COM Express Compact Size Type 6 module with 11th Gen Intel Celeron 6305E processor, dual-core, 1.8 GHz, Intel UHD graphics, dual-channel DDR4 up to 3200 MT/s with up to 64 GB in 2x SO-DIMM, 1x PCIe Gen4 x4, configurable PCIe Gen3 lanes, 2.5GbE, SATA, USB, UART, GPIO, optional TPM 2.0.

Hersteller: Adlink Technology Inc.

Kategorie: Keine Kategorie

COM Express Compact Size Type 6 module with 11th Gen Intel Core i3-1115G4E processor, dual-core, 3.0/3.9 GHz, Intel UHD graphics, dual-channel DDR4 up to 3200 MT/s with up to 64 GB in 2x SO-DIMM, 1x PCIe Gen4 x4, configurable PCIe Gen3 lanes, 2.5GbE, SATA, USB, UART, GPIO, optional TPM 2.0.

Hersteller: Adlink Technology Inc.

Kategorie: Keine Kategorie

COM Express Compact Size Type 6 module with 11th Gen Intel Core i5-1145G7E processor, quad-core, 2.6/4.1 GHz, Intel Iris Xe graphics, dual-channel DDR4 up to 3200 MT/s with up to 64 GB in 2x SO-DIMM, 1x PCIe Gen4 x4, 5x PCIe Gen3 x1 configurable lanes, 2.5GbE, 2x SATA 6Gb/s, 8x USB, 2x UART, GPIO, optional TPM 2.0, 95 x 95 mm.

Hersteller: Adlink Technology Inc.

Kategorie: Keine Kategorie

COM Express Compact Size Type 6 module with 11th Gen Intel Core i7-1185G7E processor, quad-core, 2.8/4.4 GHz, Intel Iris Xe graphics, dual-channel DDR4 up to 3200 MT/s with up to 64 GB in 2x SO-DIMM, 1x PCIe Gen4 x4, 5x PCIe Gen3 x1 configurable lanes, 2.5GbE, 2x SATA 6Gb/s, 8x USB, 2x UART, GPIO, optional TPM 2.0, PICMG COM.0 Rev 3.0 Type 6, 95 x 95 mm.

Hersteller: Adlink Technology Inc.

Kategorie: Keine Kategorie

- **Compact Dual I/O Design:** Combines 8 discrete NPN sinking inputs and 8 discrete NPN sinking outputs on a single compact board, minimizing installation space and simplifying wiring. - **High-Speed Link (HSL) Interface:** Utilizes ADLINK’s proprietary HSL communication protocol for fast, deterministic data transfer between modules and controllers. - **Industrial-Grade Reliability:** Designed for robust operation in industrial environments, supporting wide voltage ranges and stable signal integrity. - **Flexible Power Input:** Operates with an external DC power supply ranging from +10 V to +30 V, ensuring compatibility with standard industrial power systems. - **LED Status Indicators:** Integrated LED indicators for power, link status, and individual channel activity provide immediate visual diagnostics. - **DIN-Rail Mounting Compatibility:** Supports installation with HSL terminal bases such as HSL-TB32-U-DIN and HSL-TB64-DIN for modular, scalable system integration. - **Fast Response Time:** Typical ON/OFF response times of 2 ms ensure accurate and timely signal processing for high-speed automation tasks. - **Address Configuration via DIP Switch:** Simple DIP switch configuration allows flexible address assignment within the HSL network. - **NPN Sinking Input/Output Type:** Compatible with NPN-type sensors and actuators, supporting both dry contact and open-collector signal types. - **Scalable System Integration:** Can be combined with other HSL daughter boards (e.g., HSL-DI32-DB, HSL-DO32-DB) to expand I/O capacity.

Hersteller: Adlink Technology Inc.

