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- Processor Support: 6th Generation Intel® Core™ i7/i5/i3 (Skylake) processors; MVP‑6023 specifically equipped with Intel® Core™ i3‑6100TE (dual‑core, 3.2 GHz, 35 W TDP).
- Chipset: Intel® Q170 Express for extended I/O and industrial‑grade reliability.
- Memory: Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.
- Display Capability: Supports two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA; maximum resolution up to 4096 × 2304 @ 60 Hz.
- Expansion Slots:
- 2 × PCIe Gen3 x8 (mechanical x16 slots with x8 signals)
- 2 × PCI 32‑bit/33 MHz slots
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication: 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Interfaces: 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot.
- Audio: 1 × Mic‑in, 1 × Line‑out.
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (fanless operation with 35 W CPU).
- Mounting: Wall‑mount kit included.
- Construction: Rugged fanless aluminum chassis for high MTBF and silent operation.
- Chipset: Intel® Q170 Express for extended I/O and industrial‑grade reliability.
- Memory: Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.
- Display Capability: Supports two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA; maximum resolution up to 4096 × 2304 @ 60 Hz.
- Expansion Slots:
- 2 × PCIe Gen3 x8 (mechanical x16 slots with x8 signals)
- 2 × PCI 32‑bit/33 MHz slots
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication: 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Interfaces: 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot.
- Audio: 1 × Mic‑in, 1 × Line‑out.
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (fanless operation with 35 W CPU).
- Mounting: Wall‑mount kit included.
- Construction: Rugged fanless aluminum chassis for high MTBF and silent operation.
Comprehensive Product Summary – ADLINK MVP‑6023 Fanless Expandable Embedded Computer
### 1. Product Overview
Product Name: MVP‑6023
Model: MVP‑6023
Series: MVP‑6010/6020 Series (Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers)
Article Number: MVP‑6023
Manufacturer: ADLINK Technology, Inc.
Product Type: Fanless expandable embedded computer for industrial automation and edge computing applications
Processor Platform: Intel® 6th Generation Core™ i3‑6100TE (Skylake)
Chipset: Intel® Q170 Express
The ADLINK MVP‑6023 is a member of the MVP‑6020 Series, part of ADLINK’s Value Family of fanless embedded computers. It is designed for industrial automation, machine vision, motion control, and surveillance applications requiring high reliability, expandability, and silent operation. The system integrates a 6th Generation Intel® Core™ i3‑6100TE processor with the Intel® Q170 chipset, providing a balance of performance and energy efficiency in a rugged, fanless chassis.
### 2. Key Features
- Processor Support: 6th Generation Intel® Core™ i7/i5/i3 (Skylake) processors; MVP‑6023 specifically equipped with Intel® Core™ i3‑6100TE (dual‑core, 3.2 GHz, 35 W TDP).
- Chipset: Intel® Q170 Express for extended I/O and industrial‑grade reliability.
- Memory: Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.
- Display Capability: Supports two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA; maximum resolution up to 4096 × 2304 @ 60 Hz.
- Expansion Slots:
- 2 × PCIe Gen3 x8 (mechanical x16 slots with x8 signals)
- 2 × PCI 32‑bit/33 MHz slots
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication: 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Interfaces: 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot.
- Audio: 1 × Mic‑in, 1 × Line‑out.
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (fanless operation with 35 W CPU).
- Mounting: Wall‑mount kit included.
- Construction: Rugged fanless aluminum chassis for high MTBF and silent operation.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑6100TE, dual‑core, 3.2 GHz, 35 W TDP |
| Chipset | Intel® Q170 Express |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 MHz |
| Graphics | Integrated Intel® HD Graphics 530 |
| Display Outputs | 2 × DisplayPort, 1 × DVI‑D, 1 × VGA |
| Max Resolution | DisplayPort 4096 × 2304 @ 60 Hz; DVI‑D 1920 × 1200 @ 60 Hz; VGA 1920 × 1080 @ 60 Hz |
| Expansion Slots | 2 × PCIe Gen3 x8 (x16 mechanical), 2 × PCI 32‑bit/33 MHz, 1 × Mini‑PCIe slot with USIM |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × COM (DB9): 2 × RS‑232/422/485 (BIOS‑selectable), 2 × RS‑232; RS‑485 auto‑flow control, 2 kV surge protection |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Storage | 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot |
| Power Input | 12 – 24 V DC wide‑range input (3‑pin connector V+, GND, V–) |
| Optional AC Input | 160 W external AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 50 °C (fanless operation with 35 W CPU) |
| Storage Temperature | –40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB, CCC |
### 4. Functionality
The MVP‑6023 operates as a compact, fanless industrial controller optimized for automation, machine vision, and data acquisition. The Intel® Core™ i3‑6100TE processor provides sufficient computing power for real‑time control, image processing, and edge analytics. The Q170 chipset enables advanced I/O, PCIe Gen3 bandwidth, and multiple display outputs.
