- **Architecture:** 3rd Generation Intel® Core™ (Ivy Bridge) - **Socket Type:** PGA988 / Socket G2 - **Core Configuration:** Dual-core, four-thread processor with Intel® Hyper-Threading Technology - **Base Clock Frequency:** 2.4 GHz - **Integrated Graphics:** Intel® HD Graphics 4000 with dynamic frequency scaling - **Process Technology:** 22nm tri-gate transistor technology for improved energy efficiency - **Thermal Design Power (TDP):** 35 Watts - **Memory Support:** Dual-channel DDR3/DDR3L memory up to 1600 MHz - **Embedded Lifecycle Support:** Extended availability for embedded and industrial applications - **Virtualization Support:** Intel® Virtualization Technology (VT-x) and Intel® VT-d for hardware-assisted virtualization - **Security Features:** Intel® AES New Instructions (AES-NI), Intel® Secure Key, and Execute Disable Bit for enhanced data protection - **Graphics Capabilities:** Support for DirectX 11, OpenGL 4.0, and OpenCL 1.1; capable of driving multiple displays - **Integrated Media Engine:** Hardware acceleration for HD video playback and encoding - **Energy Efficiency:** Optimized power management with Intel® SpeedStep® and Deep Power Down (C-states)

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i3-6100 Processor, 3M Cache - 3.70 GHz, TDP:65W

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** Based on Intel’s 14 nm Skylake microarchitecture, offering improved performance-per-watt and enhanced integrated graphics compared to previous generations. - **Core Configuration:** Dual-core, four-thread processor with Intel® Hyper-Threading Technology, enabling efficient parallel processing for multitasking workloads. - **Clock Speed:** Fixed base frequency of 2.70 GHz, optimized for consistent performance in thermally constrained environments. - **Cache:** 4 MB Intel® Smart Cache shared dynamically between cores for faster data access and reduced latency. - **Integrated Graphics:** Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, with a base frequency of 350 MHz and a maximum dynamic frequency up to 1.00 GHz. - **Memory Support:** Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for both legacy and modern systems. - **Thermal Design Power (TDP):** 35 W, making it suitable for compact and fanless systems where thermal efficiency is critical. - **Socket Compatibility:** LGA 1151 socket, compatible with Intel® 100-series chipsets (e.g., H110, Q170, B150, H170). - **Virtualization Support:** Intel® VT-x and VT-d technologies for hardware-assisted virtualization and efficient resource allocation in virtualized environments. - **Security Features:** Intel® AES-NI for accelerated encryption, Intel® Secure Key, and Intel® OS Guard for enhanced data protection and system integrity. - **Display Capabilities:** Supports up to three independent displays with resolutions up to 4096x2304 @ 60 Hz via DisplayPort or HDMI. - **Energy Efficiency:** Optimized for low-power embedded and industrial applications, maintaining performance while minimizing heat output.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** 3rd Generation Intel® Core™ (Ivy Bridge) - **Core Configuration:** Dual-core with four threads (2 cores / 4 threads) via Intel® Hyper-Threading Technology - **Base Clock Speed:** 2.7 GHz - **Max Turbo Frequency:** Up to 3.3 GHz with Intel® Turbo Boost Technology 2.0 - **Integrated Graphics:** Intel® HD Graphics 4000 with dynamic frequency scaling - **Graphics Base Frequency:** 650 MHz - **Graphics Max Dynamic Frequency:** Up to 1.1 GHz - **Cache:** 3 MB Intel® Smart Cache shared between cores - **Instruction Set:** 64-bit, supporting Intel® SSE4.1/4.2 and AVX instructions - **Thermal Design Power (TDP):** 35 watts - **Socket Type:** G2 / rPGA988B - **Process Technology:** 22 nm tri-gate transistor technology - **Memory Support:** Dual-channel DDR3/DDR3L memory up to 1600 MHz - **Embedded Lifecycle Support:** Extended availability for embedded and industrial markets - **Virtualization Support:** Intel® VT-x and VT-d for hardware-assisted virtualization - **Security Features:** Intel® AES-NI, Intel® Secure Key, Intel® Trusted Execution Technology (TXT) - **Power Management:** Enhanced Intel® SpeedStep® Technology, Thermal Monitoring, and configurable TDP options The i5-3610ME is engineered for embedded computing environments requiring high reliability, long-term availability, and consistent performance under extended operating conditions.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i5-520M Processor, 3M Cache - 2.40 GHz up to 2.93GHz