Kategorie: HSL RT IO System

- **8-Channel NPN Input / 8-Channel PNP Output Configuration:** Provides eight discrete sinking inputs and eight sourcing outputs, allowing direct connection to a wide range of industrial sensors, switches, and actuators. - **Compact Form Factor:** Designed as a daughter board for space-constrained control cabinets or embedded automation systems. - **High-Speed Link (HSL) Interface:** Integrates seamlessly into ADLINK’s HSL system, supporting high-speed, deterministic communication between distributed I/O modules and host controllers. - **Flexible Power Supply:** Operates from a wide DC voltage range of **+10V to +30V**, ensuring compatibility with standard industrial power systems. - **LED Status Indicators:** Provides visual feedback for power, link status, and individual channel activity, simplifying diagnostics and maintenance. - **DIN-Rail Mountable Terminal Bases:** Compatible with **HSL-TB32-U-DIN** and **HSL-TB64-DIN** terminal bases for convenient wiring and modular expansion. - **Fast Response Time:** Input and output response times of **2 ms maximum**, suitable for high-speed control loops and real-time monitoring. - **High Electrical Isolation and Noise Immunity:** Designed for industrial environments with robust signal conditioning and protection circuitry. - **Scalable System Integration:** Can be combined with other HSL modules (e.g., HSL-DI32-DB, HSL-DO32-DB) to build large-scale distributed I/O networks.

Hersteller: Adlink Technology Inc.

Kategorie: HSL RT IO System

- **Compact Dual-Function Design:** Combines 8-channel PNP sourcing digital inputs and 8-channel NPN sinking digital outputs on a single compact board, minimizing space requirements in control cabinets. - **High-Speed Link (HSL) Interface:** Utilizes ADLINK’s HSL communication protocol for fast, deterministic, and noise-immune data transmission suitable for industrial automation networks. - **Flexible Power Input:** Operates with an external DC power supply ranging from **+10V to +30V DC**, ensuring compatibility with standard industrial power systems. - **LED Status Indicators:** Integrated LED indicators for **Power (Red)**, **Link (Green)**, and **I/O activity (Yellow)** provide immediate visual feedback for diagnostics and system monitoring. - **Modular Terminal Base Compatibility:** Supports multiple terminal base options including **HSL-TB32-U-DIN**, **HSL-TB32-DO-DIN**, and **HSL-TB64-DIN**, allowing flexible installation and channel expansion. - **Fast Response Time:** Typical ON/OFF response time of **2 ms**, suitable for high-speed discrete control applications. - **High Output Drive Capability:** Each output channel supports up to **300 mA at 24V DC** (for NPN sinking type), enabling direct control of relays, solenoids, and indicator lamps. - **Address Configuration via DIP Switch:** Simple address assignment using onboard DIP switches, supporting consecutive address allocation for multi-module systems. - **Robust Industrial Design:** Built with durable materials and designed for DIN-rail mounting, ensuring mechanical stability and ease of integration in industrial panels. - **Scalable System Integration:** Fully compatible with ADLINK’s HSL master modules and terminal bases, enabling flexible system scaling from small to large distributed I/O networks.

Hersteller: Adlink Technology Inc.

Kategorie: HSL RT IO System

- **Compact Dual I/O Design:** Combines 8-channel PNP sourcing digital inputs and 8-channel PNP sourcing digital outputs on a single compact board, minimizing space requirements in control cabinets. - **High-Speed Communication:** Utilizes ADLINK’s HSL (High Speed Link) technology for deterministic, low-latency data transfer suitable for real-time control applications. - **PNP Sourcing Configuration:** Both input and output channels are PNP-type, simplifying wiring for sensors and actuators that require sourcing logic. - **Modular Expandability:** Compatible with HSL terminal bases such as HSL-TB32-U-DIN and HSL-TB64-DIN, allowing flexible system scaling. - **LED Status Indicators:** Integrated LEDs for power, link, and channel activity provide immediate visual diagnostics. - **Wide Power Supply Range:** Operates from +10V to +30V DC, accommodating various industrial power systems. - **Fast Response Time:** Typical ON/OFF response time of 2 ms ensures precise timing in automation sequences. - **DIN-Rail Mountable:** Designed for easy installation in standard industrial enclosures. - **Industrial-Grade Reliability:** Built with robust materials and electrical isolation to ensure stable operation in harsh environments. - **Address Configuration via DIP Switch:** Simple address assignment for multi-module HSL networks.

Hersteller: Adlink Technology Inc.