Typical Use Cases:
- Industrial automation and process control
- Machine vision and inspection systems
- Motion control and robotics
- Intelligent surveillance and security monitoring
- Edge computing and data acquisition gateways
Compatibility:
- Operating Systems: Windows 10 (64‑bit), Windows 7 (32/64‑bit), Windows Embedded Standard 7, Linux.
- Supports standard PCI/PCIe Gen3 cards, Mini‑PCIe modules, and USB peripherals.
- Dual independent display support for operator interfaces or visualization systems.
### 5. Components & Accessories
Included Components:
- MVP‑6023 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD installation
- Documentation and driver media
Optional Accessories:
- Fan Module: Optional 9 V or 12 V fan module for enhanced cooling in high‑temperature environments.
- Memory Upgrades: 8 GB / 16 GB / 32 GB DDR4 SO‑DIMM options.
- Storage Options: 500 GB / 1 TB HDD or 64 GB MLC SSD (pre‑installed factory options).
- Power Adapter: 160 W industrial‑grade AC‑DC adapter for AC input operation.
- Cabling Accessories: Auxiliary power cable (CN23 to Molex 8981, P/N 30‑20724‑0000) for add‑on cards.
### 6. Installation & Setup
Requirements:
- 12 – 24 V DC regulated power supply (160 W recommended).
- Stable mounting surface or wall mount brackets (included).
- Adequate ventilation for fanless operation (avoid blocking side vents).
Mounting Options:
- Wall Mounting: Two configurations supported – underside or left‑side mounting using included brackets and M4 screws.
- Surface Deployment: Can be placed upright or on its side on a stable surface.
Configuration Steps:
1. Install storage device (2.5″ HDD/SSD or CFast card).
2. Install PCI/PCIe expansion cards if required.
3. Connect power input (12–24 V DC) and I/O cables.
4. Power on and enter BIOS (DEL key at POST) for system configuration.
5. Install drivers (chipset, graphics, Ethernet, audio, USB 3.0, Intel ME, serial I/O).
### 7. Performance & Capabilities
Processing Performance:
- Intel® Core™ i3‑6100TE dual‑core CPU (3.2 GHz) with Intel® HD Graphics 530 GPU.
- Supports hardware virtualization (VT‑x, VT‑d), AES‑NI, and Hyper‑Threading.
Memory Performance:
- Dual‑channel DDR4 2133 MHz up to 32 GB for high bandwidth data processing.
Graphics Performance:
- Intel® HD Graphics 530 supports DirectX 12, OpenGL 4.4, and dual 4K display output.
Networking Performance:
- Three Intel® I211AT GbE controllers support IEEE 802.3az Energy Efficient Ethernet, IEEE 1588 time synchronization, VLAN, jumbo frames, and teaming for redundancy or load balancing.
Power Consumption:
- Power Off: 2.9 W
- System Idle: 17.9 W
- Full Load: 50.66 W (24 V DC input)
- Recommended Power Supply: 160 W
Thermal Performance:
- Fanless operation 0 °C – 50 °C with 35 W CPU.
- Optional fan module recommended for higher ambient temperatures or add‑on cards.
Limitations:
- Operating temperature limited to 50 °C for fanless operation.
- Add‑on cards may increase thermal load and require active cooling.
### 8. Standards & Compliance
Electromagnetic Compatibility:
- CE and FCC Class A compliant.
Safety Certifications:
- UL/cUL, CB, CCC.
Environmental Compliance:
- RoHS and WEEE directives compliant.
- Designed for long life cycle and environmentally responsible manufacturing.
Reliability Standards:
- Vibration: 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes.
- Shock: 100 Grms, half‑sine 11 ms duration (SSD/CFast).
- ESD Protection: ±4 kV contact, ±8 kV air.
### 9. Additional Information
Warranty:
- Standard manufacturer warranty (typically 2 years; extendable by region).
Support & Service:
- Global technical support via ADLINK regional offices.
- Online resources and driver downloads available at [www.adlinktech.com](https://www.adlinktech.com).
- “Ask an Expert” portal for technical assistance: [http://askanexpert.adlinktech.com](http://askanexpert.adlinktech.com).
Maintenance:
- Fanless design minimizes dust accumulation and mechanical wear.
- Periodic inspection of ventilation openings recommended.
- BIOS and firmware updates available through ADLINK support.
BIOS Features:
- AMI UEFI BIOS with advanced configuration options for CPU, memory, graphics, and power management.
- Watchdog Timer (WDT) support for system recovery and remote monitoring.
- Digital I/O API libraries for Windows and Linux for custom application development.
Environmental Responsibility:
- ADLINK ensures compliance with RoHS and WEEE directives and encourages proper end‑of‑life recycling.
### Summary
The ADLINK MVP‑6023 is a robust, fanless, and expandable embedded computer engineered for industrial and edge computing environments. Powered by the Intel® Core™ i3‑6100TE processor and Q170 chipset, it delivers reliable performance, extensive I/O, and flexible expansion in a compact, maintenance‑free chassis. With dual‑display support, triple Gigabit Ethernet, multiple COM ports, and wide DC input, the MVP‑6023 is ideal for automation control, machine vision, and data acquisition systems requiring high uptime and long‑term availability.
Its compliance with CE, FCC, UL, and CCC standards, combined with ADLINK’s industrial‑grade design and global support, ensures dependable operation in demanding industrial environments.
### 1. Product Overview
Product Name: MVP‑6023
Model: MVP‑6023
Series: MVP‑6010/6020 Series (Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers)
Article Number: MVP‑6023
Manufacturer: ADLINK Technology, Inc.
Product Type: Fanless expandable embedded computer for industrial automation and edge computing applications
Processor Platform: Intel® 6th Generation Core™ i3‑6100TE (Skylake)
Chipset: Intel® Q170 Express
The ADLINK MVP‑6023 is a member of the MVP‑6020 Series, part of ADLINK’s Value Family of fanless embedded computers. It is designed for industrial automation, machine vision, motion control, and surveillance applications requiring high reliability, expandability, and silent operation. The system integrates a 6th Generation Intel® Core™ i3‑6100TE processor with the Intel® Q170 chipset, providing a balance of performance and energy efficiency in a rugged, fanless chassis.
### 2. Key Features
- Processor Support: 6th Generation Intel® Core™ i7/i5/i3 (Skylake) processors; MVP‑6023 specifically equipped with Intel® Core™ i3‑6100TE (dual‑core, 3.2 GHz, 35 W TDP).
- Chipset: Intel® Q170 Express for extended I/O and industrial‑grade reliability.
- Memory: Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.
- Display Capability: Supports two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA; maximum resolution up to 4096 × 2304 @ 60 Hz.
- Expansion Slots:
- 2 × PCIe Gen3 x8 (mechanical x16 slots with x8 signals)
- 2 × PCI 32‑bit/33 MHz slots
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication: 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Interfaces: 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot.
- Audio: 1 × Mic‑in, 1 × Line‑out.
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (fanless operation with 35 W CPU).
- Mounting: Wall‑mount kit included.
- Construction: Rugged fanless aluminum chassis for high MTBF and silent operation.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑6100TE, dual‑core, 3.2 GHz, 35 W TDP |
| Chipset | Intel® Q170 Express |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 MHz |
| Graphics | Integrated Intel® HD Graphics 530 |
| Display Outputs | 2 × DisplayPort, 1 × DVI‑D, 1 × VGA |
| Max Resolution | DisplayPort 4096 × 2304 @ 60 Hz; DVI‑D 1920 × 1200 @ 60 Hz; VGA 1920 × 1080 @ 60 Hz |
| Expansion Slots | 2 × PCIe Gen3 x8 (x16 mechanical), 2 × PCI 32‑bit/33 MHz, 1 × Mini‑PCIe slot with USIM |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × COM (DB9): 2 × RS‑232/422/485 (BIOS‑selectable), 2 × RS‑232; RS‑485 auto‑flow control, 2 kV surge protection |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Storage | 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot |
| Power Input | 12 – 24 V DC wide‑range input (3‑pin connector V+, GND, V–) |
| Optional AC Input | 160 W external AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 50 °C (fanless operation with 35 W CPU) |
| Storage Temperature | –40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB, CCC |
### 4. Functionality
The MVP‑6023 operates as a compact, fanless industrial controller optimized for automation, machine vision, and data acquisition. The Intel® Core™ i3‑6100TE processor provides sufficient computing power for real‑time control, image processing, and edge analytics. The Q170 chipset enables advanced I/O, PCIe Gen3 bandwidth, and multiple display outputs.
Typical Use Cases:
- Industrial automation and process control
- Machine vision and inspection systems
- Motion control and robotics
- Intelligent surveillance and security monitoring
- Edge computing and data acquisition gateways
Compatibility:
- Operating Systems: Windows 10 (64‑bit), Windows 7 (32/64‑bit), Windows Embedded Standard 7, Linux.
- Supports standard PCI/PCIe Gen3 cards, Mini‑PCIe modules, and USB peripherals.
- Dual independent display support for operator interfaces or visualization systems.
### 5. Components & Accessories
Included Components:
- MVP‑6023 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD installation
- Documentation and driver media
Optional Accessories:
- Fan Module: Optional 9 V or 12 V fan module for enhanced cooling in high‑temperature environments.
