- **Integrated Rockwell GPS Engine:** Utilizes a Rockwell GPS chipset known for high sensitivity, low power consumption, and reliable satellite acquisition. - **PC/104 Form Factor:** Fully compliant with the PC/104 standard, allowing direct stacking with other PC/104 modules without the need for external cabling. - **High-Precision Positioning:** Provides accurate latitude, longitude, altitude, and velocity data suitable for navigation and tracking applications. - **Fast Time-to-First-Fix (TTFF):** Rapid satellite acquisition and reacquisition, ensuring minimal delay in obtaining position data after startup or signal loss. - **Industrial-Grade Design:** Built for continuous operation in harsh environments, with extended temperature tolerance and vibration resistance. - **Low Power Consumption:** Optimized for embedded systems where power efficiency is critical. - **Standard Communication Interfaces:** Typically supports serial (RS-232 or TTL-level) communication for easy integration with host systems. - **Timing Output:** Provides precise timing signals for synchronization of external systems or network time servers. - **Compact and Modular:** Small footprint allows integration into space-constrained systems. - **Upgradeable Firmware:** Supports firmware updates for improved performance and compatibility.

Manufacturer: No category

Category: PC/104

- **Multi-Port Serial Communication:** Available in two- or four-port configurations, each port independently selectable for RS-232 or RS-422/485 operation. - **High Electrical Isolation:** Each port is optically isolated up to **3.0 kV AC peak-to-peak**, **3.0 kV DC**, and **2.1 kV AC RMS**, ensuring protection against ground loops and electrical surges. - **High-Speed Data Transfer:** Supports baud rates up to **460.8 Kbps** for RS-422/485 and **230.4 Kbps** for RS-232. Custom baud rates are also supported. - **Advanced UART Technology:** Equipped with **16C2850 dual UARTs**, each providing **128-byte TxD/RxD FIFO buffers** for efficient data handling and reduced CPU overhead. - **Flexible Communication Modes:** Supports **Full Duplex**, **Half Duplex with automatic TxD echo cancellation**, and **Multi-drop Slave** modes for RS-422/485 operation. - **Jumper-Selectable Configuration:** - Electrical interface per port (RS-232 or RS-422/485) - Termination resistors (120 Ω) - I/O addresses (eight predefined sets) - IRQ lines (3, 4, 5, 6, 7, 9/2, 10, 11, 12, 14, 15) - Baud rate oscillator selection (1× or 4×) - **Software Compatibility:** Fully compatible with standard PC serial port drivers and major operating systems including **Windows**, **Linux**, **QNX**, **SCO Unix**, and **Solaris**. - **Industrial-Grade Design:** Built to withstand harsh environments with extended temperature options and robust optical isolation. - **Ease of Integration:** PC/104 form factor ensures stackable integration with embedded systems. Comprehensive documentation and driver support simplify setup.

Manufacturer: Connecttech

Category: PC/104

- **Multi‑port flexibility:** Two or four asynchronous serial ports, each independently configurable as RS‑232 or RS‑422/485 via onboard jumpers. - **High isolation:** Optical isolation per port rated at 3.0 kV AC p‑p, 3.0 kV DC, and 2.1 kV AC RMS on all signal lines, protecting host systems from ground loops and electrical transients. - **High‑speed communication:** Supports baud rates up to 230.4 Kbps (RS‑232) and 460.8 Kbps (RS‑422/485), with custom baud rates available. - **Advanced UART architecture:** Each port is controlled by a 16C2850 UART providing 128‑byte transmit and receive FIFO buffers, reducing CPU overhead and improving throughput. - **Multiple RS‑422/485 modes:** Full Duplex, Half Duplex with automatic TxD echo cancellation, and Multi‑drop Slave operation. - **Selectable termination:** Each RS‑422/485 channel includes jumper‑selectable 120 Ω termination resistors for proper line matching. - **Configurable I/O and interrupts:** Eight predefined I/O address sets and selectable IRQ lines (3, 4, 5, 6, 7, 9/2, 10, 11, 12, 14, 15). Boards can operate on one, two, or four interrupts. - **Independent port configuration:** Each port supports independent baud rate, parity, data bits (5–8), and stop bits (1, 1.5, 2). - **Software compatibility:** Fully compatible with standard PC serial port drivers; supports DOS, Linux, QNX, SCO Unix, Solaris, and Windows 95/98/Me/CE/CE .NET/NT/2000/XP. - **Industrial reliability:** Designed for harsh environments with extended temperature options and robust optical isolation. - **Ease of integration:** PC/104 form factor with ISA‑bus compatibility, comprehensive documentation, and driver support.