Kategorie: HSL RT IO System

- **Integrated Motion & I/O Control:** Combines a 12‑axis SSCNETII servo control interface (200 MHz DSP) with dual HSL ports for distributed I/O expansion. - **High‑Speed Distributed I/O (HSL):** Supports up to **63 slave I/O modules per master**, with deterministic scan times as low as **30.1 µs per module** and total refresh rates under **2 ms** for 2016 I/O points. - **Real‑Time Deterministic Operation:** Fixed, linear I/O refresh rate proportional to the number of connected slaves ensures predictable timing for control and data acquisition. - **Simple Wiring Architecture:** Uses standard **RJ‑45 connectors** and **Cat.5 100 Base‑TX Ethernet cables** for RS‑422 full‑duplex communication, reducing wiring complexity and cost. - **Massive I/O Expansion:** Up to **16 HSL masters** per system (8 dual‑port cards), supporting **1008 slave modules** and over **32,000 digital I/O points**. - **Self‑Diagnostic & Error Handling:** Built‑in CRC‑12 error checking, per‑slave communication counters, and automatic fault detection with software event reporting. - **Modular Slave Design:** Hot‑swappable slave I/O modules with standardized mechanical form factors and terminal bases for flexible installation. - **Comprehensive Software Support:** Drivers and libraries for **Windows 95/98/2000/NT**, **Linux**, **LabVIEW**, **ISaGRAF (IEC 1131‑3)**, **OPC**, and **DDE** integration. - **Open PC‑Based Architecture:** Fully compatible with standard PC/IPC platforms using the PCI bus, enabling integration with SCADA, HMI, and DAQ systems.

Hersteller: Adlink Technology Inc.

Kategorie: HSL RT IO System

- **8‑Axis Motion Control:** Supports coordinated multi‑axis motion for complex automation tasks. - **Dual HSL Ports:** Two independent HSL (High‑Speed Link) ports for distributed I/O connectivity. - **High‑Speed Distributed I/O:** Up to 6 Mbps data rate with deterministic I/O refreshing. - **Real‑Time Performance:** Deterministic scan cycle proportional to the number of slave modules (30.1 µs per module). - **Scalable Architecture:** Supports up to 63 slave I/O modules per HSL master, expandable to 16 masters per system. - **CompactPCI Interface:** Fully compliant with CompactPCI specifications for industrial embedded systems. - **Easy Wiring:** Utilizes standard RJ‑45 connectors and Cat.5 Ethernet cables for simplified installation. - **Self‑Diagnostic and Error Handling:** Built‑in CRC12 error checking, slave‑no‑response counters, and communication monitoring. - **Modular Slave I/O Design:** Hot‑swappable slave modules with standardized mechanical dimensions and terminal bases. - **Software Support:** Comprehensive driver and API support for Windows and Linux, including DLLs, LabVIEW, ISaGRAF, OPC, and DDE servers. - **Open PC‑Based Architecture:** Compatible with standard PC/IPC platforms, enabling integration with SCADA, DAQ, and SoftPLC systems.

Hersteller: Adlink Technology Inc.

Kategorie: HSL RT IO System

DAQMaster is engineered to streamline the configuration and management of ADLINK’s DAQ and PCI cards. Its key features include: - **Configuration-Based Management:** Provides a graphical, configuration-driven interface for setting up and managing ADLINK DAQ devices without requiring manual coding or low-level driver manipulation. - **Comprehensive Device Detection:** Automatically scans and identifies all connected ADLINK DAQ and PCI cards, displaying detailed device information such as model number, serial number, firmware version, and channel configuration. - **Unified Device Administration:** Centralizes control of multiple DAQ devices, allowing users to configure, calibrate, and monitor all connected hardware from a single software environment. - **Parameter Configuration:** Enables users to define sampling rates, input ranges, trigger modes, and channel mappings through an intuitive interface. - **Real-Time Monitoring:** Provides live data visualization and signal monitoring for verification and troubleshooting. - **Driver and Firmware Integration:** Seamlessly integrates with ADLINK’s driver packages and firmware utilities, ensuring compatibility and up-to-date device operation. - **Diagnostic and Test Tools:** Includes built-in diagnostic functions for verifying device connectivity, signal integrity, and performance metrics. - **User-Friendly Interface:** Offers a structured, menu-driven GUI that simplifies complex configuration tasks, reducing setup time and minimizing configuration errors. - **Cross-Platform Support:** Compatible with major Windows operating systems and supports integration with ADLINK SDKs and APIs for advanced application development. - **Scalability:** Supports a wide range of ADLINK DAQ and PCI cards, from entry-level analog input modules to high-speed, multi-channel data acquisition systems.

Hersteller: Adlink Technology Inc.

