayPort, 1x VGA, 1x DVI-D, 3x serial ports, support for 75W NVIDIA GPU via PCIe x16 cassette, 4-CH CC/CV LED lighting controller, 4-CH camera trigger, 1-CH quadrature encoder input, 8-CH isolated DI and 8-CH isolated DO, MCU-based real-time I/O control by DTIO V2, dual SATA with RAID 0/1, 1x mSATA, wall-mount chassis.

Hersteller: Neousys Technology

Kategorie: Keine Kategorie

Machine vision controller with Intel 6th-Gen Core i7/i5 LGA1151 CPU support, Intel Q170 chipset, up to 32 GB DDR4-2133, integrated Intel HD Graphics 530, 4x PoE+ Gigabit ports, 4x USB 3.1, 4x USB 2.0, 6x GbE, 2x DisplayPort, 1x VGA, 1x DVI-D, 3x serial ports, support for 75W NVIDIA GPU via PCIe x16 cassette, 4-CH CC/CV LED lighting controller, 4-CH camera trigger, 1-CH quadrature encoder input, 8-CH isolated DI and 8-CH isolated DO, MCU-based real-time I/O control by NuMCU, dual SATA with RAID 0/1, 1x mSATA, wall-mount chassis.

Hersteller: Neousys Technology

Kategorie: Keine Kategorie

- **Rugged GPU-Computing Platform:** Supports NVIDIA® GPUs up to 120W TDP, enabling 4–6 TFLOPS of inference performance for AI workloads. - **Intel® 8th-Gen Coffee Lake CPU Support:** Compatible with 35W and 65W TDP processors, including Core™ i7/i5/i3, Pentium®, and Celeron® models. - **Enhanced Thermal Design:** Patented Cassette design with guided airflow and smart fan control ensures stable GPU operation at ambient temperatures up to 60°C under full load. - **Rich I/O Connectivity:** Six Gigabit Ethernet ports (five Intel® I210 and one Intel® I219), eight USB ports (four USB 3.1 Gen2 and four USB 3.1 Gen1), four serial ports, and multiple video outputs. - **High-Speed Storage:** Supports dual 2.5" SATA III drives with RAID 0/1, one M.2 2280 NVMe SSD slot (PCIe Gen3 x4), and one full-size mSATA slot. - **Expansion Flexibility:** Includes one PCIe x16 slot (Gen3, 16 lanes) for GPU installation, one full-size mini PCIe slot, one M.2 2242 B-key slot with dual SIM sockets, and one MezIO™ expansion port. - **Wide Operating Range:** Operates from -25°C to +60°C (depending on CPU configuration) and accepts 8–35VDC input voltage. - **Industrial Durability:** Complies with MIL-STD-810G vibration and shock standards, ensuring reliability in mobile and industrial environments. - **Compact and Mountable:** Compact 240 x 225 x 111 mm chassis with wall-mounting standard and optional DIN-rail mounting. - **Optional PoE+ Support:** IEEE 802.3at PoE+ PSE available for GbE ports 3–6, providing up to 100W total power budget for powered devices. - **Advanced Management:** Supports Intel® AMT 12.0 for remote management and TPM 2.0 for hardware-level security.

Hersteller: Neousys Technology

Kategorie: Embedded with GPU

Fanless in-vehicle embedded controller supporting Intel 8th/9th-Gen Core i7/i5/i3 LGA1151 CPUs (35W TDP), Intel Q370 chipset, up to 64 GB DDR4 2666/2400 via two SODIMM slots, 2x GbE plus 4x IEEE 802.3at PoE+ ports by Intel I210 with RJ45 connectors, 1x isolated CAN 2.0, 4x isolated DI and 4x isolated DO, 4x USB 3.1 Gen2, 4x USB 3.1 Gen1, VGA, DVI-D, DisplayPort, 4x serial ports, 2x SATA with one hot-swappable 2.5 in tray supporting RAID 0/1, mSATA, M.2 2280 M-key, 2x M.2 2242 B-key, 3x full-size mini-PCIe, 8~35V DC input with ignition control, -40°C to 70°C operation.