Manufacturer: Connecttech

Category: PC/104

- **Architecture:** 3rd Generation Intel® Core™ (Ivy Bridge) - **Socket Type:** PGA988 / Socket G2 - **Core Configuration:** Dual-core, four-thread processor with Intel® Hyper-Threading Technology - **Base Clock Frequency:** 2.4 GHz - **Integrated Graphics:** Intel® HD Graphics 4000 with dynamic frequency scaling - **Process Technology:** 22nm tri-gate transistor technology for improved energy efficiency - **Thermal Design Power (TDP):** 35 Watts - **Memory Support:** Dual-channel DDR3/DDR3L memory up to 1600 MHz - **Embedded Lifecycle Support:** Extended availability for embedded and industrial applications - **Virtualization Support:** Intel® Virtualization Technology (VT-x) and Intel® VT-d for hardware-assisted virtualization - **Security Features:** Intel® AES New Instructions (AES-NI), Intel® Secure Key, and Execute Disable Bit for enhanced data protection - **Graphics Capabilities:** Support for DirectX 11, OpenGL 4.0, and OpenCL 1.1; capable of driving multiple displays - **Integrated Media Engine:** Hardware acceleration for HD video playback and encoding - **Energy Efficiency:** Optimized power management with Intel® SpeedStep® and Deep Power Down (C-states)

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i3-6100 Processor, 3M Cache - 3.70 GHz, TDP:65W

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** Based on Intel’s 14 nm Skylake microarchitecture, offering improved performance-per-watt and enhanced integrated graphics compared to previous generations. - **Core Configuration:** Dual-core, four-thread processor with Intel® Hyper-Threading Technology, enabling efficient parallel processing for multitasking workloads. - **Clock Speed:** Fixed base frequency of 2.70 GHz, optimized for consistent performance in thermally constrained environments. - **Cache:** 4 MB Intel® Smart Cache shared dynamically between cores for faster data access and reduced latency. - **Integrated Graphics:** Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, with a base frequency of 350 MHz and a maximum dynamic frequency up to 1.00 GHz. - **Memory Support:** Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for both legacy and modern systems. - **Thermal Design Power (TDP):** 35 W, making it suitable for compact and fanless systems where thermal efficiency is critical. - **Socket Compatibility:** LGA 1151 socket, compatible with Intel® 100-series chipsets (e.g., H110, Q170, B150, H170). - **Virtualization Support:** Intel® VT-x and VT-d technologies for hardware-assisted virtualization and efficient resource allocation in virtualized environments. - **Security Features:** Intel® AES-NI for accelerated encryption, Intel® Secure Key, and Intel® OS Guard for enhanced data protection and system integrity. - **Display Capabilities:** Supports up to three independent displays with resolutions up to 4096x2304 @ 60 Hz via DisplayPort or HDMI. - **Energy Efficiency:** Optimized for low-power embedded and industrial applications, maintaining performance while minimizing heat output.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** 3rd Generation Intel® Core™ (Ivy Bridge) - **Core Configuration:** Dual-core with four threads (2 cores / 4 threads) via Intel® Hyper-Threading Technology - **Base Clock Speed:** 2.7 GHz - **Max Turbo Frequency:** Up to 3.3 GHz with Intel® Turbo Boost Technology 2.0 - **Integrated Graphics:** Intel® HD Graphics 4000 with dynamic frequency scaling - **Graphics Base Frequency:** 650 MHz - **Graphics Max Dynamic Frequency:** Up to 1.1 GHz - **Cache:** 3 MB Intel® Smart Cache shared between cores - **Instruction Set:** 64-bit, supporting Intel® SSE4.1/4.2 and AVX instructions - **Thermal Design Power (TDP):** 35 watts - **Socket Type:** G2 / rPGA988B - **Process Technology:** 22 nm tri-gate transistor technology - **Memory Support:** Dual-channel DDR3/DDR3L memory up to 1600 MHz - **Embedded Lifecycle Support:** Extended availability for embedded and industrial markets - **Virtualization Support:** Intel® VT-x and VT-d for hardware-assisted virtualization - **Security Features:** Intel® AES-NI, Intel® Secure Key, Intel® Trusted Execution Technology (TXT) - **Power Management:** Enhanced Intel® SpeedStep® Technology, Thermal Monitoring, and configurable TDP options The i5-3610ME is engineered for embedded computing environments requiring high reliability, long-term availability, and consistent performance under extended operating conditions.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i5-520M Processor, 3M Cache - 2.40 GHz up to 2.93GHz