Kategorie: ADLink Driver, Software

- **Processor:** Intel® Core™2 Duo P8400, 2.26 GHz dual-core CPU - **Chipset:** Intel® GM45 Graphics Memory Controller Hub + ICH9-M I/O Controller - **Fanless Design:** Passive cooling for silent, dust-free operation - **Rugged Construction:** Operates from -20°C to +70°C (with industrial SSD) - **Maritime Certification:** IEC-60945 compliant for marine-grade reliability - **Power Input:** 9–24 VDC isolated wide-range DC input - **Networking:** Four Gigabit Ethernet ports (2× Intel® 82574L, 2× Realtek 8111C) - **Serial Communication:** 2× RS-232 and 2× RS-232/422/485 configurable ports - **USB Connectivity:** Six USB 2.0 ports for peripheral expansion - **Display Output:** DVI-I connector supporting both analog CRT and digital DVI-D dual-display output - **Storage:** One SATA port for 2.5" HDD or SSD installation - **Vibration Resistance:** 5 Grms (SSD/CF configuration) - **Shock Resistance:** 50 Grms, 11 ms half-sine pulse (SSD/CF configuration) - **Compact Form Factor:** 248 × 185 × 85 mm, 3.7 kg - **Operating Systems Supported:** Windows® XP, Windows® 7, Linux (by request)

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** 6th Generation Intel® Core™ i3‑6100TE (Skylake) dual‑core CPU, 2.7 GHz, 4 MB L3 cache. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (4 GB standard). - **Graphics:** Integrated Intel® HD Graphics 530 with support for up to three independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA. - **Fanless Design:** Completely fanless thermal solution for silent operation and high reliability in dusty or vibration‑prone environments. - **Networking:** Three Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN (WOL) support. - **Serial Communication:** Four COM ports (2 × software‑selectable RS‑232/422/485 with auto‑flow control, 2 × RS‑232). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external ports (1.6 A each), and 1 × internal USB 2.0 (optional). - **Storage Options:** 1 × SATA III (6 Gb/s) port for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear‑mounted). - **Expansion:** 1 × Mini PCI Express slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE). - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (with industrial SSD). - **Mounting:** Wall‑mount kit included. - **Construction:** Compact, industrial‑grade aluminum chassis with front‑accessible I/O.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor:** 6th Generation Intel® Core™ i3‑6100TE (2.7 GHz, 4 MB cache, dual‑core) - **Chipset:** Intel® H110 Mobile Platform Controller Hub - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 - **Graphics:** Integrated Intel® HD Graphics 530 with support for up to two independent displays - **Display Interfaces:** - 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz) - 1 × VGA (up to 1920 × 1200 @ 60 Hz) - **Expansion Slots:** - 1 × PCIe x16 (Gen 3) - 1 × PCI (32‑bit, 33 MHz) - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE, and IEEE 1588 support - **Storage:** - 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD - 1 × rear CFast slot (Type II, SATA interface) - **USB Connectivity:** - 4 × USB 3.0 (external, Type A) - 2 × USB 2.0 (external, Type A) - 1 × internal USB 2.0 (Type A) - **Serial Communication:** - 2 × software‑programmable RS‑232/422/485 ports (COM1, COM2) - 2 × RS‑232 ports (COM3, COM4) - **Digital I/O:** 8 × DI and 8 × DO channels (non‑isolated, open‑drain MOSFET outputs) - **Audio:** 1 × Mic‑in, 1 × Line‑out - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector - **Operating Temperature:** 0 °C – 50 °C (fanless operation with industrial SSD) - **Mounting:** Wall‑mount kit included - **Construction:** Rugged aluminum chassis, fanless thermal design

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor and Chipset:** Equipped with Intel® Core™ i3‑6100E dual‑core, four‑thread CPU (2.7 GHz, 3 MB cache) and Intel® QM170 chipset for enhanced performance and low power consumption. - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory. - **Expansion Flexibility:** One PCI slot and two PCIe Gen3 ×8 slots (or one PCIe ×16 slot, auto‑switching) for add‑on cards. Two Mini PCIe slots and one USIM socket for 3G/4G communication modules. - **Display Capabilities:** Supports up to three independent displays via two DisplayPort 1.3 and one DVI‑I port. Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD). DisplayPort to VGA/DVI/HDMI conversion supported via adapter cables. - **Storage:** Two front‑mounted hot‑swappable 2.5″ SATA III trays and two internal SATA III ports (6 Gb/s) with RAID 0/1/5/10 support. One internal Type II CFast socket for solid‑state storage. - **Connectivity:** Three Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219LM) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 support. Six USB 3.0 ports (two × 1600 mA, four × 900 mA) and one internal USB 2.0 port. Four serial ports: two software‑programmable RS‑232/422/485 and two RS‑232. Optional 16‑channel isolated digital input/output (DI/O) module with configurable digital filters. - **Power and Reliability:** Wide‑range 9–32 V DC input with remote power on/off connector. Optional 160 W AC‑DC adapter. Fanless operation from –20 °C to +70 °C (with industrial SSD/CFast). Built‑in watchdog timer and SEMA 3.0 system management. - **Mechanical Design:** Compact, cable‑free, fanless aluminum chassis (150 × 200 × 225 mm, 4 kg). Wall‑mountable with optional fan module for high‑power PCIe cards.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor and Chipset:** Equipped with a 6th Generation Intel® Core™ i3-6100E processor (Skylake architecture) and Intel® QM170 chipset, providing strong computational performance and integrated Intel® HD Graphics 530. - **Fanless Design:** Completely fanless operation ensures silent performance and high reliability in dusty or vibration-prone environments. The system’s thermal design supports operation in extended temperature ranges up to -20°C to +70°C (with industrial SSD). - **Rich I/O Connectivity:** - 4 × Intel® Gigabit Ethernet ports - 6 × COM ports (4 configurable RS-232/422/485 + 2 RS-232) - 8 × USB ports (4 USB 3.0 + 4 USB 2.0) - 8 × isolated Digital Inputs and 8 × isolated Digital Outputs - 1 × Audio (Mic-in/Line-out) - 2 × DisplayPort (4096×2304 @60Hz) and 1 × DVI-I (supports DVI-D and VGA) - **Storage Flexibility:** - 2 × 2.5” SATA III (6.0 Gb/s) hot-swappable drive bays - 1 × M.2 2280 slot (SATA) - 1 × CFast socket - **Expansion and Communication:** - 2 × Mini PCIe slots with 2 × USIM sockets for wireless modules (3G/4G/LTE, Wi-Fi, Bluetooth, GPS) - Optional wireless kit for extended connectivity - **Rugged Construction:** - Cable-free internal design - 5 Grms vibration resistance (SSD configuration) - 100G shock resistance (SSD configuration) - EMC compliance with CE/FCC Class A - **System Management:** Integrated ADLINK SEMA 3.0 (Smart Embedded Management Agent) for remote monitoring, power management, and system health diagnostics. - **Software Support:** Compatible with Windows® 10/7/Embedded Standard 7 and Linux distributions (others available upon request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor and Chipset:** - Intel® Core™ i3-2330E dual-core processor - Intel® Mobile Platform Controller Hub (QM67) - Integrated Intel® HD Graphics 3000 GPU - **Fanless Design:** - Completely fanless operation for silent, maintenance-free performance. - Ruggedized thermal design supports extended temperature operation (-20°C to +70°C with industrial SSD). - **Rich I/O Connectivity:** - 4 Gigabit Ethernet ports (2× Realtek® 8111C, 1× Intel® 82574IT, 1× Intel® 82579LM PHY) - 4 COM ports (2× RS-232/422/485 software-programmable, 2× RS-232) - 6 USB ports (2× USB 3.0, 4× USB 2.0) - 4 isolated digital I/O channels (1.5 kV isolation) - 1 audio interface (mic-in, line-out) - 1 PS/2 combo port for keyboard/mouse - **Expansion and Storage:** - 2 Mini PCIe slots (one with USIM socket, one with mSATA support) - 1 SATA III port for 2.5" HDD/SSD - 1 external CFast slot - 1 eSATA port for external storage expansion - **Wireless and Remote Management:** - Dual Mini PCIe slots support 3G, Wi-Fi, Bluetooth, and GPS modules. - Intel® Active Management Technology (AMT) 7.0 for remote diagnostics and BIOS configuration. - **Rugged Industrial Design:** - 9–32 VDC wide-range power input - 5 Grms vibration resistance (SSD/CFast) - 50 G shock resistance - CE and FCC Class A compliance

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Support:** 3rd Generation Intel® Core™ i7/i5/i3 and Celeron processors (Ivy Bridge architecture). MXC‑6303D specifically integrates the Intel® Core™ i3‑3120ME dual‑core 2.4 GHz CPU with 3 MB cache. - **Chipset:** Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory. - **Display:** Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 @ 60 Hz). - **Expansion:** 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (auto‑switching, PCIe Gen 2). - **Storage:** Two onboard SATA III ports (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external). - **Networking:** 2 × Intel GbE ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and iAMT 8.0. - **I/O Interfaces:** - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232 - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation) - Audio: Mic‑in + Line‑out (Realtek ALC269 HD Audio) - PS/2 keyboard and mouse ports - **Power Input:** 9 – 32 V DC wide‑range input with pluggable 3‑pin connector and optional remote power switch. - **Design:** Completely fanless and cable‑free for high reliability in harsh environments. - **Operating Temperature:** - Standard: 0 °C – 50 °C (with HDD) - Extended: –20 °C – 60 °C (with industrial SSD/CFast) - **Certifications:** CE, FCC Class A, UL/cUL, CB, KCC. - **Mounting:** Wall‑mount kit included.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** Powered by a 3rd‑generation Intel® Core™ i3‑3120ME dual‑core CPU (2.4 GHz, 3 MB cache), paired with the Intel® QM77 Mobile Platform Controller Hub. Supports Intel® HD Graphics 4000 integrated GPU for high‑definition visual output. - **Fanless and Cable‑Free Design:** The MXC‑6313D employs a completely fanless architecture with passive heat dissipation, ensuring silent operation and high reliability in dusty or vibration‑prone environments. The cable‑free internal layout enhances mechanical robustness and thermal stability. - **Expandable Architecture:** Provides one PCI slot and one PCI Express x16 slot (Gen 2), allowing integration of add‑on cards for motion control, data acquisition, or specialized I/O expansion. - **Triple Independent Display Support:** Two DisplayPort connectors and one DVI‑I port enable simultaneous operation of up to three independent displays with resolutions up to 2560 × 1600 (1st DP), 1920 × 1600 (2nd DP), and 1920 × 1200 (DVI‑I). - **Comprehensive I/O Connectivity:** Includes 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0; 2 × RS‑232/422/485 software‑selectable ports and 2 × RS‑232 ports; 3 × Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming and Intel AMT 11.0 support; 16‑channel isolated digital input and 16‑channel isolated digital output. - **Storage Flexibility:** Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation, supporting RAID 0/1. Dual CFast sockets (one internal, one external) for solid‑state storage or OS installation. - **Wide‑Range Power Input:** Accepts 9 – 32 V DC input via pluggable connector with latch and optional remote power switch. - **Industrial‑Grade Reliability:** Operating temperature range of 0 °C – 50 °C (standard) or –20 °C – 60 °C with industrial‑grade SSD/RAM. Vibration tolerance up to 5 Grms (SSD/CFast) and shock resistance up to 50 G. - **Software and OS Support:** Compatible with Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, and Linux distributions.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** 3rd Generation Intel® Core™ i3‑3120ME (2.4 GHz, 3 MB cache, dual‑core) with Intel® QM77 Mobile Platform Controller Hub. - **Fanless Design:** Completely fanless and cable‑free architecture for silent operation and enhanced reliability in harsh industrial environments. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory. - **Expansion Capability:** Four expansion slots — three PCI and one PCI Express ×16 (Gen 2) — enabling flexible system integration with add‑on cards. - **Display Support:** Triple independent display capability via two DisplayPort connectors and one DVI‑I port, supporting resolutions up to 2560 × 1600. - **Storage Options:** Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation with RAID 0/1 support; dual CFast sockets (one internal, one external). - **Networking:** Three Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming function, Wake‑on‑LAN, and Intel® Active Management Technology (iAMT 11.0). - **I/O Interfaces:** - 2 × RS‑232/422/485 (software‑selectable) - 2 × RS‑232 - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation) - Audio (Mic‑in, Line‑out) - PS/2 keyboard and mouse ports - **Power Input:** Wide‑range 9 – 32 V DC input with pluggable connector and remote power switch support. - **Operating Temperature:** - Standard: 0 °C – 50 °C - Extended: –20 °C – +55 °C (with industrial‑grade SSD/RAM) - **Mechanical Design:** Compact aluminum chassis (173 × 225 × 213 mm), weight 4.3 kg, wall‑mountable. - **Reliability:** Shock‑resistant (50 G, 11 ms), vibration‑tolerant (5 Grms, 5–500 Hz), CE/FCC Class A, UL/cUL, CB, KCC certified.