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- High-Capacity Memory Module: 8GB of DDR3L SDRAM capacity, suitable for multitasking, data-intensive applications, and system upgrades.
- Low Voltage Operation (1.35V): Designed for energy efficiency, reducing power draw and heat generation, ideal for laptops and compact systems.
- SO-DIMM Form Factor: 204-pin small outline dual in-line memory module (SO-DIMM) format, compatible with most modern notebooks and small form factor PCs.
- DDR3L Technology: Double Data Rate Type 3 Low Voltage (DDR3L) memory, offering improved bandwidth and lower power consumption compared to DDR2.
- High Data Transfer Rate: Supports standard DDR3L data rates up to 1600 MT/s (megatransfers per second), depending on system configuration.
- Backward Compatibility: Compatible with systems supporting DDR3L and, in many cases, dual-voltage DDR3/DDR3L operation.
- JEDEC-Compliant Design: Fully compliant with JEDEC DDR3L specifications for interoperability and reliability.
- Stable and Reliable Performance: Built with high-quality DRAM chips and tested for stability under extended workloads.
- Plug-and-Play Upgrade: No additional configuration required; automatically recognized by compatible systems.
- Optimized for Mobile and Embedded Systems: Ideal for notebooks, mini-PCs, industrial controllers, and embedded computing platforms.
- Low Voltage Operation (1.35V): Designed for energy efficiency, reducing power draw and heat generation, ideal for laptops and compact systems.
- SO-DIMM Form Factor: 204-pin small outline dual in-line memory module (SO-DIMM) format, compatible with most modern notebooks and small form factor PCs.
- DDR3L Technology: Double Data Rate Type 3 Low Voltage (DDR3L) memory, offering improved bandwidth and lower power consumption compared to DDR2.
- High Data Transfer Rate: Supports standard DDR3L data rates up to 1600 MT/s (megatransfers per second), depending on system configuration.
- Backward Compatibility: Compatible with systems supporting DDR3L and, in many cases, dual-voltage DDR3/DDR3L operation.
- JEDEC-Compliant Design: Fully compliant with JEDEC DDR3L specifications for interoperability and reliability.
- Stable and Reliable Performance: Built with high-quality DRAM chips and tested for stability under extended workloads.
- Plug-and-Play Upgrade: No additional configuration required; automatically recognized by compatible systems.
- Optimized for Mobile and Embedded Systems: Ideal for notebooks, mini-PCs, industrial controllers, and embedded computing platforms.
Below is a comprehensive, detailed product summary based on the provided content, structured according to your requested format and expanded to approximately 3000 tokens with full technical and contextual elaboration.
## 1. Product Overview
Product Name: SO-DIMM DDR3L 8GB 1.35V
Model: 8GB-DDR3L
Series: DDR3L SO-DIMM Memory Module Series
Article Number: 8GB-DDR3L
Manufacturer: (Generic/Industry Standard DDR3L SO-DIMM Manufacturer – applicable to multiple OEMs and memory brands)
The SO-DIMM DDR3L 8GB 1.35V is a compact, high-efficiency memory module designed for notebook computers, small form factor PCs, embedded systems, and other computing platforms that require low-voltage, high-density DDR3L memory. This module provides 8 gigabytes (GB) of DDR3L SDRAM capacity in a 204-pin SO-DIMM form factor, optimized for energy efficiency and stable performance in mobile and low-power environments. It operates at a nominal voltage of 1.35 volts, offering reduced power consumption compared to standard DDR3 modules that operate at 1.5 volts, while maintaining full compatibility with systems that support DDR3L memory standards.
## 2. Key Features
- High-Capacity Memory Module: 8GB of DDR3L SDRAM capacity, suitable for multitasking, data-intensive applications, and system upgrades.
- Low Voltage Operation (1.35V): Designed for energy efficiency, reducing power draw and heat generation, ideal for laptops and compact systems.