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i5-6500 Processor, 6M Cache - up to 3.60 GHz, TDP:65W

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Quad-Core Architecture:** The i5-6500TE features four physical cores and supports four threads, providing robust multitasking and parallel processing performance for industrial and embedded workloads. - **Base and Turbo Frequencies:** Operates at a base frequency of 2.3 GHz with Intel® Turbo Boost Technology 2.0 enabling dynamic acceleration up to 3.3 GHz for demanding tasks. - **Integrated Graphics:** Equipped with Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, enabling smooth rendering for 2D/3D graphics, video playback, and light gaming or visualization workloads. - **Cache Memory:** 6 MB Intel® Smart Cache shared dynamically among cores to improve data access speed and reduce latency. - **Thermal Design Power (TDP):** Optimized 35 W TDP for energy-efficient operation in thermally constrained environments such as fanless or small-form-factor systems. - **Memory Support:** Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for various system configurations. - **Virtualization and Security:** Supports Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT), and Intel® Software Guard Extensions (SGX) for secure and isolated computing environments. - **Advanced Power Management:** Features Intel® SpeedStep® Technology and power gating for dynamic power optimization. - **Embedded Lifecycle Support:** Designed for embedded and industrial markets with extended availability and reliability.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Quad-Core Architecture:** Four physical cores with Hyper-Threading Technology, supporting up to eight simultaneous threads for enhanced multitasking and parallel processing. - **Base and Turbo Frequencies:** Operates at a base clock speed of 2.3 GHz with Intel® Turbo Boost Technology 2.0 enabling dynamic frequency scaling up to 3.3 GHz for demanding workloads. - **Ivy Bridge Microarchitecture:** Built on Intel’s 22nm process technology featuring 3D Tri-Gate transistors for improved performance-per-watt efficiency compared to previous generations. - **Integrated Graphics:** Intel® HD Graphics 4000 integrated GPU with support for DirectX 11, OpenGL 4.0, and OpenCL 1.1, enabling advanced visual performance without the need for a discrete GPU. - **Embedded Platform Support:** Part of Intel’s embedded product line with extended availability and lifecycle support, ideal for industrial, medical, and military-grade systems. - **Virtualization and Security:** Supports Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT), and Intel® AES New Instructions (AES-NI) for secure and efficient virtualization and encryption. - **Memory Support:** Dual-channel DDR3/DDR3L memory controller supporting up to 32 GB of system memory at speeds up to 1600 MHz. - **Thermal Design Power (TDP):** 45 watts, optimized for performance in thermally constrained environments. - **Socket Compatibility:** Designed for Socket G2 (rPGA988B) platforms, ensuring compatibility with a wide range of embedded and mobile motherboards.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** Based on Intel’s 22nm Ivy Bridge microarchitecture, offering improved performance-per-watt compared to the previous Sandy Bridge generation. - **Core Configuration:** Quad-core design with Hyper-Threading Technology, enabling up to eight simultaneous processing threads for enhanced multitasking. - **Clock Speed:** Base frequency of 2.30 GHz with Intel® Turbo Boost Technology 2.0 allowing dynamic acceleration up to 3.30 GHz depending on workload and thermal conditions. - **Integrated Graphics:** Intel® HD Graphics 4000 integrated GPU, supporting DirectX 11, OpenGL 4.0, and Intel® Quick Sync Video for hardware-accelerated media encoding and decoding. - **Cache Memory:** 6 MB Intel® Smart Cache shared dynamically among cores for optimized data access and reduced latency. - **Thermal Design Power (TDP):** 45 watts, balancing high performance with efficient thermal management for mobile platforms. - **Instruction Set Support:** 64-bit instruction set with support for Intel® SSE4.1, SSE4.2, and AVX instruction extensions for enhanced computational performance. - **Virtualization and Security:** Includes Intel® Virtualization Technology (VT-x), Intel® Virtualization Technology for Directed I/O (VT-d), and Intel® Trusted Execution Technology (TXT) for secure and efficient virtualized environments. - **Memory Support:** Dual-channel DDR3/DDR3L memory controller supporting up to 32 GB of system memory at speeds up to 1600 MHz. - **Advanced Power Management:** Intel® Enhanced SpeedStep® Technology and Deep Power Down (C-states) for optimized energy efficiency.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i7-620M Processor, 4M Cache - 2.66 GHz up to 3.33GHz

