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- Processor Platform: 3rd Generation Intel® Core™ i3‑3120ME (2.4 GHz, 3 MB cache, dual‑core) with Intel® QM77 Mobile Platform Controller Hub.
- Fanless Design: Completely fanless and cable‑free architecture for silent operation and enhanced reliability in harsh industrial environments.
- Memory: Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory.
- Expansion Capability: Four expansion slots — three PCI and one PCI Express ×16 (Gen 2) — enabling flexible system integration with add‑on cards.
- Display Support: Triple independent display capability via two DisplayPort connectors and one DVI‑I port, supporting resolutions up to 2560 × 1600.
- Storage Options: Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation with RAID 0/1 support; dual CFast sockets (one internal, one external).
- Networking: Three Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming function, Wake‑on‑LAN, and Intel® Active Management Technology (iAMT 11.0).
- I/O Interfaces:
- 2 × RS‑232/422/485 (software‑selectable)
- 2 × RS‑232
- 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal)
- 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation)
- Audio (Mic‑in, Line‑out)
- PS/2 keyboard and mouse ports
- Power Input: Wide‑range 9 – 32 V DC input with pluggable connector and remote power switch support.
- Operating Temperature:
- Standard: 0 °C – 50 °C
- Extended: –20 °C – +55 °C (with industrial‑grade SSD/RAM)
- Mechanical Design: Compact aluminum chassis (173 × 225 × 213 mm), weight 4.3 kg, wall‑mountable.
- Reliability: Shock‑resistant (50 G, 11 ms), vibration‑tolerant (5 Grms, 5–500 Hz), CE/FCC Class A, UL/cUL, CB, KCC certified.
- Fanless Design: Completely fanless and cable‑free architecture for silent operation and enhanced reliability in harsh industrial environments.
- Memory: Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory.
- Expansion Capability: Four expansion slots — three PCI and one PCI Express ×16 (Gen 2) — enabling flexible system integration with add‑on cards.
- Display Support: Triple independent display capability via two DisplayPort connectors and one DVI‑I port, supporting resolutions up to 2560 × 1600.
- Storage Options: Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation with RAID 0/1 support; dual CFast sockets (one internal, one external).
- Networking: Three Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming function, Wake‑on‑LAN, and Intel® Active Management Technology (iAMT 11.0).
- I/O Interfaces:
- 2 × RS‑232/422/485 (software‑selectable)
- 2 × RS‑232
- 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal)
- 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation)
- Audio (Mic‑in, Line‑out)
- PS/2 keyboard and mouse ports
- Power Input: Wide‑range 9 – 32 V DC input with pluggable connector and remote power switch support.
- Operating Temperature:
- Standard: 0 °C – 50 °C
- Extended: –20 °C – +55 °C (with industrial‑grade SSD/RAM)
- Mechanical Design: Compact aluminum chassis (173 × 225 × 213 mm), weight 4.3 kg, wall‑mountable.
- Reliability: Shock‑resistant (50 G, 11 ms), vibration‑tolerant (5 Grms, 5–500 Hz), CE/FCC Class A, UL/cUL, CB, KCC certified.
Comprehensive Product Summary – ADLINK MXC‑6323D Embedded Computer
*(Approx. 3000 tokens / ~12,000 characters)*
### 1. Product Overview
Product Name: MXC‑6323D
Model Number: MXC‑6323D
Series: Matrix MXC‑6300 / 6310 / 6320 Series
Article Number: MXC‑6323D
Manufacturer: ADLINK Technology Inc.
The ADLINK MXC‑6323D is a high‑performance, fanless, expandable embedded computer designed for industrial and automation applications. It belongs to the Matrix MXC‑6300/6310/6320 family, which integrates 3rd‑generation Intel® Core™ i7/i5/i3 processors and the Intel® QM77 chipset. The MXC‑6323D variant specifically incorporates the Intel® Core™ i3‑3120ME dual‑core processor, offering a balance of performance, energy efficiency, and rugged reliability for mission‑critical environments.
### 2. Key Features
- Processor Platform: 3rd Generation Intel® Core™ i3‑3120ME (2.4 GHz, 3 MB cache, dual‑core) with Intel® QM77 Mobile Platform Controller Hub.