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor & Architecture:** Equipped with a dual‑core Intel® Core™ i3‑4100E processor (2.4 GHz, Haswell architecture) delivering strong computing performance with low thermal design power (TDP). - **Chipset:** Intel® QM87 chipset supporting advanced I/O, SATA III, USB 3.0, and PCIe 3.0 interfaces. - **Graphics & Display:** Integrated Intel® HD Graphics supporting up to three independent displays via 1 × DVI‑I and 2 × DisplayPort connectors. Maximum resolutions: – DisplayPort: up to 2560 × 1600 @ 60 Hz – DVI‑I: up to 1920 × 1080 @ 60 Hz – VGA (via DVI‑I analog): up to 2048 × 1280 @ 60 Hz - **Fanless Rugged Design:** Completely fanless aluminum chassis with cable‑free internal design, optimized for vibration resistance (up to 5 Grms) and extended temperature operation (‑20 °C to +70 °C with industrial SSD/CFast). - **Rich I/O Interface:** – 4 × Gigabit Ethernet (3 × Intel I210IT + 1 × Intel I217LM) – 4 × COM ports (2 × RS‑232/422/485 + 2 × RS‑232) – 6 × USB 3.0 (4 ports with 1600 mA power budget) + 1 × USB 2.0 – 8 × Isolated Digital Inputs + 8 × Isolated Digital Outputs (1.5 kV isolation) – 1 × Audio In + 1 × Line Out - **Expansion & Storage:** – 2 × Mini PCIe slots (one switchable to mSATA) – 1 × USIM socket for 3G/LTE modules – 2 × SATA III ports (6 Gb/s) supporting RAID 0/1 – 1 × CFast Type II slot – 1 × eSATA port - **Power Input:** Wide‑range 9 – 32 V DC input with optional 160 W AC‑DC adapter. - **Embedded Management:** Integrated ADLINK SEMA 2.2 (Smart Embedded Management Agent) for system health monitoring, watchdog timer, and remote management. - **Security & Virtualization:** Intel® vPro™ technology (iAMT 9.0, TPM 1.2, TXT, Intel VT) for secure remote management and virtualization. - **Software Support:** Compatible with Windows 7 / Windows 7 Embedded and Linux (distribution by request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor:** 6th Generation Intel® Core™ i5‑6500TE, Quad‑Core, 2.3 GHz (Turbo up to 3.3 GHz), 6 MB L3 cache. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Dual DDR4‑2133 MHz SO‑DIMM sockets, up to 32 GB total capacity. - **Graphics:** Integrated Intel® HD Graphics 530 supporting up to three independent displays. - **Display Interfaces:** - 2 × DisplayPort 1.2 (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (1920 × 1080 @ 60 Hz) - 1 × VGA (1920 × 1200 @ 60 Hz) - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN. - **Serial Communication:** 2 × software‑selectable RS‑232/422/485 ports (COM1/2) and 2 × RS‑232 ports (COM3/4). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 (optional). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output. - **Expansion:** 1 × Mini PCIe slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE). - **Storage:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast slot. - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector. - **Cooling:** Fanless passive thermal design for silent, dust‑resistant operation. - **Mounting:** Wall‑mount kit included. - **Operating Temperature:** 0 °C – 50 °C (industrial SSD recommended). - **Software Support:** Windows 7 Pro, Windows 10 IoT Enterprise, Linux (Ubuntu 12.04/Fedora 18 on request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor:** Intel® Core™ i5‑6500TE Quad‑Core CPU (2.3 GHz base, 3.3 GHz Turbo, 6 MB cache) - **Chipset:** Intel® H110 Mobile Platform Controller Hub - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz - **Graphics:** Integrated Intel® HD Graphics 530 with support for dual independent displays - **Display Interfaces:** - 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz) - 1 × VGA (up to 1920 × 1200 @ 60 Hz) - **Expansion:** - 1 × PCIe x16 Gen3 slot - 1 × PCI 32‑bit slot (33 MHz) - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE boot, and IEEE 1588 support - **Storage:** - 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD - 1 × rear CFast Type II socket (SATA interface, 3.0 Gb/s) - **I/O Interfaces:** - 4 × USB 3.0 (Type A) - 2 × USB 2.0 (Type A) + 1 × internal USB 2.0 - 4 × COM ports (2 × RS‑232/422/485 software‑selectable + 2 × RS‑232) - 8 × Digital Input + 8 × Digital Output channels - 1 × Mic‑in and 1 × Line‑out audio - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector - **Operating Temperature:** 0 °C to 50 °C (fanless, with industrial SSD) - **Mounting:** Wall‑mount kit included - **Construction:** Fanless aluminum chassis for dust‑resistant, low‑noise operation