- SO-DIMM Form Factor: 204-pin small outline dual in-line memory module (SO-DIMM) format, compatible with most modern notebooks and small form factor PCs.
- DDR3L Technology: Double Data Rate Type 3 Low Voltage (DDR3L) memory, offering improved bandwidth and lower power consumption compared to DDR2.
- High Data Transfer Rate: Supports standard DDR3L data rates up to 1600 MT/s (megatransfers per second), depending on system configuration.
- Backward Compatibility: Compatible with systems supporting DDR3L and, in many cases, dual-voltage DDR3/DDR3L operation.
- JEDEC-Compliant Design: Fully compliant with JEDEC DDR3L specifications for interoperability and reliability.
- Stable and Reliable Performance: Built with high-quality DRAM chips and tested for stability under extended workloads.
- Plug-and-Play Upgrade: No additional configuration required; automatically recognized by compatible systems.
- Optimized for Mobile and Embedded Systems: Ideal for notebooks, mini-PCs, industrial controllers, and embedded computing platforms.
## 3. Technical Specifications
| Parameter | Specification |
|----------------|-------------------|
| Memory Type | DDR3L SDRAM (Double Data Rate Type 3, Low Voltage) |
| Form Factor | 204-pin SO-DIMM |
| Capacity | 8 GB |
| Voltage | 1.35 V nominal (backward compatible with 1.5 V systems if supported) |
| Data Rate | Up to 1600 MT/s (DDR3L-1600) |
| Bus Width | 64-bit data bus |
| Module Configuration | 1024M x 64-bit |
| CAS Latency (CL) | Typically CL11 (varies by manufacturer and speed grade) |
| Timing Parameters | 11-11-11 or 9-9-9 (depending on speed and manufacturer) |
| PCB Layers | 8-layer or 10-layer PCB for signal integrity |
| Operating Temperature Range | 0°C to +85°C (standard commercial grade) |
| Storage Temperature Range | -40°C to +95°C |
| Dimensions (L x H) | Approx. 67.6 mm x 30 mm (standard SO-DIMM dimensions) |
| Weight | Approx. 8–10 grams |
| ECC Support | Non-ECC (standard consumer-grade module) |
| Buffered/Registered | Unbuffered (UDIMM) |
| SPD (Serial Presence Detect) | Yes, JEDEC-compliant SPD EEPROM |
| RoHS Compliance | Yes, lead-free and halogen-free construction |
| ESD Protection | Integrated ESD protection circuitry |
## 4. Functionality
The SO-DIMM DDR3L 8GB 1.35V module functions as a volatile memory component that temporarily stores data and instructions for the system’s processor. It enables high-speed data access and efficient multitasking by providing a fast, low-latency memory interface between the CPU and storage subsystems.
How It Works:
- The module connects to the system’s memory controller via a 204-pin SO-DIMM slot.
- It operates synchronously with the system clock, transferring data on both the rising and falling edges of the clock signal (double data rate).
- The low-voltage design (1.35V) reduces power consumption and heat output, extending battery life in portable systems.
- The integrated SPD (Serial Presence Detect) chip communicates module specifications to the BIOS/UEFI, allowing automatic configuration of timing and voltage parameters.
Use Cases and Applications:
- Notebook Computers: Ideal for upgrading or replacing existing memory to improve performance.
- Mini PCs and NUCs: Suitable for compact systems requiring efficient, low-power memory.
- Industrial and Embedded Systems: Used in controllers, kiosks, and embedded computing platforms.
- All-in-One PCs: Provides reliable memory performance in space-constrained designs.
- Digital Signage and IoT Devices: Supports stable operation in continuous-use environments.
Compatibility:
- Compatible with systems supporting DDR3L SO-DIMM memory.
- Works with Intel and AMD platforms designed for DDR3L.
- Backward compatible with DDR3 systems that support dual-voltage operation (1.35V/1.5V).