- Fanless Design: Completely fanless and cable‑free architecture for silent operation and enhanced reliability in harsh industrial environments.
- Memory: Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory.
- Expansion Capability: Four expansion slots — three PCI and one PCI Express ×16 (Gen 2) — enabling flexible system integration with add‑on cards.
- Display Support: Triple independent display capability via two DisplayPort connectors and one DVI‑I port, supporting resolutions up to 2560 × 1600.
- Storage Options: Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation with RAID 0/1 support; dual CFast sockets (one internal, one external).
- Networking: Three Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming function, Wake‑on‑LAN, and Intel® Active Management Technology (iAMT 11.0).
- I/O Interfaces:
- 2 × RS‑232/422/485 (software‑selectable)
- 2 × RS‑232
- 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal)
- 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation)
- Audio (Mic‑in, Line‑out)
- PS/2 keyboard and mouse ports
- Power Input: Wide‑range 9 – 32 V DC input with pluggable connector and remote power switch support.
- Operating Temperature:
- Standard: 0 °C – 50 °C
- Extended: –20 °C – +55 °C (with industrial‑grade SSD/RAM)
- Mechanical Design: Compact aluminum chassis (173 × 225 × 213 mm), weight 4.3 kg, wall‑mountable.
- Reliability: Shock‑resistant (50 G, 11 ms), vibration‑tolerant (5 Grms, 5–500 Hz), CE/FCC Class A, UL/cUL, CB, KCC certified.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑3120ME, 2.4 GHz, 3 MB cache, dual‑core |
| Chipset | Intel® QM77 Mobile PCH |
| Memory | 2 × DDR3 SO‑DIMM sockets, up to 16 GB DDR3‑1600 |
| Graphics | Intel® HD Graphics 4000 integrated GPU |
| Display Outputs | 2 × DisplayPort (2560×1600 / 1920×1200), 1 × DVI‑I (1920×1200) |
| Expansion Slots | 3 × PCI (32‑bit 5 V), 1 × PCIe ×16 (Gen 2, auto‑switch to ×8 when dual cards installed) |
| Storage | 2 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, RAID 0/1 support; 2 × CFast sockets (1 internal, 1 external) |
| Ethernet | 3 × GbE (1 × Intel I219 + 2 × Intel I210IT), teaming, iAMT 11.0, Wake‑on‑LAN |
| Serial Ports | 2 × RS‑232/422/485 (COM1/2), 2 × RS‑232 (COM3/4) |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) |
| Digital I/O | 16 × DI + 16 × DO, 1.5 kV isolation, MOSFET outputs (100 mA sustained / 250 mA peak) |
| Audio | Realtek ALC269 HD Audio (24‑bit/192 kHz), Mic‑in + Line‑out |
| Power Input | 9 – 32 V DC wide‑range input, 3‑pin pluggable connector (GND, V–, V+), optional 160 W AC‑DC adapter |
| Dimensions | 172.5 (W) × 225 (D) × 213 (H) mm (6.79″ × 8.86″ × 8.39″) |
| Weight | 4.3 kg (9.5 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temp. | 0 – 50 °C (standard), –20 – +55 °C (extended with industrial SSD) |
| Storage Temp. | –40 – +85 °C (excluding HDD/SSD/CFast) |
| Humidity | ≤ 95 % @ 40 °C (non‑condensing) |
| Shock/Vibration | 50 G (11 ms half‑sine), 5 Grms (SSD/CFast) |
| EMC/Safety | CE, FCC Class A, UL/cUL, CB, KCC compliant |
### 4. Functionality
The MXC‑6323D operates as a rugged, fanless embedded controller optimized for industrial automation, machine vision, transportation, and surveillance. Its Intel® Core™ i3 processor and QM77 chipset deliver strong computing and graphics performance while maintaining low thermal output.
Operation Principle:
The system integrates CPU, chipset, memory, and I/O subsystems on a cable‑free motherboard/backplane assembly. Passive heat sinks dissipate thermal energy through the aluminum chassis. The wide‑range DC input allows direct connection to industrial power sources (9–32 V DC).