Hersteller: Neousys Technology

Kategorie: Keine Kategorie

Fanless in-vehicle embedded controller supporting Intel 8th/9th-Gen Core i7/i5/i3 LGA1151 CPUs (35W TDP), Intel Q370 chipset, up to 64 GB DDR4 2666/2400 via two SODIMM slots, 2x GbE plus 8x IEEE 802.3at PoE+ ports by Intel I210 with RJ45 connectors, 1x isolated CAN 2.0, 4x isolated DI and 4x isolated DO, 4x USB 3.1 Gen2, 4x USB 3.1 Gen1, VGA, DVI-D, DisplayPort, 4x serial ports, 2x SATA with one hot-swappable 2.5 in tray supporting RAID 0/1, mSATA, M.2 2280 M-key, 2x M.2 2242 B-key, 3x full-size mini-PCIe, 8~35V DC input with ignition control, -40°C to 70°C operation, E-Mark compliance.

Hersteller: Neousys Technology

Kategorie: Keine Kategorie

- **Processor Options:** - Intel® Atom® x7‑E3950 (quad‑core, 1.6 GHz base / 2.0 GHz burst) - Intel® Atom® x5‑E3930 (dual‑core, 1.3 GHz base / 1.8 GHz burst) - **Compact Fanless Design:** - Dimensions: 140 (W) × 110 (D) × 58 (H) mm - Weight: 0.95 kg (2.06 lb) - Full aluminum alloy enclosure for durability and heat dissipation - **Rich I/O and Expansion:** - 1 × DisplayPort 1.2 (DP++) supporting up to 4096 × 2160 @ 60 Hz - 2 × USB 3.0, 2 × USB 2.0 - 2 × Intel® I210 GbE LAN ports - 2 × COM ports (BIOS‑selectable RS‑232/422/485) - 2 × full‑size Mini PCIe slots - 1 × USIM slot for 3G/4G LTE modules - 1 × mSATA slot, 1 × Micro SD slot - Optional 2.5" SATA SSD or isolated 8 DI / 8 DO module (1.5 kV isolation) - **Optional Features:** - eSIM support (project‑based) - Audio (mic‑in, line‑out/speaker) - Wireless kits (Wi‑Fi, Bluetooth, 3G, 4G LTE, LoRa) - 2.5" SATA HDD/SSD kit (P/N 91‑95223‑0010) - 40 W or 90 W industrial‑grade AC‑DC adapter - **Manageability:** - Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health, watchdog timer, and remote monitoring - Hardware watchdog timer and BMC support - **Certifications:** - Railway EN50121 compliance - CE/FCC Class B (EN61000‑6‑4/‑2) - UL, CB safety certifications

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

- **Processor:** Intel® Atom® x5-E3930 dual-core SoC, base frequency 1.3 GHz, burst up to 1.8 GHz. - **Memory:** 2 GB DDR3L-1600 SODIMM (expandable up to 8 GB). - **Fanless Design:** Fully enclosed aluminum alloy chassis for silent, maintenance-free operation. - **Compact Form Factor:** 140 mm (W) × 110 mm (D) × 58 mm (H). - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) supporting up to 4096×2160 @ 60 Hz. - 2 × Intel® I210 Gigabit Ethernet ports. - 2 × COM ports (RS-232/422/485, BIOS selectable). - 2 × USB 3.0 and 2 × USB 2.0 ports. - **Expansion Options:** - 2 × full-size Mini PCIe slots. - 1 × USIM socket for 3G/4G LTE modules. - 1 × mSATA slot and 1 × MicroSD slot. - Optional 2.5" SATA SSD via internal SATA wafer. - **Power Input:** Wide-range 6–36 VDC input with 3-pin pluggable connector (GND, V-, V+). - **Operating Temperature:** Extended temperature model supports -20°C to +70°C. - **Shock & Vibration Resistance:** 100 G shock, 5 Grms vibration (SSD configuration). - **Certifications:** CE, FCC Class B, EN61000-6-4/-2, EN50121 (railway), UL, CB. - **Manageability:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health monitoring and remote management. - **Security:** TPM 2.0, Intel® Boot Guard, UEFI Secure Boot. - **Mounting Options:** DIN rail (standard) and wall-mount (optional). - **Software Support:** Windows® 10 IoT Enterprise 64-bit, Ubuntu Linux 16.04 LTS 64-bit, Wind River® Pulsar™ Linux (on request).