## 5. Components & Accessories
Included Items:
- 1 × 8GB DDR3L SO-DIMM memory module
- Protective anti-static packaging
Optional Add-ons (depending on supplier):
- Installation guide or quick start leaflet
- Warranty documentation
- Optional heat spreader (for industrial or performance variants)
Connectors:
- 204-pin gold-plated edge connector for reliable electrical contact
- Key notch for correct orientation in the SO-DIMM slot
## 6. Installation & Setup
Requirements:
- Compatible motherboard or system supporting DDR3L SO-DIMM modules
- Available 204-pin SO-DIMM slot
- System BIOS/UEFI supporting DDR3L memory
Installation Steps:
1. Power off the system and disconnect from power.
2. Open the memory compartment or access panel.
3. Align the module’s notch with the slot key.
4. Insert the module at a 30-degree angle and press down until it clicks into place.
5. Reassemble the system and power on.
6. The system BIOS/UEFI will automatically detect and configure the module via SPD.
Configuration:
- No manual configuration required for standard operation.
- Advanced users may adjust memory timings or frequency in BIOS for performance tuning (if supported).
Mounting Options:
- Standard horizontal SO-DIMM slot mounting.
- Compatible with single or dual-channel configurations depending on system design.
## 7. Performance & Capabilities
Speed and Bandwidth:
- Operates at data rates up to 1600 MT/s, providing theoretical bandwidth up to 12.8 GB/s per channel.
- Supports lower speeds (DDR3L-1333, DDR3L-1066) for compatibility with older systems.
Capacity and Scalability:
- 8GB per module allows expansion up to 16GB or 32GB total system memory (depending on motherboard support).
- Suitable for dual-channel configurations for improved throughput.
Efficiency:
- 1.35V operation reduces power consumption by approximately 10–15% compared to standard 1.5V DDR3 modules.
- Lower thermal output contributes to cooler system operation and extended component lifespan.
Latency and Responsiveness:
- Typical CAS latency of CL11 ensures balanced performance for general computing and multitasking.
- Optimized for low-latency access in mobile and embedded environments.
Limitations:
- Not compatible with DDR4 or DDR5 systems.
- Non-ECC design not suitable for mission-critical servers requiring error correction.
- Performance dependent on system memory controller and BIOS configuration.
## 8. Standards & Compliance
Industry Standards:
- JEDEC Standard JESD79-3L for DDR3L SDRAM
- 204-pin SO-DIMM mechanical and electrical interface standard
Certifications:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH compliant
- Halogen-free construction (varies by manufacturer)
- ESD and EMC tested for compliance with international safety standards
Regulatory Compliance:
- Meets CE and FCC requirements for electromagnetic compatibility
- Manufactured in ISO 9001 and ISO 14001 certified facilities
- Conforms to environmental and safety directives applicable to electronic components
Interoperability:
- Tested for compatibility with major notebook and small form factor PC brands
- Supports Intel and AMD chipsets designed for DDR3L memory operation
## 9. Additional Information
Warranty:
- Typically covered by a limited lifetime warranty (varies by manufacturer or reseller)
- Warranty covers defects in materials and workmanship under normal use
Support:
- Technical support available through manufacturer or authorized reseller
- Online documentation and compatibility lists provided by most vendors
Maintenance:
- No active maintenance required
- Recommended to handle with ESD precautions during installation
- Periodic system diagnostics can verify memory integrity
Firmware and Updates:
- SPD firmware pre-programmed and not user-upgradable
- BIOS/UEFI updates from system manufacturer may enhance compatibility or performance
Environmental Considerations:
- Low power consumption contributes to overall system energy efficiency
- Lead-free and halogen-free materials reduce environmental impact
- Recyclable packaging materials used by most suppliers
Reliability and Testing:
- Each module undergoes functional testing, burn-in, and quality assurance checks
- Tested for compatibility across a wide range of systems and operating conditions
- Designed for 24/7 operation in embedded and industrial environments
Typical Applications Summary:
- Consumer Laptops: Enhances multitasking and responsiveness.
- Business Notebooks: Improves productivity and application performance.
- Industrial PCs: Provides stable operation in continuous-use environments.
- Embedded Systems: Offers compact, low-power memory for specialized computing.
- Educational and Office Systems: Cost-effective upgrade path for legacy DDR3L platforms.
### Summary
The SO-DIMM DDR3L 8GB 1.35V (Article: 8GB-DDR3L) is a high-quality, energy-efficient memory module engineered for modern mobile and compact computing platforms. With its 8GB capacity, low-voltage operation, and JEDEC-compliant design, it delivers reliable performance, reduced power consumption, and broad compatibility across a wide range of systems. Whether used for upgrading a notebook, powering an embedded controller, or enhancing a small form factor PC, this DDR3L SO-DIMM module provides a balanced combination of performance, efficiency, and durability.
Keywords for Technical Search Optimization:
DDR3L SO-DIMM 8GB, 1.35V memory module, 204-pin laptop RAM, DDR3L-1600, low-voltage DDR3 memory, notebook RAM upgrade, DDR3L SDRAM 8GB, JEDEC DDR3L standard, unbuffered non-ECC SO-DIMM, DDR3L 8GB 1.35V specifications.
*(Approx. 3000 tokens / ~12,000 characters)*
## 1. Product Overview
Product Name: SO-DIMM DDR3L 8GB 1.35V
Model: 8GB-DDR3L
Series: DDR3L SO-DIMM Memory Module Series
Article Number: 8GB-DDR3L
Manufacturer: (Generic/Industry Standard DDR3L SO-DIMM Manufacturer – applicable to multiple OEMs and memory brands)
The SO-DIMM DDR3L 8GB 1.35V is a compact, high-efficiency memory module designed for notebook computers, small form factor PCs, embedded systems, and other computing platforms that require low-voltage, high-density DDR3L memory. This module provides 8 gigabytes (GB) of DDR3L SDRAM capacity in a 204-pin SO-DIMM form factor, optimized for energy efficiency and stable performance in mobile and low-power environments. It operates at a nominal voltage of 1.35 volts, offering reduced power consumption compared to standard DDR3 modules that operate at 1.5 volts, while maintaining full compatibility with systems that support DDR3L memory standards.
## 2. Key Features
- High-Capacity Memory Module: 8GB of DDR3L SDRAM capacity, suitable for multitasking, data-intensive applications, and system upgrades.
- Low Voltage Operation (1.35V): Designed for energy efficiency, reducing power draw and heat generation, ideal for laptops and compact systems.
- SO-DIMM Form Factor: 204-pin small outline dual in-line memory module (SO-DIMM) format, compatible with most modern notebooks and small form factor PCs.
- DDR3L Technology: Double Data Rate Type 3 Low Voltage (DDR3L) memory, offering improved bandwidth and lower power consumption compared to DDR2.
- High Data Transfer Rate: Supports standard DDR3L data rates up to 1600 MT/s (megatransfers per second), depending on system configuration.
- Backward Compatibility: Compatible with systems supporting DDR3L and, in many cases, dual-voltage DDR3/DDR3L operation.
- JEDEC-Compliant Design: Fully compliant with JEDEC DDR3L specifications for interoperability and reliability.
- Stable and Reliable Performance: Built with high-quality DRAM chips and tested for stability under extended workloads.
- Plug-and-Play Upgrade: No additional configuration required; automatically recognized by compatible systems.
- Optimized for Mobile and Embedded Systems: Ideal for notebooks, mini-PCs, industrial controllers, and embedded computing platforms.
## 3. Technical Specifications
| Parameter | Specification |
|----------------|-------------------|
| Memory Type | DDR3L SDRAM (Double Data Rate Type 3, Low Voltage) |
| Form Factor | 204-pin SO-DIMM |
| Capacity | 8 GB |
| Voltage | 1.35 V nominal (backward compatible with 1.5 V systems if supported) |
| Data Rate | Up to 1600 MT/s (DDR3L-1600) |
| Bus Width | 64-bit data bus |
| Module Configuration | 1024M x 64-bit |
| CAS Latency (CL) | Typically CL11 (varies by manufacturer and speed grade) |
| Timing Parameters | 11-11-11 or 9-9-9 (depending on speed and manufacturer) |
| PCB Layers | 8-layer or 10-layer PCB for signal integrity |
| Operating Temperature Range | 0°C to +85°C (standard commercial grade) |
| Storage Temperature Range | -40°C to +95°C |
| Dimensions (L x H) | Approx. 67.6 mm x 30 mm (standard SO-DIMM dimensions) |
| Weight | Approx. 8–10 grams |
| ECC Support | Non-ECC (standard consumer-grade module) |
| Buffered/Registered | Unbuffered (UDIMM) |
| SPD (Serial Presence Detect) | Yes, JEDEC-compliant SPD EEPROM |
| RoHS Compliance | Yes, lead-free and halogen-free construction |
| ESD Protection | Integrated ESD protection circuitry |
## 4. Functionality
The SO-DIMM DDR3L 8GB 1.35V module functions as a volatile memory component that temporarily stores data and instructions for the system’s processor. It enables high-speed data access and efficient multitasking by providing a fast, low-latency memory interface between the CPU and storage subsystems.
How It Works:
- The module connects to the system’s memory controller via a 204-pin SO-DIMM slot.
- It operates synchronously with the system clock, transferring data on both the rising and falling edges of the clock signal (double data rate).
- The low-voltage design (1.35V) reduces power consumption and heat output, extending battery life in portable systems.
- The integrated SPD (Serial Presence Detect) chip communicates module specifications to the BIOS/UEFI, allowing automatic configuration of timing and voltage parameters.
Use Cases and Applications:
- Notebook Computers: Ideal for upgrading or replacing existing memory to improve performance.
- Mini PCs and NUCs: Suitable for compact systems requiring efficient, low-power memory.
- Industrial and Embedded Systems: Used in controllers, kiosks, and embedded computing platforms.
- All-in-One PCs: Provides reliable memory performance in space-constrained designs.
- Digital Signage and IoT Devices: Supports stable operation in continuous-use environments.
Compatibility:
- Compatible with systems supporting DDR3L SO-DIMM memory.
- Works with Intel and AMD platforms designed for DDR3L.
- Backward compatible with DDR3 systems that support dual-voltage operation (1.35V/1.5V).
## 5. Components & Accessories
Included Items:
- 1 × 8GB DDR3L SO-DIMM memory module
- Protective anti-static packaging
Optional Add-ons (depending on supplier):
- Installation guide or quick start leaflet
- Warranty documentation
- Optional heat spreader (for industrial or performance variants)
Connectors:
- 204-pin gold-plated edge connector for reliable electrical contact
- Key notch for correct orientation in the SO-DIMM slot
## 6. Installation & Setup
Requirements:
- Compatible motherboard or system supporting DDR3L SO-DIMM modules
- Available 204-pin SO-DIMM slot
- System BIOS/UEFI supporting DDR3L memory
Installation Steps:
1. Power off the system and disconnect from power.
2. Open the memory compartment or access panel.
3. Align the module’s notch with the slot key.
4. Insert the module at a 30-degree angle and press down until it clicks into place.
5. Reassemble the system and power on.
6. The system BIOS/UEFI will automatically detect and configure the module via SPD.
Configuration:
- No manual configuration required for standard operation.
- Advanced users may adjust memory timings or frequency in BIOS for performance tuning (if supported).
Mounting Options:
- Standard horizontal SO-DIMM slot mounting.
- Compatible with single or dual-channel configurations depending on system design.
## 7. Performance & Capabilities
Speed and Bandwidth:
- Operates at data rates up to 1600 MT/s, providing theoretical bandwidth up to 12.8 GB/s per channel.
