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Startseite / Produkte / Industrial Computers / Artificial Intelligence Robot / Lightweight Jetson Orin NX 16GB mission computer for UAV and UGV applications.
Lightweight Jetson Orin NX 16GB mission computer for UAV and UGV applications.
Lightweight Jetson Orin NX 16GB mission computer for UAV and UGV applications. Lightweight Jetson Orin NX 16GB mission computer for UAV and UGV applications.

FLYC-300-JON16

Lightweight Jetson Orin NX 16GB mission computer for UAV and UGV applications.
Angebot anfragen
  • Hersteller Neousys Technology
  • Kategorie: Artificial Intelligence Robot
  • Der FLYC-300-JON16 von Neousys ist ein leichter KI-Missionscomputer für unbemannte Luft- und Bodenfahrzeuge. Sein NVIDIA Jetson Orin NX mit 16 GB LPDDR5 unterstützt Anwendungen wie autonome Navigation, Hindernisvermeidung und Objekterkennung. Zwei Ethernet-, zwei USB-3.2- und zwei GMSL2-Anschlüsse verbinden Kameras und Sensoren. UART und CAN ermöglichen die Kommunikation mit dem Flugcontroller. M.2-Steckplätze stehen für NVMe-Speicher und 4G/5G-Module bereit. Die Ausführung ohne Gehäuse wiegt 297 g und unterstützt 4S–14S-Akkupacks. Für erweiterte Temperaturbereiche ist eine geeignete Wärmeableitung erforderlich.
NVIDIA Jetson Orin NX SOM with Ampere GPU, ARM Cortex CPU and 16GB LPDDR5 at 3200 MHz. Provides 1x GbE, 1x 2.5GbE, USB 3.2 Gen2 and Gen1, 2x GMSL2, DisplayPort, CAN 2.0, UART, I2C and isolated 2 DI/4 DO. Includes an M.2 2230 M-key NVMe Gen4 x4 interface and an M.2 3042/3052 B-key slot with micro SIM for 4G/5G modules. Supports 12–60 VDC and 4S–14S batteries. Unenclosed version: 124 x 123 x 29.8 mm, 297 g. Extended operating temperatures require specified cooling and battery conditions.
  • Processor Platform NVIDIA Jetson Orin NX SOM with NVIDIA Ampere GPU and ARM Cortex CPU
  • Installed Memory 16GB LPDDR5 on SOM, 3200 MHz
  • Series AI Performance Up to 100 TOPS; no separate model-specific performance stated
  • GMSL2 Camera Inputs 2x GMSL2 FAKRA Z; supports 2x 1920x1080 at 60 FPS or 2x 2880x1860 at 30 FPS
  • Ethernet Ports 1x Gigabit Ethernet by NVIDIA; 1x 2.5 Gigabit Ethernet by Intel I226-IT/I225-IT
  • External USB Ports 1x USB 3.2 Gen2 at 10 Gbps; 1x USB 3.2 Gen1 at 5 Gbps
  • Internal USB Interfaces 1x USB Type-C for debug only; 1x USB 2.0
  • Display Output 1x DisplayPort connector
  • Control Interfaces 1x CAN bus 2.0; 1x UART; I2C
  • Isolated Digital I/O Channels 2 DI; 4 DO
  • Digital I/O 2 isolated digital inputs; 4 isolated digital outputs
  • NVMe Storage Interface 1x M.2 2230 M-key socket, NVMe Gen4 x4; storage capacity not specified
  • Memory Card Slot 1x microSD card slot
  • Cellular Expansion Slot 1x M.2 3042/3052 B-key with internal micro SIM socket; supports 4G/5G module installation
  • DC Input Voltage 12–60 VDC
  • Power Connector and Battery Support XT-30; 4S–14S drone battery packs, subject to operating-temperature limits
  • Enclosure Without enclosure
  • Dimensions 124 x 123 x 29.8 mm
  • Weight 297 g
  • Mounting Method Wall mount
  • Form Factor Unenclosed embedded mission computer; wall mount
  • Connector 2x Ethernet; 2x USB 3.2; 2x GMSL2 FAKRA Z; DisplayPort; microSD; internal USB Type-C debug; internal USB 2.0; XT-30 DC input; M.2 M-key; M.2 B-key; internal micro SIM
  • Dimensions 124 x 123 x 29.8 mm
  • Optional Cooling Fan External-accessible 65 x 65 mm fan for system heat dissipation
  • Extended Temperature Requirements Secure heat spreader to an aluminum surface for conduction; wide-temperature SSD required for sub-zero operation
  • Operating Temperature Without Heat-Spreader Attachment -25 to 40 °C; 4S–14S battery packs
  • Operating Temperature With Heat-Spreader Attachment -25 to 60 °C with 4S–14S; -25 to 70 °C with 4S–6S
  • Storage Temperature -40 to 85 °C
  • Humidity 10–90, non-condensing %
  • Operating Vibration Standard MIL-STD-810H, Method 514.8, Category 4
  • Operating Shock Standard MIL-STD-810H, Method 516.8, Procedure I
  • Operating Temperature -25 to 40 °C without heat-spreader attachment, 4S–14S; -25 to 60 °C with attachment, 4S–14S; -25 to 70 °C with attachment, 4S–6S; wide-temperature SSD required below 0 °C
  • Safety Standard EN 62368-1
  • EMC Compliance CE/FCC Class A, according to EN 55032 and EN 55035
  • Optional Fan Assembly AccsyBx-FAN-FLYC-300
  • Optional Cable Kit Cblkit-FLYC-300; no further specifications stated
  • Optional Thermal Pad ThermalPad-90-FLYC-300; 90 x 90 x 0.5 mm
  • Optional Power Adapter PA-60W-FLYC300; 60W AC/DC, 12V/5A DC; cord-end terminals with 2 splicing connectors; operating temperature -30 to 70 °C
  • Target Applications UAV and UGV autonomy; navigation; obstacle avoidance; object detection and tracking; drone imagery; environmental and infrastructure monitoring
  • Bus Interface M.2 NVMe PCIe Gen4 x4; M.2 B-key; CAN 2.0; I2C; UART
  • Key Features Jetson Orin NX 16GB; 297 g unenclosed design; dual Ethernet; dual USB 3.2; dual GMSL2; isolated 2 DI/4 DO; UART and CAN flight-controller interfaces; NVMe Gen4 x4; 4G/5G expansion ready; 12–60 VDC input
  • Accessories AccsyBx-FAN-FLYC-300, Cblkit-FLYC-300, ThermalPad-90-FLYC-300, PA-60W-FLYC300

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