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

- **Processor:** Intel® Atom® x5-E3930 dual-core SoC, base frequency 1.3 GHz, burst frequency up to 1.8 GHz. - **Memory:** 2 GB DDR3L-1600 SODIMM (expandable up to 8 GB). - **Fanless Design:** Fully enclosed aluminum alloy chassis for passive cooling and silent operation. - **Compact Form Factor:** 140 mm (W) × 110 mm (D) × 58 mm (H); weight 0.95 kg. - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) supporting up to 4096 × 2160 @ 60 Hz - 2 × Intel® I210 GbE LAN ports - 2 × COM ports (BIOS-selectable RS-232/422/485) - 2 × USB 3.0 and 2 × USB 2.0 ports - **Expansion Options:** - 2 × full-size Mini PCIe slots - 1 × USIM socket for 3G/4G LTE modules - 1 × mSATA slot - 1 × Micro SD slot (up to 32 GB) - **Storage Options:** - mSATA SSD (factory-installed 16/32/64 GB options) - Optional 2.5" SATA SSD/HDD via internal SATA wafer - **Power Input:** Wide-range 6–36 VDC input with 3-pin pluggable connector (GND, V-, V+). - **Operating Temperature:** - Standard: 0°C to +50°C - Extended: -20°C to +70°C (with industrial SSD) - Wide Temperature (WT model): -40°C to +85°C (with industrial SSD and ETTS kit) - **Shock and Vibration Resistance:** - Shock: 100 G, half sine 11 ms duration - Vibration: 5 Grms, 5–500 Hz, 3 axes - **Certifications:** CE, FCC Class B, EN61000-6-4/-2, EN50121 (railway), UL, CB. - **Manageability:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health monitoring, watchdog timer, and remote management. - **Security:** TPM 2.0, Intel® Boot Guard, UEFI Secure Boot. - **Mounting Options:** DIN rail (standard), wall mount (optional). - **Software Support:** Windows® 10 IoT Enterprise 64-bit, Ubuntu Linux 16.04 LTS 64-bit, Wind River® Pulsar™ Linux LTS 17 (on request).

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

- **Processor:** Intel® Atom® x5-E3930 dual-core SoC, base frequency 1.3 GHz, burst frequency up to 1.8 GHz. - **Memory:** 2 GB DDR3L-1600 SODIMM (expandable up to 8 GB). - **Fanless Design:** Completely fanless operation for silent, maintenance-free performance. - **Compact Form Factor:** 140 mm (W) × 110 mm (D) × 58 mm (H). - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) - 2 × Intel® I210 GbE LAN ports - 2 × COM ports (RS-232/422/485, BIOS selectable) - 2 × USB 3.0 and 2 × USB 2.0 ports - **Expansion Options:** - 2 × full-size Mini PCIe slots - 1 × USIM socket for 3G/4G LTE modules - 1 × mSATA slot - 1 × Micro SD slot (up to 32 GB) - **Optional Storage:** 2.5" SATA SSD/HDD via internal SATA wafer. - **Power Input:** Wide-range 6–36 VDC input with 3-pin pluggable connector. - **Operating Temperature:** - Standard: 0°C to 50°C - Extended: -20°C to 70°C (with industrial SSD) - Wide: -40°C to 85°C (with industrial SSD and ETTS kit) - **Rugged Construction:** Aluminum alloy chassis, shock tolerance up to 100 G, vibration resistance 5 Grms. - **Certifications:** CE, FCC Class B, EN50121 (railway), UL, CB. - **Manageability:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system monitoring and remote management. - **Security:** TPM 2.0, Intel Boot Guard, UEFI Secure Boot. - **Mounting Options:** DIN rail (standard) and wall mount (optional). - **Software Support:** Windows 10 IoT Enterprise 64-bit, Ubuntu 16.04 LTS 64-bit, Wind River Pulsar Linux (on request).

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded