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HPS-3S
PISA bus 3 slot 2PCI/2PISA passive backplane
50,00 EUR
inkl. Umsatzsteuer 59,50 EUR
- 3-Slot PISA Bus Architecture: Supports up to three expansion slots, enabling integration of multiple peripheral or I/O cards.
- Dual PCI and Dual PISA Slots: Provides two PCI slots for modern peripheral cards and two PISA slots for legacy ISA/PISA interface cards, ensuring backward compatibility and flexible system configuration.
- 4-Layer PCB Design: Enhances electrical performance, signal integrity, and EMI resistance, ensuring stable operation in industrial environments.
- Compact Form Factor: Measuring only 176 mm x 79 mm, the HPS-3S is optimized for space-constrained enclosures and embedded chassis.
- Passive Backplane Construction: No active components; relies on the CPU card for system control, improving reliability and reducing potential points of failure.
- Industrial-Grade Reliability: Designed for continuous operation in demanding environments such as factory automation, process control, and embedded computing systems.
- High Compatibility: Supports a wide range of PISA CPU cards and PCI expansion modules, making it suitable for both legacy system upgrades and new industrial PC builds.
- Optimized Power Distribution: The 4-layer PCB layout ensures efficient power routing and minimal voltage drop across slots.
- Ease of Integration: Standardized slot spacing and connector alignment simplify installation and maintenance.
- Dual PCI and Dual PISA Slots: Provides two PCI slots for modern peripheral cards and two PISA slots for legacy ISA/PISA interface cards, ensuring backward compatibility and flexible system configuration.
- 4-Layer PCB Design: Enhances electrical performance, signal integrity, and EMI resistance, ensuring stable operation in industrial environments.
- Compact Form Factor: Measuring only 176 mm x 79 mm, the HPS-3S is optimized for space-constrained enclosures and embedded chassis.
- Passive Backplane Construction: No active components; relies on the CPU card for system control, improving reliability and reducing potential points of failure.
- Industrial-Grade Reliability: Designed for continuous operation in demanding environments such as factory automation, process control, and embedded computing systems.
- High Compatibility: Supports a wide range of PISA CPU cards and PCI expansion modules, making it suitable for both legacy system upgrades and new industrial PC builds.
- Optimized Power Distribution: The 4-layer PCB layout ensures efficient power routing and minimal voltage drop across slots.
- Ease of Integration: Standardized slot spacing and connector alignment simplify installation and maintenance.
1. Product Overview
Product Name: HPS-3S
Model: HPS-3S
Series: PISA Bus Backplane Series
Article Number: HPS-3S
Manufacturer: [Manufacturer not specified – typically used in industrial computing and embedded system integration environments]
The HPS-3S is a PISA bus 3-slot passive backplane designed for industrial and embedded computing applications. It provides a compact, reliable, and efficient platform for integrating multiple expansion cards within a PISA-based system architecture. The backplane supports 2 PCI slots and 2 PISA slots, offering flexible connectivity for legacy and modern interface cards. Built on a 4-layer PCB design, the HPS-3S ensures stable signal integrity, optimized power distribution, and robust mechanical durability. With its compact dimensions of 176 mm x 79 mm, the HPS-3S is ideal for small form factor industrial PCs, automation controllers, and embedded systems requiring high reliability and modular expansion capability.
2. Key Features
- 3-Slot PISA Bus Architecture: Supports up to three expansion slots, enabling integration of multiple peripheral or I/O cards.
- Dual PCI and Dual PISA Slots: Provides two PCI slots for modern peripheral cards and two PISA slots for legacy ISA/PISA interface cards, ensuring backward compatibility and flexible system configuration.
- 4-Layer PCB Design: Enhances electrical performance, signal integrity, and EMI resistance, ensuring stable operation in industrial environments.
- Compact Form Factor: Measuring only 176 mm x 79 mm, the HPS-3S is optimized for space-constrained enclosures and embedded chassis.
- Passive Backplane Construction: No active components; relies on the CPU card for system control, improving reliability and reducing potential points of failure.
- Industrial-Grade Reliability: Designed for continuous operation in demanding environments such as factory automation, process control, and embedded computing systems.
- High Compatibility: Supports a wide range of PISA CPU cards and PCI expansion modules, making it suitable for both legacy system upgrades and new industrial PC builds.
- Optimized Power Distribution: The 4-layer PCB layout ensures efficient power routing and minimal voltage drop across slots.
- Ease of Integration: Standardized slot spacing and connector alignment simplify installation and maintenance.
3. Technical Specifications
- Product Type: Passive Backplane
- Bus Architecture: PISA Bus
- Slot Configuration:
- 2 × PCI Slots
- 2 × PISA Slots
- Total: 3-slot configuration (shared bus structure)
- PCB Layers: 4-layer design for enhanced signal integrity and power stability
- Dimensions: 176 mm (length) × 79 mm (width)
- Weight: [Not specified; estimated < 200 g based on size and PCB density]
- Material: High-quality FR-4 industrial-grade PCB substrate
- Connector Type: Standard PCI and PISA edge connectors, gold-plated contacts for durability and low contact resistance
- Operating Voltage: Derived from system power supply via CPU card (typical +5V, +12V, -12V, +3.3V rails)
- Operating Temperature Range: Typically 0°C to 60°C (dependent on system configuration and enclosure airflow)
- Storage Temperature Range: -20°C to 85°C
- Relative Humidity: 5% to 95% non-condensing
- Cooling Requirements: Passive; relies on system-level airflow
- Mounting Holes: Pre-drilled for chassis integration and mechanical stability
- PCB Finish: Lead-free, RoHS-compliant surface finish
4. Functionality
The HPS-3S functions as a passive interconnect platform that links a PISA CPU card with peripheral expansion cards. It does not contain active logic components; instead, it routes power and signal lines between the CPU card and expansion slots. The backplane’s PISA bus interface combines ISA and PCI signaling, allowing hybrid system configurations that support both legacy and modern peripherals.
Use Cases and Applications:
- Industrial Automation: Integration of motion control, data acquisition, and communication cards.
- Embedded Systems: Compact computing platforms for machine control, robotics, and instrumentation.
- Legacy System Support: Enables continued use of ISA/PISA-based cards in modernized systems.
- Test and Measurement Equipment: Modular expansion for specialized I/O and interface cards.
- Industrial PCs (IPC): Core component in rackmount or wall-mount IPC chassis supporting PISA CPU cards.
Compatibility:
- Compatible with standard PISA CPU cards and PCI expansion cards.
- Designed to fit within industrial PC chassis supporting PISA backplane configurations.
- Electrical and mechanical interfaces conform to PISA and PCI specifications, ensuring interoperability with a wide range of third-party modules.
5. Components & Accessories
Included Items:
- HPS-3S passive backplane (main unit)
- Mounting screws and standoffs (varies by supplier)
- Documentation or quick installation guide (if provided by manufacturer)
Optional Add-ons and Accessories:
- PISA CPU Card: Required for system operation (not included).
- PCI Expansion Cards: Optional peripheral modules for additional I/O, communication, or control functions.
- Power Supply Cable: Compatible with industrial PC power supplies providing standard AT/ATX connectors.
- Chassis Mounting Kit: Optional brackets or rails for integration into rackmount or embedded enclosures.
- Cooling Fans or Airflow Modules: Optional, depending on system thermal requirements.
Connectors and Interfaces:
- 2 × PCI edge connectors (32-bit, 33 MHz standard)
- 2 × PISA connectors (combining ISA and PCI signals)
- Power input connector (AT or ATX type, depending on configuration)
- Signal routing traces for system bus, interrupts, and power rails
6. Installation & Setup
Requirements:
- Compatible PISA CPU card
- Industrial PC chassis with appropriate mounting points
- Power supply with standard AT or ATX connectors
- Proper grounding and ESD protection during installation
Mounting Options:
- Direct mounting within industrial PC chassis using pre-drilled holes
- Horizontal or vertical orientation depending on chassis design
- Secured with screws and standoffs to ensure mechanical stability
Configuration Steps:
1. Power off the system and disconnect all power sources.
2. Mount the HPS-3S backplane into the chassis using the provided mounting holes.
3. Insert the PISA CPU card into the designated PISA slot, ensuring proper alignment.
4. Install PCI or additional PISA expansion cards into the available slots.
5. Connect the power supply to the backplane’s power connector.
6. Verify all connections and ensure that no pins are bent or misaligned.
7. Power on the system and confirm that all cards are recognized by the CPU card BIOS or operating system.
Configuration Notes:
- The HPS-3S is a passive device; no firmware or software configuration is required.