Use Cases:
- Factory automation and machine vision inspection
- Intelligent transportation and traffic control
- Maritime and navigation systems
- Medical imaging and diagnostic equipment
- Surveillance and security monitoring
Compatibility:
Supports Windows 7 / Embedded Standard 7 / XP / XP Embedded / Linux. Drivers for chipset, graphics, LAN, audio, USB 3.0, Intel Management Engine, watchdog timer, and digital I/O are provided via ADLINK’s All‑in‑One DVD or online support.
### 5. Components & Accessories
Included Items:
- MXC‑6323D controller unit
- Wall‑mount brackets and screw pack
- User manual and ADLINK All‑in‑One DVD (drivers & utilities)
Optional Accessories:
- Fan Module: Smart‑controlled 12 V DC fan for additional cooling when high‑power PCI/PCIe cards are installed.
- Storage Options: Factory‑installed 500 GB / 1 TB HDD or 32 GB / 64 GB MLC SSD.
- Power Adapter: 160 W industrial‑grade AC‑DC adapter (–20 °C to +70 °C).
- Display Cables: Passive/active DisplayPort‑to‑HDMI/DVI/VGA adapters (P/N 30‑01119‑0000 to 30‑01157‑0000).
- DIN‑68S‑01 / ACL‑10568‑1: Optional digital I/O cable assemblies for isolated DI/O connector.
### 6. Installation & Setup
Requirements:
- Stable 9–32 V DC power supply (160 W recommended)
- Minimum 5 cm clearance above unit for heat dissipation
- Industrial‑grade SSD for extended temperature operation
Mounting Options:
Wall‑mount kit included; remove corner pads and attach brackets using M4 screws (84 mm spacing).
Configuration Steps:
1. Storage Installation: Remove top cover, mount up to two 2.5″ HDD/SSD on bracket, connect to SATA ports.
2. Expansion Cards: Insert PCI/PCIe cards into designated slots (ensure 174 mm length limit and 25 W max per card).
3. CFast Cards: Install internal and/or external CFast cards for OS or data storage.
4. Power Connection: Connect DC input (V+, V–, GND) using pluggable connector; verify polarity and voltage.
5. Driver Installation: After OS installation, install drivers in sequence – chipset, graphics, LAN, audio, USB 3.0, Intel ME, WDT, DI/O.
6. BIOS Configuration: Access via DEL key at POST; configure SATA mode (AHCI/RAID), serial port modes, boot order, and power management.
### 7. Performance & Capabilities
Processing Performance:
- Dual‑core Intel Core™ i3‑3120ME (2.4 GHz) delivers robust multi‑threaded performance for industrial control and vision tasks.
- Integrated Intel HD Graphics 4000 supports hardware‑accelerated video and 3D rendering.
Storage Performance:
- SATA III 6 Gb/s interface enables high‑speed data transfer.
- RAID 0 (striping) for maximum I/O throughput or RAID 1 (mirroring) for data redundancy.
Networking:
- Triple Gigabit Ethernet with Intel controllers supports IEEE 802.3az Energy Efficient Ethernet, 802.1Q VLAN, and teaming for redundancy or load balancing.
- Intel iAMT 11.0 enables remote management and diagnostics.
Power Efficiency:
- Typical power consumption (24 V DC input): 16.08 W idle, 53.76 W full load.
- Low standby power (2.16 W in shutdown).
Environmental Resilience:
- Operates reliably in –20 °C to +55 °C range with industrial SSD.
- Withstands vibration (5 Grms) and shock (50 G).
Limitations:
- Passive cooling limits use of high‑TDP add‑on cards without optional fan module.
- Extended temperature operation requires solid‑state storage (no HDD).
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant.
- Safety: UL/cUL, CB, KCC certified.
- Environmental: RoHS and WEEE compliant; lead‑free manufacturing.
- Ethernet Standards: IEEE 802.3, 802.3u, 802.3ab, 802.3az, 802.1Q, 802.1p.
- Power Protection: ESD protection ±4 kV (contact), ±8 kV (air).
- Quality Assurance: Manufactured under ADLINK’s ISO 9001 and ISO 14001 certified processes.
### 9. Additional Information
Warranty:
Standard 3‑year limited warranty covering manufacturing defects and hardware failures under normal operation.
Technical Support:
ADLINK provides global technical support through regional offices in Taiwan, USA, China, Europe, Japan, Korea, Singapore, and India. Support includes driver updates, BIOS revisions, and RMA services.
Maintenance:
- Periodically inspect for dust accumulation on heat sink fins.
- Ensure adequate air clearance for passive cooling.
- Use industrial‑grade storage for extended temperature operation.
- Firmware and BIOS updates available via ADLINK website.
Software Utilities:
- Watchdog Timer (WDT) API for system recovery automation.
- Digital I/O API library for custom control applications (ADMX_DIO).
- Intel Rapid Storage Technology utility for RAID configuration.
Environmental Responsibility:
ADLINK ensures compliance with RoHS and WEEE directives and encourages proper recycling of electronic equipment and batteries.
### Summary
The ADLINK MXC‑6323D is a robust, fanless, and highly expandable embedded computer engineered for industrial automation, machine vision, and transportation control systems. Combining the Intel® Core™ i3‑3120ME processor with the QM77 chipset, it delivers reliable computing and graphics performance in a compact, rugged chassis. Its triple‑display capability, extensive I/O, and multiple expansion slots make it ideal for complex control and monitoring tasks. With wide‑range DC input, extended temperature operation, and comprehensive certifications, the MXC‑6323D provides a dependable platform for long‑life industrial deployments.
Manufacturer Contact:
ADLINK Technology Inc.
9F, No. 166 Jian Yi Road, Zhonghe District, New Taipei City 235, Taiwan
Tel: +886‑2‑8226‑5877 Email: service@adlinktech.com Website: [www.adlinktech.com](https://www.adlinktech.com)
*(End of Comprehensive Product Summary for MXC‑6323D)*
*(Approx. 3000 tokens / ~12,000 characters)*
### 1. Product Overview
Product Name: MXC‑6323D
Model Number: MXC‑6323D
Series: Matrix MXC‑6300 / 6310 / 6320 Series
Article Number: MXC‑6323D
Manufacturer: ADLINK Technology Inc.
The ADLINK MXC‑6323D is a high‑performance, fanless, expandable embedded computer designed for industrial and automation applications. It belongs to the Matrix MXC‑6300/6310/6320 family, which integrates 3rd‑generation Intel® Core™ i7/i5/i3 processors and the Intel® QM77 chipset. The MXC‑6323D variant specifically incorporates the Intel® Core™ i3‑3120ME dual‑core processor, offering a balance of performance, energy efficiency, and rugged reliability for mission‑critical environments.
### 2. Key Features
- Processor Platform: 3rd Generation Intel® Core™ i3‑3120ME (2.4 GHz, 3 MB cache, dual‑core) with Intel® QM77 Mobile Platform Controller Hub.
- Fanless Design: Completely fanless and cable‑free architecture for silent operation and enhanced reliability in harsh industrial environments.
- Memory: Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory.
- Expansion Capability: Four expansion slots — three PCI and one PCI Express ×16 (Gen 2) — enabling flexible system integration with add‑on cards.
- Display Support: Triple independent display capability via two DisplayPort connectors and one DVI‑I port, supporting resolutions up to 2560 × 1600.
- Storage Options: Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation with RAID 0/1 support; dual CFast sockets (one internal, one external).
- Networking: Three Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming function, Wake‑on‑LAN, and Intel® Active Management Technology (iAMT 11.0).
- I/O Interfaces:
- 2 × RS‑232/422/485 (software‑selectable)
- 2 × RS‑232
- 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal)
- 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation)
- Audio (Mic‑in, Line‑out)
- PS/2 keyboard and mouse ports
- Power Input: Wide‑range 9 – 32 V DC input with pluggable connector and remote power switch support.
- Operating Temperature:
- Standard: 0 °C – 50 °C
- Extended: –20 °C – +55 °C (with industrial‑grade SSD/RAM)
- Mechanical Design: Compact aluminum chassis (173 × 225 × 213 mm), weight 4.3 kg, wall‑mountable.
- Reliability: Shock‑resistant (50 G, 11 ms), vibration‑tolerant (5 Grms, 5–500 Hz), CE/FCC Class A, UL/cUL, CB, KCC certified.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑3120ME, 2.4 GHz, 3 MB cache, dual‑core |
| Chipset | Intel® QM77 Mobile PCH |
| Memory | 2 × DDR3 SO‑DIMM sockets, up to 16 GB DDR3‑1600 |
| Graphics | Intel® HD Graphics 4000 integrated GPU |
| Display Outputs | 2 × DisplayPort (2560×1600 / 1920×1200), 1 × DVI‑I (1920×1200) |
| Expansion Slots | 3 × PCI (32‑bit 5 V), 1 × PCIe ×16 (Gen 2, auto‑switch to ×8 when dual cards installed) |
| Storage | 2 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, RAID 0/1 support; 2 × CFast sockets (1 internal, 1 external) |
| Ethernet | 3 × GbE (1 × Intel I219 + 2 × Intel I210IT), teaming, iAMT 11.0, Wake‑on‑LAN |
| Serial Ports | 2 × RS‑232/422/485 (COM1/2), 2 × RS‑232 (COM3/4) |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) |
| Digital I/O | 16 × DI + 16 × DO, 1.5 kV isolation, MOSFET outputs (100 mA sustained / 250 mA peak) |
| Audio | Realtek ALC269 HD Audio (24‑bit/192 kHz), Mic‑in + Line‑out |
| Power Input | 9 – 32 V DC wide‑range input, 3‑pin pluggable connector (GND, V–, V+), optional 160 W AC‑DC adapter |
| Dimensions | 172.5 (W) × 225 (D) × 213 (H) mm (6.79″ × 8.86″ × 8.39″) |
| Weight | 4.3 kg (9.5 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temp. | 0 – 50 °C (standard), –20 – +55 °C (extended with industrial SSD) |
| Storage Temp. | –40 – +85 °C (excluding HDD/SSD/CFast) |
| Humidity | ≤ 95 % @ 40 °C (non‑condensing) |
| Shock/Vibration | 50 G (11 ms half‑sine), 5 Grms (SSD/CFast) |
| EMC/Safety | CE, FCC Class A, UL/cUL, CB, KCC compliant |
### 4. Functionality
The MXC‑6323D operates as a rugged, fanless embedded controller optimized for industrial automation, machine vision, transportation, and surveillance. Its Intel® Core™ i3 processor and QM77 chipset deliver strong computing and graphics performance while maintaining low thermal output.
Operation Principle:
The system integrates CPU, chipset, memory, and I/O subsystems on a cable‑free motherboard/backplane assembly. Passive heat sinks dissipate thermal energy through the aluminum chassis. The wide‑range DC input allows direct connection to industrial power sources (9–32 V DC).
Use Cases:
- Factory automation and machine vision inspection
- Intelligent transportation and traffic control
- Maritime and navigation systems
- Medical imaging and diagnostic equipment
- Surveillance and security monitoring
Compatibility:
Supports Windows 7 / Embedded Standard 7 / XP / XP Embedded / Linux. Drivers for chipset, graphics, LAN, audio, USB 3.0, Intel Management Engine, watchdog timer, and digital I/O are provided via ADLINK’s All‑in‑One DVD or online support.
### 5. Components & Accessories
Included Items:
- MXC‑6323D controller unit
- Wall‑mount brackets and screw pack
- User manual and ADLINK All‑in‑One DVD (drivers & utilities)
Optional Accessories:
- Fan Module: Smart‑controlled 12 V DC fan for additional cooling when high‑power PCI/PCIe cards are installed.
- Storage Options: Factory‑installed 500 GB / 1 TB HDD or 32 GB / 64 GB MLC SSD.
- Power Adapter: 160 W industrial‑grade AC‑DC adapter (–20 °C to +70 °C).
- Display Cables: Passive/active DisplayPort‑to‑HDMI/DVI/VGA adapters (P/N 30‑01119‑0000 to 30‑01157‑0000).
- DIN‑68S‑01 / ACL‑10568‑1: Optional digital I/O cable assemblies for isolated DI/O connector.
### 6. Installation & Setup
Requirements:
- Stable 9–32 V DC power supply (160 W recommended)
- Minimum 5 cm clearance above unit for heat dissipation
- Industrial‑grade SSD for extended temperature operation
Mounting Options:
Wall‑mount kit included; remove corner pads and attach brackets using M4 screws (84 mm spacing).