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i5-6500 Processor, 6M Cache - up to 3.60 GHz, TDP:65W

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Quad-Core Architecture:** The i5-6500TE features four physical cores and supports four threads, providing robust multitasking and parallel processing performance for industrial and embedded workloads. - **Base and Turbo Frequencies:** Operates at a base frequency of 2.3 GHz with Intel® Turbo Boost Technology 2.0 enabling dynamic acceleration up to 3.3 GHz for demanding tasks. - **Integrated Graphics:** Equipped with Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, enabling smooth rendering for 2D/3D graphics, video playback, and light gaming or visualization workloads. - **Cache Memory:** 6 MB Intel® Smart Cache shared dynamically among cores to improve data access speed and reduce latency. - **Thermal Design Power (TDP):** Optimized 35 W TDP for energy-efficient operation in thermally constrained environments such as fanless or small-form-factor systems. - **Memory Support:** Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for various system configurations. - **Virtualization and Security:** Supports Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT), and Intel® Software Guard Extensions (SGX) for secure and isolated computing environments. - **Advanced Power Management:** Features Intel® SpeedStep® Technology and power gating for dynamic power optimization. - **Embedded Lifecycle Support:** Designed for embedded and industrial markets with extended availability and reliability.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Quad-Core Architecture:** Four physical cores with Hyper-Threading Technology, supporting up to eight simultaneous threads for enhanced multitasking and parallel processing. - **Base and Turbo Frequencies:** Operates at a base clock speed of 2.3 GHz with Intel® Turbo Boost Technology 2.0 enabling dynamic frequency scaling up to 3.3 GHz for demanding workloads. - **Ivy Bridge Microarchitecture:** Built on Intel’s 22nm process technology featuring 3D Tri-Gate transistors for improved performance-per-watt efficiency compared to previous generations. - **Integrated Graphics:** Intel® HD Graphics 4000 integrated GPU with support for DirectX 11, OpenGL 4.0, and OpenCL 1.1, enabling advanced visual performance without the need for a discrete GPU. - **Embedded Platform Support:** Part of Intel’s embedded product line with extended availability and lifecycle support, ideal for industrial, medical, and military-grade systems. - **Virtualization and Security:** Supports Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT), and Intel® AES New Instructions (AES-NI) for secure and efficient virtualization and encryption. - **Memory Support:** Dual-channel DDR3/DDR3L memory controller supporting up to 32 GB of system memory at speeds up to 1600 MHz. - **Thermal Design Power (TDP):** 45 watts, optimized for performance in thermally constrained environments. - **Socket Compatibility:** Designed for Socket G2 (rPGA988B) platforms, ensuring compatibility with a wide range of embedded and mobile motherboards.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** Based on Intel’s 22nm Ivy Bridge microarchitecture, offering improved performance-per-watt compared to the previous Sandy Bridge generation. - **Core Configuration:** Quad-core design with Hyper-Threading Technology, enabling up to eight simultaneous processing threads for enhanced multitasking. - **Clock Speed:** Base frequency of 2.30 GHz with Intel® Turbo Boost Technology 2.0 allowing dynamic acceleration up to 3.30 GHz depending on workload and thermal conditions. - **Integrated Graphics:** Intel® HD Graphics 4000 integrated GPU, supporting DirectX 11, OpenGL 4.0, and Intel® Quick Sync Video for hardware-accelerated media encoding and decoding. - **Cache Memory:** 6 MB Intel® Smart Cache shared dynamically among cores for optimized data access and reduced latency. - **Thermal Design Power (TDP):** 45 watts, balancing high performance with efficient thermal management for mobile platforms. - **Instruction Set Support:** 64-bit instruction set with support for Intel® SSE4.1, SSE4.2, and AVX instruction extensions for enhanced computational performance. - **Virtualization and Security:** Includes Intel® Virtualization Technology (VT-x), Intel® Virtualization Technology for Directed I/O (VT-d), and Intel® Trusted Execution Technology (TXT) for secure and efficient virtualized environments. - **Memory Support:** Dual-channel DDR3/DDR3L memory controller supporting up to 32 GB of system memory at speeds up to 1600 MHz. - **Advanced Power Management:** Intel® Enhanced SpeedStep® Technology and Deep Power Down (C-states) for optimized energy efficiency.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i7-620M Processor, 4M Cache - 2.66 GHz up to 3.33GHz

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i7-6700 Processor, 8M Cache - up to 4.00 GHz, TDP:65W