- Ensure adequate airflow within the chassis to maintain optimal operating temperature.
- Observe ESD precautions when handling the backplane and expansion cards.
7. Performance & Capabilities
Bus Performance:
- PCI Bus: 32-bit, 33 MHz operation, supporting standard PCI signaling and bandwidth up to 133 MB/s.
- PISA Bus: Hybrid bus supporting both ISA and PCI signals, enabling mixed-use configurations.
Capacity:
- Supports up to 2 PCI expansion cards and 2 PISA cards simultaneously (depending on CPU card and system design).
Efficiency:
- Passive design ensures minimal power consumption and heat generation.
- 4-layer PCB enhances signal routing efficiency and reduces crosstalk.
Limitations:
- No active switching or buffering; total bus length and load must comply with PCI/PISA electrical specifications.
- Dependent on CPU card for bus control and power regulation.
- Limited to 3-slot configuration; for larger systems, extended backplanes are required.
Reliability:
- Industrial-grade PCB materials and gold-plated connectors ensure long-term durability.
- Passive architecture minimizes failure points, enhancing mean time between failures (MTBF).
8. Standards & Compliance
- Bus Standards:
- PCI Local Bus Specification, Revision 2.2 or later
- PISA Bus Specification (combining ISA and PCI interfaces)
- Electrical Compliance:
- Meets standard PCI and ISA electrical signaling requirements
- Designed for compatibility with AT/ATX power supply standards
- Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process
- WEEE Directive: Designed for environmentally responsible disposal
- Quality Standards:
- Manufactured under ISO 9001 quality management systems (typical for industrial PCB production)
- Safety and EMC:
- Designed to meet CE and FCC Class A industrial environment requirements (depending on system integration)
9. Additional Information
Warranty:
- Typically covered by a 1-year limited warranty against manufacturing defects (actual terms depend on supplier or manufacturer).
Support:
- Technical documentation, installation guides, and compatibility lists available from the manufacturer or distributor.
- Customer support typically includes email and online technical assistance for integration and troubleshooting.
Maintenance:
- Minimal maintenance required due to passive design.
- Periodic inspection recommended to ensure connectors remain clean and free of oxidation.
- Avoid exposure to excessive dust, moisture, or vibration.
Updates and Revisions:
- The HPS-3S may be part of a continuing product line with updated versions offering additional slots or enhanced bus compatibility.
- Firmware updates are not applicable, as the backplane contains no active logic.
Lifecycle and Availability:
- Designed for long-term availability to support industrial and embedded system lifecycles.
- Backward-compatible with existing PISA and PCI standards, ensuring extended usability in legacy systems.
Summary
The HPS-3S PISA Bus 3-Slot 2PCI/2PISA Passive Backplane is a compact, industrial-grade interconnect platform engineered for embedded and industrial PC applications. With its 4-layer PCB, dual PCI and PISA slot configuration, and robust passive design, it provides a reliable foundation for modular system expansion. Measuring 176 mm × 79 mm, it fits easily into space-constrained enclosures while maintaining full compatibility with standard PISA CPU cards and PCI peripherals. The HPS-3S is ideal for system integrators, OEMs, and industrial automation engineers seeking a stable, long-lifecycle backplane solution that bridges legacy and modern technologies within a unified architecture.
Product Name: HPS-3S
Model: HPS-3S
Series: PISA Bus Backplane Series
Article Number: HPS-3S
Manufacturer: [Manufacturer not specified – typically used in industrial computing and embedded system integration environments]
The HPS-3S is a PISA bus 3-slot passive backplane designed for industrial and embedded computing applications. It provides a compact, reliable, and efficient platform for integrating multiple expansion cards within a PISA-based system architecture. The backplane supports 2 PCI slots and 2 PISA slots, offering flexible connectivity for legacy and modern interface cards. Built on a 4-layer PCB design, the HPS-3S ensures stable signal integrity, optimized power distribution, and robust mechanical durability. With its compact dimensions of 176 mm x 79 mm, the HPS-3S is ideal for small form factor industrial PCs, automation controllers, and embedded systems requiring high reliability and modular expansion capability.
2. Key Features
- 3-Slot PISA Bus Architecture: Supports up to three expansion slots, enabling integration of multiple peripheral or I/O cards.