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Core i7-6700 Processor, 8M Cache - up to 4.00 GHz, TDP:65W

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** 6th Generation Intel® Core™ (Skylake) microarchitecture - **Core/Thread Count:** 4 cores / 8 threads with Intel® Hyper-Threading Technology - **Base Frequency:** 2.40 GHz - **Max Turbo Frequency:** Up to 3.40 GHz with Intel® Turbo Boost Technology 2.0 - **Cache:** 8 MB Intel® Smart Cache shared dynamically among cores - **Thermal Design Power (TDP):** 35 W, optimized for low-power embedded and industrial systems - **Integrated Graphics:** Intel® HD Graphics 530 with dynamic frequency scaling up to 1.05 GHz - **Memory Support:** Dual-channel DDR4-2133 / DDR3L-1600 memory support - **Socket Type:** LGA 1151 - **Manufacturing Process:** 14 nm lithography - **Instruction Set:** 64-bit with Intel® SSE4.1/4.2, AVX2, and Intel® VT-x/VT-d virtualization support - **Security Features:** Intel® AES-NI, Intel® Secure Key, Intel® OS Guard, Intel® Trusted Execution Technology (TXT), and Intel® Boot Guard - **Embedded Options Available:** Yes – designed for long lifecycle embedded applications - **Graphics APIs Supported:** DirectX 12, OpenGL 4.4, OpenCL 2.0 - **Display Support:** Up to three independent displays via DisplayPort, HDMI, DVI, or eDP interfaces The i7-6700TE’s key differentiator lies in its combination of high performance and low thermal output, enabling system designers to integrate it into compact or fanless systems without sacrificing computational capability.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

Intel Celeron 1020E Socket G2 Processor,2.2GHz.