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** 6th Generation Intel® Core™ (Skylake) microarchitecture - **Core/Thread Count:** 4 cores / 8 threads with Intel® Hyper-Threading Technology - **Base Frequency:** 2.40 GHz - **Max Turbo Frequency:** Up to 3.40 GHz with Intel® Turbo Boost Technology 2.0 - **Cache:** 8 MB Intel® Smart Cache shared dynamically among cores - **Thermal Design Power (TDP):** 35 W, optimized for low-power embedded and industrial systems - **Integrated Graphics:** Intel® HD Graphics 530 with dynamic frequency scaling up to 1.05 GHz - **Memory Support:** Dual-channel DDR4-2133 / DDR3L-1600 memory support - **Socket Type:** LGA 1151 - **Manufacturing Process:** 14 nm lithography - **Instruction Set:** 64-bit with Intel® SSE4.1/4.2, AVX2, and Intel® VT-x/VT-d virtualization support - **Security Features:** Intel® AES-NI, Intel® Secure Key, Intel® OS Guard, Intel® Trusted Execution Technology (TXT), and Intel® Boot Guard - **Embedded Options Available:** Yes – designed for long lifecycle embedded applications - **Graphics APIs Supported:** DirectX 12, OpenGL 4.4, OpenCL 2.0 - **Display Support:** Up to three independent displays via DisplayPort, HDMI, DVI, or eDP interfaces The i7-6700TE’s key differentiator lies in its combination of high performance and low thermal output, enabling system designers to integrate it into compact or fanless systems without sacrificing computational capability.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Celeron 1020E Socket G2 Processor,2.2GHz.

Manufacturer: Intel

Category: CPU Embedded Celeron Pentium

- **Dual-Core Architecture:** Two physical cores with two threads, based on Intel’s 14 nm Skylake microarchitecture, delivering efficient multitasking and stable performance for embedded workloads. - **Base Frequency:** 2.40 GHz fixed clock speed, optimized for consistent operation in thermally constrained environments. - **Cache Memory:** 3 MB Intel® Smart Cache shared between cores, improving data access latency and throughput. - **Integrated Graphics:** Intel® HD Graphics 510 with support for DirectX 12, OpenGL 4.4, and OpenCL 2.0, enabling hardware-accelerated video decoding and multi-display output. - **Low Power Design:** 35 W TDP (Thermal Design Power), suitable for fanless or small form factor systems. - **Memory Support:** Dual-channel DDR4/DDR3L memory controller supporting DDR4-2133 or DDR3L-1600 memory modules, up to 64 GB total capacity. - **Socket Compatibility:** LGA1151 socket, compatible with Intel® 100 Series chipsets (e.g., H110, Q170, B150). - **Virtualization Support:** Intel® Virtualization Technology (VT-x) and Intel® VT-d for efficient virtual machine management. - **Security Features:** Intel® Execute Disable Bit, Intel® Secure Key, and Intel® OS Guard for enhanced system protection. - **Embedded Lifecycle Support:** Designed for long-term availability and reliability in embedded and industrial environments.

Manufacturer: Intel

Category: CPU Embedded Celeron Pentium

Intel Celeron Processor P4500, 2M Cache - 1.86 GHz

Manufacturer: Intel

Category: CPU Embedded Celeron Pentium

SO-DIMM DDR3 4GB

Manufacturer: Intel

Category: RAM DDR3

- **Memory Type:** DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory) - **Form Factor:** SO-DIMM (Small Outline Dual In-line Memory Module) - **Capacity:** 4 GB - **Extended Temperature Range:** –20°C to +70°C, ensuring stable operation in harsh or variable environmental conditions - **High Reliability:** Designed for continuous operation in industrial and embedded systems where uptime and stability are critical - **Low Power Consumption:** DDR3 technology provides improved energy efficiency compared to DDR2, reducing thermal output and power draw - **Compact Design:** SO-DIMM form factor optimized for space-constrained systems such as industrial PCs, embedded controllers, and compact servers - **High Data Throughput:** Supports standard DDR3 data rates (commonly 1066, 1333, 1600 MT/s depending on system configuration) - **Compatibility:** Fully compliant with JEDEC DDR3 standards, ensuring interoperability with a wide range of industrial motherboards and embedded platforms - **Error-Free Operation:** Manufactured using high-quality DRAM chips and tested for data integrity under extended temperature conditions - **RoHS Compliant:** Environmentally friendly design meeting Restriction of Hazardous Substances directives