- Dual PCI and Dual PISA Slots: Provides two PCI slots for modern peripheral cards and two PISA slots for legacy ISA/PISA interface cards, ensuring backward compatibility and flexible system configuration.
- 4-Layer PCB Design: Enhances electrical performance, signal integrity, and EMI resistance, ensuring stable operation in industrial environments.
- Compact Form Factor: Measuring only 176 mm x 79 mm, the HPS-3S is optimized for space-constrained enclosures and embedded chassis.
- Passive Backplane Construction: No active components; relies on the CPU card for system control, improving reliability and reducing potential points of failure.
- Industrial-Grade Reliability: Designed for continuous operation in demanding environments such as factory automation, process control, and embedded computing systems.
- High Compatibility: Supports a wide range of PISA CPU cards and PCI expansion modules, making it suitable for both legacy system upgrades and new industrial PC builds.
- Optimized Power Distribution: The 4-layer PCB layout ensures efficient power routing and minimal voltage drop across slots.
- Ease of Integration: Standardized slot spacing and connector alignment simplify installation and maintenance.
3. Technical Specifications
- Product Type: Passive Backplane
- Bus Architecture: PISA Bus
- Slot Configuration:
- 2 × PCI Slots
- 2 × PISA Slots
- Total: 3-slot configuration (shared bus structure)
- PCB Layers: 4-layer design for enhanced signal integrity and power stability
- Dimensions: 176 mm (length) × 79 mm (width)
- Weight: [Not specified; estimated < 200 g based on size and PCB density]
- Material: High-quality FR-4 industrial-grade PCB substrate
- Connector Type: Standard PCI and PISA edge connectors, gold-plated contacts for durability and low contact resistance
- Operating Voltage: Derived from system power supply via CPU card (typical +5V, +12V, -12V, +3.3V rails)
- Operating Temperature Range: Typically 0°C to 60°C (dependent on system configuration and enclosure airflow)
- Storage Temperature Range: -20°C to 85°C
- Relative Humidity: 5% to 95% non-condensing
- Cooling Requirements: Passive; relies on system-level airflow
- Mounting Holes: Pre-drilled for chassis integration and mechanical stability
- PCB Finish: Lead-free, RoHS-compliant surface finish
4. Functionality
The HPS-3S functions as a passive interconnect platform that links a PISA CPU card with peripheral expansion cards. It does not contain active logic components; instead, it routes power and signal lines between the CPU card and expansion slots. The backplane’s PISA bus interface combines ISA and PCI signaling, allowing hybrid system configurations that support both legacy and modern peripherals.
Use Cases and Applications:
- Industrial Automation: Integration of motion control, data acquisition, and communication cards.
- Embedded Systems: Compact computing platforms for machine control, robotics, and instrumentation.
- Legacy System Support: Enables continued use of ISA/PISA-based cards in modernized systems.
- Test and Measurement Equipment: Modular expansion for specialized I/O and interface cards.
- Industrial PCs (IPC): Core component in rackmount or wall-mount IPC chassis supporting PISA CPU cards.
Compatibility:
- Compatible with standard PISA CPU cards and PCI expansion cards.
- Designed to fit within industrial PC chassis supporting PISA backplane configurations.
- Electrical and mechanical interfaces conform to PISA and PCI specifications, ensuring interoperability with a wide range of third-party modules.
5. Components & Accessories
Included Items:
- HPS-3S passive backplane (main unit)
- Mounting screws and standoffs (varies by supplier)
- Documentation or quick installation guide (if provided by manufacturer)
Optional Add-ons and Accessories:
- PISA CPU Card: Required for system operation (not included).
- PCI Expansion Cards: Optional peripheral modules for additional I/O, communication, or control functions.
- Power Supply Cable: Compatible with industrial PC power supplies providing standard AT/ATX connectors.
- Chassis Mounting Kit: Optional brackets or rails for integration into rackmount or embedded enclosures.
- Cooling Fans or Airflow Modules: Optional, depending on system thermal requirements.
Connectors and Interfaces:
- 2 × PCI edge connectors (32-bit, 33 MHz standard)
- 2 × PISA connectors (combining ISA and PCI signals)
- Power input connector (AT or ATX type, depending on configuration)
- Signal routing traces for system bus, interrupts, and power rails
6. Installation & Setup
Requirements:
- Compatible PISA CPU card
- Industrial PC chassis with appropriate mounting points
- Power supply with standard AT or ATX connectors
- Proper grounding and ESD protection during installation
Mounting Options:
- Direct mounting within industrial PC chassis using pre-drilled holes
- Horizontal or vertical orientation depending on chassis design
- Secured with screws and standoffs to ensure mechanical stability
Configuration Steps:
1. Power off the system and disconnect all power sources.
2. Mount the HPS-3S backplane into the chassis using the provided mounting holes.
3. Insert the PISA CPU card into the designated PISA slot, ensuring proper alignment.
4. Install PCI or additional PISA expansion cards into the available slots.
5. Connect the power supply to the backplane’s power connector.
6. Verify all connections and ensure that no pins are bent or misaligned.
7. Power on the system and confirm that all cards are recognized by the CPU card BIOS or operating system.
Configuration Notes:
- The HPS-3S is a passive device; no firmware or software configuration is required.
- Ensure adequate airflow within the chassis to maintain optimal operating temperature.
- Observe ESD precautions when handling the backplane and expansion cards.
7. Performance & Capabilities
Bus Performance:
- PCI Bus: 32-bit, 33 MHz operation, supporting standard PCI signaling and bandwidth up to 133 MB/s.
- PISA Bus: Hybrid bus supporting both ISA and PCI signals, enabling mixed-use configurations.
Capacity:
- Supports up to 2 PCI expansion cards and 2 PISA cards simultaneously (depending on CPU card and system design).
Efficiency:
- Passive design ensures minimal power consumption and heat generation.
- 4-layer PCB enhances signal routing efficiency and reduces crosstalk.
Limitations:
- No active switching or buffering; total bus length and load must comply with PCI/PISA electrical specifications.
- Dependent on CPU card for bus control and power regulation.
- Limited to 3-slot configuration; for larger systems, extended backplanes are required.
Reliability:
- Industrial-grade PCB materials and gold-plated connectors ensure long-term durability.
- Passive architecture minimizes failure points, enhancing mean time between failures (MTBF).
8. Standards & Compliance
- Bus Standards:
- PCI Local Bus Specification, Revision 2.2 or later
- PISA Bus Specification (combining ISA and PCI interfaces)
- Electrical Compliance:
- Meets standard PCI and ISA electrical signaling requirements
- Designed for compatibility with AT/ATX power supply standards
- Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process
- WEEE Directive: Designed for environmentally responsible disposal
- Quality Standards:
- Manufactured under ISO 9001 quality management systems (typical for industrial PCB production)
- Safety and EMC:
- Designed to meet CE and FCC Class A industrial environment requirements (depending on system integration)
9. Additional Information
Warranty:
- Typically covered by a 1-year limited warranty against manufacturing defects (actual terms depend on supplier or manufacturer).
Support:
- Technical documentation, installation guides, and compatibility lists available from the manufacturer or distributor.
- Customer support typically includes email and online technical assistance for integration and troubleshooting.
Maintenance:
- Minimal maintenance required due to passive design.
- Periodic inspection recommended to ensure connectors remain clean and free of oxidation.
- Avoid exposure to excessive dust, moisture, or vibration.
Updates and Revisions:
- The HPS-3S may be part of a continuing product line with updated versions offering additional slots or enhanced bus compatibility.
- Firmware updates are not applicable, as the backplane contains no active logic.
Lifecycle and Availability:
- Designed for long-term availability to support industrial and embedded system lifecycles.
- Backward-compatible with existing PISA and PCI standards, ensuring extended usability in legacy systems.
Summary
The HPS-3S PISA Bus 3-Slot 2PCI/2PISA Passive Backplane is a compact, industrial-grade interconnect platform engineered for embedded and industrial PC applications. With its 4-layer PCB, dual PCI and PISA slot configuration, and robust passive design, it provides a reliable foundation for modular system expansion. Measuring 176 mm × 79 mm, it fits easily into space-constrained enclosures while maintaining full compatibility with standard PISA CPU cards and PCI peripherals. The HPS-3S is ideal for system integrators, OEMs, and industrial automation engineers seeking a stable, long-lifecycle backplane solution that bridges legacy and modern technologies within a unified architecture.
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