Comprehensive Product Summary: ADLINK cPCIS‑1101R CompactPCI Chassis

---

### 1. Product Overview

Product Name: cPCIS‑1101R
Model / Article Number: cPCIS‑1101R
Series: cPCIS‑1000 Series (3U CompactPCI Sub‑systems)
Manufacturer: ADLINK Technology Inc.
Product Type: 19‑inch 3U CompactPCI rear I/O chassis with integrated power supply
Description: 19″ rack‑mount 3U CompactPCI chassis featuring eight slots (seven free CompactPCI slots plus one system slot) in a rear I/O configuration, equipped with a 300 W ATX power supply.
Manufacturer Contact:
ADLINK Technology Inc., 9F, No. 166, Jian Yi Road, Chungho City, Taipei 235, Taiwan, R.O.C.
Tel: +886‑2‑82265877 Fax: +886‑2‑82265717 Web: [www.adlinktech.com](http://www.adlinktech.com)

---

### 2. Key Features

- CompactPCI 3U Form Factor: Fully compliant with PICMG 2.0 R2.1 CompactPCI mechanical and electrical standards.
- Rear I/O Configuration: Supports rear I/O connectivity through compatible backplanes (e.g., cBP‑3208R).
- Eight‑Slot Architecture: Provides one system slot and seven peripheral slots for I/O or CPU modules.
- Integrated Power Supply: Includes a 300 W ATX power supply (APS‑925A or equivalent) mounted via the cPCI‑PSF frame.
- High‑Quality Aluminum Construction: Lightweight yet rigid chassis ensuring mechanical stability and EMI shielding.
- External Cooling Support: Designed for use with an external fan or forced‑air cooling system to maintain optimal thermal performance.
- Rack‑Mountable 19″ Width: Standard 19‑inch rack‑mount design suitable for industrial and laboratory environments.
- Comprehensive EMC Shielding: Front and rear rails equipped with EMC gaskets to minimize electromagnetic interference.
- Modular Design: Compatible with ADLINK’s range of CompactPCI backplanes, power supplies, and mechanical accessories.
- Serviceability: Modular sub‑system design allows easy replacement of power supply, backplane, or drive bay components.

---

### 3. Technical Specifications

| Parameter | Specification |
|----------------|-------------------|
| Form Factor | 19″ rack‑mount, 3U height |
| Configuration | Rear I/O, 8‑slot (7 free slots + 1 system slot) |
| Chassis Dimensions | 245 mm (D) × 482.6 mm (W) × 129.4 mm (H) |
| Material | Aluminum alloy chassis with EMC shielding |
| Cooling | External fan recommended (no internal fans) |
| Power Supply | 300 W ATX (APS‑925A or equivalent) |
| Power Input | Auto‑switching 90–264 VAC, 47–63 Hz |
| Output Voltages | +3.3 V @ 15 A, +5 V @ 30 A, +12 V @ 15 A, −5 V @ 1 A, −12 V @ 1 A, +5 VSB @ 1.2 A |
| Backplane Compatibility | cBP‑3200 Series (32‑bit CompactPCI with rear I/O) |
| Operating Temperature | 0 °C – 70 °C (with adequate airflow) |
| Storage Temperature | −40 °C – +85 °C |
| Relative Humidity | < 95 % @ 40 °C, non‑condensing |
| Weight | Approx. 4.5 – 5 kg (including PSU) |
| Mounting | Rack‑mount brackets or desktop operation with optional stands |
| EMC Protection | Front/rear EMC gaskets, conductive side panels |

---

### 4. Functionality

The cPCIS‑1101R serves as a CompactPCI system enclosure designed to host 3U CompactPCI CPU and I/O boards in industrial control, automation, and embedded computing applications. It provides mechanical housing, power distribution, and signal backplane interconnection for CompactPCI modules.

Operation Principle:
- The chassis houses a CompactPCI backplane (typically cBP‑3208R) that interconnects the system CPU slot with up to seven peripheral I/O slots.
- The integrated ATX power supply delivers regulated DC voltages (+3.3 V, +5 V, ±12 V) to the backplane.
- Rear I/O capability allows signal routing through the backplane’s P2 connectors to rear transition modules.
- External fans or rack‑level cooling maintain airflow through the card cage.

Typical Applications:
- Industrial automation controllers
- Data acquisition and measurement systems
- Telecommunications and network test equipment
- Embedded computing platforms requiring rear I/O access
- Laboratory instrumentation and system integration testbeds

Compatibility:
- Fully compatible with ADLINK CompactPCI backplanes (cBP‑3200, cBP‑3208R, cBP‑3100 series).
- Supports standard 3U CompactPCI CPU boards and peripheral modules compliant with PICMG 2.0.
- Power interface compatible with ATX and PS2‑type supplies via cPCI‑PSF frame.