Manufacturer: Intel

Category: RAM DDR3

- **Extended Temperature Range:** Operates reliably from **–20°C to +70°C**, making it suitable for harsh or thermally challenging environments. - **High Capacity:** Provides **8GB** of DDR3 SDRAM memory capacity in a compact SO-DIMM form factor. - **DDR3 Technology:** Utilizes **DDR3 SDRAM** architecture for improved bandwidth, lower power consumption, and enhanced data transfer efficiency compared to DDR2. - **SO-DIMM Form Factor:** Compact 204-pin design optimized for space-constrained systems such as embedded boards, industrial PCs, and portable devices. - **Industrial-Grade Components:** Built using high-quality DRAM chips and PCB materials rated for extended temperature operation and long-term reliability. - **Low Power Consumption:** Operates at standard DDR3 voltage levels (typically 1.5V), offering efficient power usage for embedded and mobile applications. - **High Data Transfer Rates:** Supports standard DDR3 data rates (commonly 1066, 1333, or 1600 MT/s depending on system configuration). - **Compatibility:** Fully compliant with JEDEC DDR3 SO-DIMM standards, ensuring broad compatibility with industrial motherboards, embedded systems, and single-board computers. - **Long-Term Availability:** Designed for industrial and embedded markets where product longevity and consistent supply are critical. - **Error-Free Operation:** Non-ECC configuration suitable for systems that do not require error correction but demand stable, consistent performance.

Manufacturer: Intel

Category: RAM DDR3

SO-DIMM DDR3 8GB

Manufacturer: Intel

Category: RAM DDR3

- **Memory Type:** DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory) - **Form Factor:** SO-DIMM (Small Outline Dual Inline Memory Module) - **Capacity:** 4GB - **Operating Temperature Range:** -40°C to +85°C (wide temperature range suitable for industrial environments) - **Voltage:** Standard DDR3 operating voltage (typically 1.5V; low-voltage variants may operate at 1.35V depending on configuration) - **Data Rate:** Supports DDR3 standard frequencies (commonly 1066 MHz, 1333 MHz, 1600 MHz depending on system compatibility) - **Error Correction:** Non-ECC (standard) or ECC (optional, depending on variant) - **Compatibility:** Designed for systems supporting DDR3 SO-DIMM slots, including industrial PCs, embedded controllers, and compact computing platforms - **Reliability:** Built with high-quality DRAM chips screened for extended temperature operation and long-term stability - **Compliance:** JEDEC-compliant design ensuring interoperability and standardization across DDR3 platforms - **Durability:** Designed for continuous operation in environments with temperature extremes, vibration, and humidity variations **Unique Selling Points:** - Wide temperature tolerance (-40°C to +85°C) for industrial and outdoor use - Compact SO-DIMM form factor ideal for space-constrained embedded systems - High reliability and endurance for mission-critical applications - Fully compliant with DDR3 JEDEC standards for broad compatibility - Optimized for low power consumption and stable performance under thermal stress

Manufacturer: Intel

Category: RAM DDR3

- **Wide Temperature Range:** Fully operational from **–40°C to +85°C**, ensuring stable performance in both extreme cold and high-heat environments. - **High Capacity:** 8GB of DDR3 SDRAM, suitable for memory-intensive industrial and embedded applications. - **SO-DIMM Form Factor:** Compact 204-pin design optimized for space-constrained systems such as industrial PCs, edge devices, and embedded controllers. - **DDR3 Technology:** Utilizes DDR3 SDRAM architecture for improved bandwidth, lower power consumption, and enhanced data integrity compared to DDR2. - **Low Power Operation:** Typically operates at **1.5V** (standard DDR3 voltage), reducing thermal output and energy consumption. - **High Reliability Components:** Built using industrial-grade DRAM chips and PCB materials for long-term stability and endurance. - **Error-Free Data Transmission:** Designed for robust signal integrity and consistent data throughput in electrically noisy environments. - **Compatibility:** Fully compliant with JEDEC DDR3 SO-DIMM standards, ensuring interoperability with a wide range of industrial and embedded platforms. - **Rugged Design:** Resistant to vibration, shock, and thermal cycling, making it ideal for mission-critical and field-deployed systems.