Manufacturer: Intel

Category: CPU Embedded Celeron Pentium

- **Dual-Core Architecture:** Two physical cores with two threads, based on Intel’s 14 nm Skylake microarchitecture, delivering efficient multitasking and stable performance for embedded workloads. - **Base Frequency:** 2.40 GHz fixed clock speed, optimized for consistent operation in thermally constrained environments. - **Cache Memory:** 3 MB Intel® Smart Cache shared between cores, improving data access latency and throughput. - **Integrated Graphics:** Intel® HD Graphics 510 with support for DirectX 12, OpenGL 4.4, and OpenCL 2.0, enabling hardware-accelerated video decoding and multi-display output. - **Low Power Design:** 35 W TDP (Thermal Design Power), suitable for fanless or small form factor systems. - **Memory Support:** Dual-channel DDR4/DDR3L memory controller supporting DDR4-2133 or DDR3L-1600 memory modules, up to 64 GB total capacity. - **Socket Compatibility:** LGA1151 socket, compatible with Intel® 100 Series chipsets (e.g., H110, Q170, B150). - **Virtualization Support:** Intel® Virtualization Technology (VT-x) and Intel® VT-d for efficient virtual machine management. - **Security Features:** Intel® Execute Disable Bit, Intel® Secure Key, and Intel® OS Guard for enhanced system protection. - **Embedded Lifecycle Support:** Designed for long-term availability and reliability in embedded and industrial environments.

Manufacturer: Intel

Category: CPU Embedded Celeron Pentium

Intel Celeron Processor P4500, 2M Cache - 1.86 GHz

Manufacturer: Intel

Category: CPU Embedded Celeron Pentium

SO-DIMM DDR3 4GB

Manufacturer: Intel

Category: RAM DDR3

- **Memory Type:** DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory) - **Form Factor:** SO-DIMM (Small Outline Dual In-line Memory Module) - **Capacity:** 4 GB - **Extended Temperature Range:** –20°C to +70°C, ensuring stable operation in harsh or variable environmental conditions - **High Reliability:** Designed for continuous operation in industrial and embedded systems where uptime and stability are critical - **Low Power Consumption:** DDR3 technology provides improved energy efficiency compared to DDR2, reducing thermal output and power draw - **Compact Design:** SO-DIMM form factor optimized for space-constrained systems such as industrial PCs, embedded controllers, and compact servers - **High Data Throughput:** Supports standard DDR3 data rates (commonly 1066, 1333, 1600 MT/s depending on system configuration) - **Compatibility:** Fully compliant with JEDEC DDR3 standards, ensuring interoperability with a wide range of industrial motherboards and embedded platforms - **Error-Free Operation:** Manufactured using high-quality DRAM chips and tested for data integrity under extended temperature conditions - **RoHS Compliant:** Environmentally friendly design meeting Restriction of Hazardous Substances directives

Manufacturer: Intel

Category: RAM DDR3

- **Extended Temperature Range:** Operates reliably from **–20°C to +70°C**, making it suitable for harsh or thermally challenging environments. - **High Capacity:** Provides **8GB** of DDR3 SDRAM memory capacity in a compact SO-DIMM form factor. - **DDR3 Technology:** Utilizes **DDR3 SDRAM** architecture for improved bandwidth, lower power consumption, and enhanced data transfer efficiency compared to DDR2. - **SO-DIMM Form Factor:** Compact 204-pin design optimized for space-constrained systems such as embedded boards, industrial PCs, and portable devices. - **Industrial-Grade Components:** Built using high-quality DRAM chips and PCB materials rated for extended temperature operation and long-term reliability. - **Low Power Consumption:** Operates at standard DDR3 voltage levels (typically 1.5V), offering efficient power usage for embedded and mobile applications. - **High Data Transfer Rates:** Supports standard DDR3 data rates (commonly 1066, 1333, or 1600 MT/s depending on system configuration). - **Compatibility:** Fully compliant with JEDEC DDR3 SO-DIMM standards, ensuring broad compatibility with industrial motherboards, embedded systems, and single-board computers. - **Long-Term Availability:** Designed for industrial and embedded markets where product longevity and consistent supply are critical. - **Error-Free Operation:** Non-ECC configuration suitable for systems that do not require error correction but demand stable, consistent performance.