- Memory Upgrades: 8 GB / 16 GB / 32 GB DDR4 SO‑DIMM options.
- Storage Options: 500 GB / 1 TB HDD or 64 GB MLC SSD (pre‑installed factory options).
- Power Adapter: 160 W industrial‑grade AC‑DC adapter for AC input operation.
- Cabling Accessories: Auxiliary power cable (CN23 to Molex 8981, P/N 30‑20724‑0000) for add‑on cards.
### 6. Installation & Setup
Requirements:
- 12 – 24 V DC regulated power supply (160 W recommended).
- Stable mounting surface or wall mount brackets (included).
- Adequate ventilation for fanless operation (avoid blocking side vents).
Mounting Options:
- Wall Mounting: Two configurations supported – underside or left‑side mounting using included brackets and M4 screws.
- Surface Deployment: Can be placed upright or on its side on a stable surface.
Configuration Steps:
1. Install storage device (2.5″ HDD/SSD or CFast card).
2. Install PCI/PCIe expansion cards if required.
3. Connect power input (12–24 V DC) and I/O cables.
4. Power on and enter BIOS (DEL key at POST) for system configuration.
5. Install drivers (chipset, graphics, Ethernet, audio, USB 3.0, Intel ME, serial I/O).
### 7. Performance & Capabilities
Processing Performance:
- Intel® Core™ i3‑6100TE dual‑core CPU (3.2 GHz) with Intel® HD Graphics 530 GPU.
- Supports hardware virtualization (VT‑x, VT‑d), AES‑NI, and Hyper‑Threading.
Memory Performance:
- Dual‑channel DDR4 2133 MHz up to 32 GB for high bandwidth data processing.
Graphics Performance:
- Intel® HD Graphics 530 supports DirectX 12, OpenGL 4.4, and dual 4K display output.
Networking Performance:
- Three Intel® I211AT GbE controllers support IEEE 802.3az Energy Efficient Ethernet, IEEE 1588 time synchronization, VLAN, jumbo frames, and teaming for redundancy or load balancing.
Power Consumption:
- Power Off: 2.9 W
- System Idle: 17.9 W
- Full Load: 50.66 W (24 V DC input)
- Recommended Power Supply: 160 W
Thermal Performance:
- Fanless operation 0 °C – 50 °C with 35 W CPU.
- Optional fan module recommended for higher ambient temperatures or add‑on cards.
Limitations:
- Operating temperature limited to 50 °C for fanless operation.
- Add‑on cards may increase thermal load and require active cooling.
### 8. Standards & Compliance
Electromagnetic Compatibility:
- CE and FCC Class A compliant.
Safety Certifications:
- UL/cUL, CB, CCC.
Environmental Compliance:
- RoHS and WEEE directives compliant.
- Designed for long life cycle and environmentally responsible manufacturing.
Reliability Standards:
- Vibration: 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes.
- Shock: 100 Grms, half‑sine 11 ms duration (SSD/CFast).
- ESD Protection: ±4 kV contact, ±8 kV air.
### 9. Additional Information
Warranty:
- Standard manufacturer warranty (typically 2 years; extendable by region).
Support & Service:
- Global technical support via ADLINK regional offices.
- Online resources and driver downloads available at [www.adlinktech.com](https://www.adlinktech.com).
- “Ask an Expert” portal for technical assistance: [http://askanexpert.adlinktech.com](http://askanexpert.adlinktech.com).
Maintenance:
- Fanless design minimizes dust accumulation and mechanical wear.
- Periodic inspection of ventilation openings recommended.
- BIOS and firmware updates available through ADLINK support.
BIOS Features:
- AMI UEFI BIOS with advanced configuration options for CPU, memory, graphics, and power management.
- Watchdog Timer (WDT) support for system recovery and remote monitoring.
- Digital I/O API libraries for Windows and Linux for custom application development.
Environmental Responsibility:
- ADLINK ensures compliance with RoHS and WEEE directives and encourages proper end‑of‑life recycling.
### Summary
The ADLINK MVP‑6023 is a robust, fanless, and expandable embedded computer engineered for industrial and edge computing environments. Powered by the Intel® Core™ i3‑6100TE processor and Q170 chipset, it delivers reliable performance, extensive I/O, and flexible expansion in a compact, maintenance‑free chassis. With dual‑display support, triple Gigabit Ethernet, multiple COM ports, and wide DC input, the MVP‑6023 is ideal for automation control, machine vision, and data acquisition systems requiring high uptime and long‑term availability.
Its compliance with CE, FCC, UL, and CCC standards, combined with ADLINK’s industrial‑grade design and global support, ensures dependable operation in demanding industrial environments.
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