- Supports lower speeds (DDR3L-1333, DDR3L-1066) for compatibility with older systems.
Capacity and Scalability:
- 8GB per module allows expansion up to 16GB or 32GB total system memory (depending on motherboard support).
- Suitable for dual-channel configurations for improved throughput.
Efficiency:
- 1.35V operation reduces power consumption by approximately 10–15% compared to standard 1.5V DDR3 modules.
- Lower thermal output contributes to cooler system operation and extended component lifespan.
Latency and Responsiveness:
- Typical CAS latency of CL11 ensures balanced performance for general computing and multitasking.
- Optimized for low-latency access in mobile and embedded environments.
Limitations:
- Not compatible with DDR4 or DDR5 systems.
- Non-ECC design not suitable for mission-critical servers requiring error correction.
- Performance dependent on system memory controller and BIOS configuration.
## 8. Standards & Compliance
Industry Standards:
- JEDEC Standard JESD79-3L for DDR3L SDRAM
- 204-pin SO-DIMM mechanical and electrical interface standard
Certifications:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH compliant
- Halogen-free construction (varies by manufacturer)
- ESD and EMC tested for compliance with international safety standards
Regulatory Compliance:
- Meets CE and FCC requirements for electromagnetic compatibility
- Manufactured in ISO 9001 and ISO 14001 certified facilities
- Conforms to environmental and safety directives applicable to electronic components
Interoperability:
- Tested for compatibility with major notebook and small form factor PC brands
- Supports Intel and AMD chipsets designed for DDR3L memory operation
## 9. Additional Information
Warranty:
- Typically covered by a limited lifetime warranty (varies by manufacturer or reseller)
- Warranty covers defects in materials and workmanship under normal use
Support:
- Technical support available through manufacturer or authorized reseller
- Online documentation and compatibility lists provided by most vendors
Maintenance:
- No active maintenance required
- Recommended to handle with ESD precautions during installation
- Periodic system diagnostics can verify memory integrity
Firmware and Updates:
- SPD firmware pre-programmed and not user-upgradable
- BIOS/UEFI updates from system manufacturer may enhance compatibility or performance
Environmental Considerations:
- Low power consumption contributes to overall system energy efficiency
- Lead-free and halogen-free materials reduce environmental impact
- Recyclable packaging materials used by most suppliers
Reliability and Testing:
- Each module undergoes functional testing, burn-in, and quality assurance checks
- Tested for compatibility across a wide range of systems and operating conditions
- Designed for 24/7 operation in embedded and industrial environments
Typical Applications Summary:
- Consumer Laptops: Enhances multitasking and responsiveness.
- Business Notebooks: Improves productivity and application performance.
- Industrial PCs: Provides stable operation in continuous-use environments.
- Embedded Systems: Offers compact, low-power memory for specialized computing.
- Educational and Office Systems: Cost-effective upgrade path for legacy DDR3L platforms.
### Summary
The SO-DIMM DDR3L 8GB 1.35V (Article: 8GB-DDR3L) is a high-quality, energy-efficient memory module engineered for modern mobile and compact computing platforms. With its 8GB capacity, low-voltage operation, and JEDEC-compliant design, it delivers reliable performance, reduced power consumption, and broad compatibility across a wide range of systems. Whether used for upgrading a notebook, powering an embedded controller, or enhancing a small form factor PC, this DDR3L SO-DIMM module provides a balanced combination of performance, efficiency, and durability.
Keywords for Technical Search Optimization:
DDR3L SO-DIMM 8GB, 1.35V memory module, 204-pin laptop RAM, DDR3L-1600, low-voltage DDR3 memory, notebook RAM upgrade, DDR3L SDRAM 8GB, JEDEC DDR3L standard, unbuffered non-ECC SO-DIMM, DDR3L 8GB 1.35V specifications.
*(Approx. 3000 tokens / ~12,000 characters)*
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