Manufacturer: Intel

Category: RAM DDR3

SO-DIMM DDR3 8GB

Manufacturer: Intel

Category: RAM DDR3

- **Memory Type:** DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory) - **Form Factor:** SO-DIMM (Small Outline Dual Inline Memory Module) - **Capacity:** 4GB - **Operating Temperature Range:** -40°C to +85°C (wide temperature range suitable for industrial environments) - **Voltage:** Standard DDR3 operating voltage (typically 1.5V; low-voltage variants may operate at 1.35V depending on configuration) - **Data Rate:** Supports DDR3 standard frequencies (commonly 1066 MHz, 1333 MHz, 1600 MHz depending on system compatibility) - **Error Correction:** Non-ECC (standard) or ECC (optional, depending on variant) - **Compatibility:** Designed for systems supporting DDR3 SO-DIMM slots, including industrial PCs, embedded controllers, and compact computing platforms - **Reliability:** Built with high-quality DRAM chips screened for extended temperature operation and long-term stability - **Compliance:** JEDEC-compliant design ensuring interoperability and standardization across DDR3 platforms - **Durability:** Designed for continuous operation in environments with temperature extremes, vibration, and humidity variations **Unique Selling Points:** - Wide temperature tolerance (-40°C to +85°C) for industrial and outdoor use - Compact SO-DIMM form factor ideal for space-constrained embedded systems - High reliability and endurance for mission-critical applications - Fully compliant with DDR3 JEDEC standards for broad compatibility - Optimized for low power consumption and stable performance under thermal stress

Manufacturer: Intel

Category: RAM DDR3

- **Wide Temperature Range:** Fully operational from **–40°C to +85°C**, ensuring stable performance in both extreme cold and high-heat environments. - **High Capacity:** 8GB of DDR3 SDRAM, suitable for memory-intensive industrial and embedded applications. - **SO-DIMM Form Factor:** Compact 204-pin design optimized for space-constrained systems such as industrial PCs, edge devices, and embedded controllers. - **DDR3 Technology:** Utilizes DDR3 SDRAM architecture for improved bandwidth, lower power consumption, and enhanced data integrity compared to DDR2. - **Low Power Operation:** Typically operates at **1.5V** (standard DDR3 voltage), reducing thermal output and energy consumption. - **High Reliability Components:** Built using industrial-grade DRAM chips and PCB materials for long-term stability and endurance. - **Error-Free Data Transmission:** Designed for robust signal integrity and consistent data throughput in electrically noisy environments. - **Compatibility:** Fully compliant with JEDEC DDR3 SO-DIMM standards, ensuring interoperability with a wide range of industrial and embedded platforms. - **Rugged Design:** Resistant to vibration, shock, and thermal cycling, making it ideal for mission-critical and field-deployed systems.

Manufacturer: Intel

Category: RAM DDR3

- **Memory Type:** DDR3L (Double Data Rate Type 3, Low Voltage) - **Form Factor:** SO-DIMM (Small Outline Dual Inline Memory Module) - **Capacity:** 4GB (Gigabytes) - **Operating Voltage:** 1.35V (Low Voltage, energy-efficient) - **Compatibility:** Backward compatible with standard DDR3 (1.5V) systems that support DDR3L - **Speed Grades:** Typically supports DDR3L-1333, DDR3L-1600, or DDR3L-1866 MHz (depending on system configuration) - **Data Transfer Rate:** Up to 12.8 GB/s (for DDR3L-1600) - **Error Correction:** Non-ECC (unbuffered) - **Pin Count:** 204-pin SO-DIMM interface - **Latency:** CL9–CL11 (varies by configuration and manufacturer) - **Low Power Consumption:** Reduced voltage operation minimizes heat generation and extends battery life in portable devices - **Compact Design:** Optimized for laptops, mini-PCs, and embedded systems with limited space - **Plug-and-Play Installation:** Automatically detected and configured by most modern BIOS/UEFI systems

Manufacturer: Intel

Category: RAM DDR3L