Manufacturer: Intel

Category: RAM DDR3

- **Memory Type:** DDR3L (Double Data Rate Type 3, Low Voltage) - **Form Factor:** SO-DIMM (Small Outline Dual Inline Memory Module) - **Capacity:** 4GB (Gigabytes) - **Operating Voltage:** 1.35V (Low Voltage, energy-efficient) - **Compatibility:** Backward compatible with standard DDR3 (1.5V) systems that support DDR3L - **Speed Grades:** Typically supports DDR3L-1333, DDR3L-1600, or DDR3L-1866 MHz (depending on system configuration) - **Data Transfer Rate:** Up to 12.8 GB/s (for DDR3L-1600) - **Error Correction:** Non-ECC (unbuffered) - **Pin Count:** 204-pin SO-DIMM interface - **Latency:** CL9–CL11 (varies by configuration and manufacturer) - **Low Power Consumption:** Reduced voltage operation minimizes heat generation and extends battery life in portable devices - **Compact Design:** Optimized for laptops, mini-PCs, and embedded systems with limited space - **Plug-and-Play Installation:** Automatically detected and configured by most modern BIOS/UEFI systems

Manufacturer: Intel

Category: RAM DDR3L

- **Memory Type:** DDR3L (Double Data Rate 3 Low Voltage) - **Form Factor:** SO-DIMM (Small Outline Dual Inline Memory Module) - **Capacity:** 4 GB - **Voltage:** 1.35 V nominal operating voltage (backward compatible with 1.5 V systems depending on platform support) - **Extended Temperature Range:** –20°C to +70°C operational range for industrial and embedded environments - **Low Power Consumption:** Optimized for energy-efficient systems, reducing heat generation and power draw - **High Reliability:** Designed for continuous operation in demanding conditions, with robust signal integrity and thermal stability - **Compact Design:** SO-DIMM form factor ideal for space-constrained systems such as industrial PCs, embedded controllers, and compact computing platforms - **Compatibility:** Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of DDR3L-compatible chipsets and processors - **Enhanced Thermal Tolerance:** Built using high-quality DRAM components screened for extended temperature performance - **Plug-and-Play Installation:** Standard 204-pin SO-DIMM interface for easy integration into compatible systems

Manufacturer: Intel

Category: RAM DDR3L

- **Memory Type:** DDR3L SDRAM (Double Data Rate 3 Low Voltage) - **Form Factor:** 204-pin SO-DIMM (Small Outline Dual Inline Memory Module) - **Capacity:** 8GB total memory - **Operating Voltage:** 1.35V (DDR3L low-voltage standard) - **Temperature Range:** Extended industrial range from **–20°C to +70°C** - **Low Power Consumption:** Optimized for energy efficiency and reduced heat generation - **High Compatibility:** Designed for systems supporting DDR3L SO-DIMM modules - **Stable Performance:** Engineered for continuous operation in demanding environments - **Compact Design:** Ideal for space-constrained embedded and mobile systems - **Enhanced Reliability:** Built with industrial-grade components for long-term stability The 4GB-DDR3L-WT module’s unique selling points include its extended temperature tolerance, low-voltage operation, and industrial-grade reliability. These characteristics make it suitable for mission-critical applications where standard consumer memory would fail due to environmental stress or thermal variation.

Manufacturer: Intel

Category: RAM DDR3L

- **High-Capacity Memory Module:** 8GB of DDR3L SDRAM capacity, suitable for multitasking, data-intensive applications, and system upgrades. - **Low Voltage Operation (1.35V):** Designed for energy efficiency, reducing power draw and heat generation, ideal for laptops and compact systems. - **SO-DIMM Form Factor:** 204-pin small outline dual in-line memory module (SO-DIMM) format, compatible with most modern notebooks and small form factor PCs. - **DDR3L Technology:** Double Data Rate Type 3 Low Voltage (DDR3L) memory, offering improved bandwidth and lower power consumption compared to DDR2. - **High Data Transfer Rate:** Supports standard DDR3L data rates up to 1600 MT/s (megatransfers per second), depending on system configuration. - **Backward Compatibility:** Compatible with systems supporting DDR3L and, in many cases, dual-voltage DDR3/DDR3L operation. - **JEDEC-Compliant Design:** Fully compliant with JEDEC DDR3L specifications for interoperability and reliability. - **Stable and Reliable Performance:** Built with high-quality DRAM chips and tested for stability under extended workloads. - **Plug-and-Play Upgrade:** No additional configuration required; automatically recognized by compatible systems. - **Optimized for Mobile and Embedded Systems:** Ideal for notebooks, mini-PCs, industrial controllers, and embedded computing platforms.

Manufacturer: Intel

Category: RAM DDR3L