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** 6th Generation Intel® Core™ i5‑6440EQ (Skylake) CPU, 4 cores / 4 threads, 2.7 GHz base frequency, 3.4 GHz Turbo, 6 MB cache. Integrated Intel® Gen9 HD Graphics (GT2e/GT4e) supporting 4K UHD output. - **Chipset:** Intel® QM170 Mobile Platform Controller Hub. - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Display Support:** Three independent displays via dual DisplayPort 1.3 and one DVI‑I port. Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD). Supports VGA/DVI/HDMI through converter cables. - **Expansion Capability:** 1 × PCI slot and either 2 × PCIe Gen3 x8 or 1 × PCIe Gen3 x16 slot (auto‑switching). 2 × Mini PCIe slots (one with USIM socket for 3G/4G connectivity). - **Storage:** 2 × front‑mounted hot‑swappable SATA III trays (2.5″ HDD/SSD). 2 × internal SATA III ports with RAID 0/1/5/10 support (6 Gb/s). 1 × Type II CFast socket (front or internal). - **Networking:** 3 × Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219). Features include teaming, Wake‑on‑LAN, Intel® iAMT 11.0, PXE boot, and EEE 802.3az. - **I/O Interfaces:** - 6 × USB 3.0 (2 × 1600 mA, 4 × 900 mA) - 1 × internal USB 2.0 - 2 × RS‑232/422/485 (COM1–2, software‑selectable) - 2 × RS‑232 (COM3–4) - 1 × PS/2 keyboard and 1 × PS/2 mouse - Audio in/line out (Realtek ALC262 HD Audio) - Optional 16 × DI + 16 × DO isolated digital I/O with configurable filters and COS interrupt - **Power Input:** 9 – 32 V DC wide‑range input with 3‑pin pluggable connector (V+, V–, GND). Optional 160 W AC‑DC adapter for AC operation. Remote power on/off connector on front panel. - **Environmental Design:** Fanless, cable‑free construction with optional hot‑pluggable fan module. Standard operating range 0 – 50 °C (with HDD). Extended range –20 – 70 °C (with industrial SSD/CFast). Vibration 5 Grms (SSD/CFast), 0.5 Grms (HDD); Shock 50 G 11 ms. Humidity 95 % @ 40 °C non‑condensing. - **Certifications:** CE, FCC Class A EMC; UL/cUL and CB Safety; RoHS and WEEE compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **High‑Performance CPU:** Equipped with a 6th Generation Intel® Core™ i5‑6440EQ quad‑core processor (2.7 GHz base, up to 3.4 GHz Turbo) and Intel® QM170 chipset, providing strong computing and graphics performance for industrial workloads. - **Fanless, Rugged Design:** Completely fanless aluminum chassis ensures silent operation and resistance to dust and vibration. Operates in extended temperature ranges from ‑20 °C to +70 °C (with industrial SSD/CFast). - **Rich I/O Connectivity:** - 4 × Intel® Gigabit Ethernet ports - 6 × COM ports (2 × RS‑232 + 4 × RS‑232/422/485 configurable) - 8 × USB ports (4 × USB 3.0 + 4 × USB 2.0) - 8 × isolated digital inputs and 8 × isolated digital outputs - 1 × Mic‑in/Line‑out audio interface - 2 × DisplayPort and 1 × DVI‑I (supporting DVI‑D and VGA) - **Flexible Storage Options:** - 2 × hot‑swappable 2.5″ SATA III (6 Gb/s) drive bays - 1 × M.2 2280 slot (SATA) - 1 × CFast socket Enables RAID or redundant storage configurations. - **Expansion and Communication:** - 2 × Mini PCIe slots with 2 × USIM sockets for 3G/4G/LTE, Wi‑Fi, Bluetooth, or GPS modules. - Optional wireless kit supports 3G/Wi‑Fi/BT/GPS connectivity. - **System Management:** Integrated ADLINK SEMA 3.0 (Smart Embedded Management Agent) for remote monitoring, power management, and health diagnostics. - **Wide Power Input:** 9 – 32 V DC input range with optional 160 W AC‑DC adapter. - **Industrial‑Grade Reliability:** Cable‑free internal design, 5 Grms vibration resistance, 100 G shock tolerance (SSD), and ESD protection (±4 kV contact, ±8 kV air). - **Software Compatibility:** Supports Windows 10/7/Embedded Standard 7 and Linux distributions.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series