Configuration Steps:
1. Storage Installation: Remove top cover, mount up to two 2.5″ HDD/SSD on bracket, connect to SATA ports.
2. Expansion Cards: Insert PCI/PCIe cards into designated slots (ensure 174 mm length limit and 25 W max per card).
3. CFast Cards: Install internal and/or external CFast cards for OS or data storage.
4. Power Connection: Connect DC input (V+, V–, GND) using pluggable connector; verify polarity and voltage.
5. Driver Installation: After OS installation, install drivers in sequence – chipset, graphics, LAN, audio, USB 3.0, Intel ME, WDT, DI/O.
6. BIOS Configuration: Access via DEL key at POST; configure SATA mode (AHCI/RAID), serial port modes, boot order, and power management.
### 7. Performance & Capabilities
Processing Performance:
- Dual‑core Intel Core™ i3‑3120ME (2.4 GHz) delivers robust multi‑threaded performance for industrial control and vision tasks.
- Integrated Intel HD Graphics 4000 supports hardware‑accelerated video and 3D rendering.
Storage Performance:
- SATA III 6 Gb/s interface enables high‑speed data transfer.
- RAID 0 (striping) for maximum I/O throughput or RAID 1 (mirroring) for data redundancy.
Networking:
- Triple Gigabit Ethernet with Intel controllers supports IEEE 802.3az Energy Efficient Ethernet, 802.1Q VLAN, and teaming for redundancy or load balancing.
- Intel iAMT 11.0 enables remote management and diagnostics.
Power Efficiency:
- Typical power consumption (24 V DC input): 16.08 W idle, 53.76 W full load.
- Low standby power (2.16 W in shutdown).
Environmental Resilience:
- Operates reliably in –20 °C to +55 °C range with industrial SSD.
- Withstands vibration (5 Grms) and shock (50 G).
Limitations:
- Passive cooling limits use of high‑TDP add‑on cards without optional fan module.
- Extended temperature operation requires solid‑state storage (no HDD).
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant.
- Safety: UL/cUL, CB, KCC certified.
- Environmental: RoHS and WEEE compliant; lead‑free manufacturing.
- Ethernet Standards: IEEE 802.3, 802.3u, 802.3ab, 802.3az, 802.1Q, 802.1p.
- Power Protection: ESD protection ±4 kV (contact), ±8 kV (air).
- Quality Assurance: Manufactured under ADLINK’s ISO 9001 and ISO 14001 certified processes.
### 9. Additional Information
Warranty:
Standard 3‑year limited warranty covering manufacturing defects and hardware failures under normal operation.
Technical Support:
ADLINK provides global technical support through regional offices in Taiwan, USA, China, Europe, Japan, Korea, Singapore, and India. Support includes driver updates, BIOS revisions, and RMA services.
Maintenance:
- Periodically inspect for dust accumulation on heat sink fins.
- Ensure adequate air clearance for passive cooling.
- Use industrial‑grade storage for extended temperature operation.
- Firmware and BIOS updates available via ADLINK website.
Software Utilities:
- Watchdog Timer (WDT) API for system recovery automation.
- Digital I/O API library for custom control applications (ADMX_DIO).
- Intel Rapid Storage Technology utility for RAID configuration.
Environmental Responsibility:
ADLINK ensures compliance with RoHS and WEEE directives and encourages proper recycling of electronic equipment and batteries.
### Summary
The ADLINK MXC‑6323D is a robust, fanless, and highly expandable embedded computer engineered for industrial automation, machine vision, and transportation control systems. Combining the Intel® Core™ i3‑3120ME processor with the QM77 chipset, it delivers reliable computing and graphics performance in a compact, rugged chassis. Its triple‑display capability, extensive I/O, and multiple expansion slots make it ideal for complex control and monitoring tasks. With wide‑range DC input, extended temperature operation, and comprehensive certifications, the MXC‑6323D provides a dependable platform for long‑life industrial deployments.
Manufacturer Contact:
ADLINK Technology Inc.
9F, No. 166 Jian Yi Road, Zhonghe District, New Taipei City 235, Taiwan
Tel: +886‑2‑8226‑5877 Email: service@adlinktech.com Website: [www.adlinktech.com](https://www.adlinktech.com)
*(End of Comprehensive Product Summary for MXC‑6323D)*
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