---

### 5. Components & Accessories

Included Components:
- cPCIS‑1101R aluminum chassis (3U, 19″ rack‑mount)
- 300 W ATX power supply (APS‑925A or equivalent)
- Rear I/O backplane (typically cBP‑3208R, 8‑slot, 32‑bit CompactPCI)
- Power supply frame (cPCI‑PSF) for PS2‑size PSU mounting
- EMC slot panels for unused slots
- Mounting brackets for rack installation

Optional Accessories:
- Drive Bay Frame (cPCI‑DBF): Supports two 5¼″ and one 3½″ drives.
- Redundant Power Supply Units: cPS‑150R (175 W, 31‑pin) or cPS‑175 series (175 W, 47‑pin).
- Backplane Variants:
- cBP‑3208 (front I/O)
- cBP‑3208R (rear I/O)
- cBP‑3400 series (64‑bit)
- LCD Kit (cPCI‑LCD): 6.4″ TFT display module for front‑panel integration.
- Slot Panels: cPCI‑SP3E 4 HP panels with EMC gaskets for unused slots.
- Cooling Accessories: External 12 V DC brushless fans or rack‑level forced‑air modules.

Connectors:
- Standard ATX 20‑pin power connector on backplane
- Screw terminals for auxiliary DC input/output
- Rear I/O connectors per CompactPCI P2 standard

---

### 6. Installation & Setup

Requirements:
- Standard 19″ rack or desktop environment with adequate ventilation.
- External cooling fans providing at least 15 CFM airflow across the card cage.
- AC mains supply 90–264 VAC, 47–63 Hz.

Mounting Options:
- Rack‑mount using supplied brackets (482.6 mm width).
- Desktop operation with optional adjustable foot stands.

Configuration Steps:
1. Install the CompactPCI backplane (e.g., cBP‑3208R) into the chassis card cage.
2. Mount the ATX power supply into the cPCI‑PSF frame and connect to the backplane’s ATX connector (CN1).
3. Insert CPU and I/O boards into the CompactPCI slots, ensuring correct keying and alignment.
4. Connect rear I/O transition modules if required.
5. Attach external fans or connect to rack cooling system.
6. Connect AC mains to the PSU and verify power LED indicators.
7. Power‑on sequence: ensure PS_ON signal (pin 14 of ATX connector) is grounded to enable DC outputs.

Safety Notes:
- Ensure backplane connectors conform to PICMG 2.11 standards (ERNI #914374 or AMP #148370‑1).
- Improper insertion of power modules may damage connectors.
- Always disconnect AC power before installing or removing modules.

---

### 7. Performance & Capabilities

Electrical Performance:
- Power Output: 300 W continuous at 40 °C ambient.
- Efficiency: ≥ 65 % at nominal line and rated load.
- Hold‑Up Time: ≥ 20 ms at 115 VAC input.
- Ripple & Noise: < 50 mV p‑p on +5 V and +3.3 V rails; < 100 mV p‑p on others.
- Line Regulation: ±1 % for ±10 % input variation.
- Load Regulation: ±3 % (+5 V), ±2 % (+3.3 V), ±5 % (+12 V).
- Protection: Over‑voltage, over‑current, short‑circuit, and thermal shutdown with automatic recovery.

Thermal & Mechanical Performance:
- Designed for continuous operation at 0–40 °C full load with forced air.
- Aluminum chassis provides efficient heat dissipation.
- External fan recommended for sustained high‑load operation.

Capacity & Expandability:
- Supports up to eight CompactPCI boards (one system + seven I/O).
- Rear I/O capability enables high‑density signal routing without front‑panel congestion.
- Optional redundant PSU backplanes (cBP‑3052E or cBP‑3062) allow dual‑supply configurations.

Limitations:
- No internal fans; external airflow required.
- 3U height limits use to 3U CompactPCI modules only.
- Total power consumption of installed modules must not exceed 300 W.

---

### 8. Standards & Compliance

Industry Standards:
- CompactPCI: PICMG 2.0 R2.1 mechanical/electrical compliance.
- Power Interface: PICMG 2.11 (31‑pin or 47‑pin PSU interface).
- EMC: EN55022 Class A/B, FCC Part 15 Class A/B (depending on PSU).
- Safety: UL 1950, CSA C22.2 No. 950, EN 60950/TÜV certified power supply.
- Environmental: Designed for industrial operating range (0–70 °C, 95 % RH).
- RoHS/CE: Conforms to CE marking requirements for EMI/EMS (EN61000‑3‑2, EN61000‑3‑3, EN50082‑2).

Mechanical Standards:
- 19″ rack‑mount width per IEC 60297.
- 3U height (133.35 mm) per CompactPCI mechanical specification.
- Slot pitch 4 HP (20.32 mm) per module.

---

### 9. Additional Information

Warranty:
One‑year limited warranty covering defects in materials and workmanship from the date of purchase. Warranty excludes damage due to misuse, modification, or operation beyond specified limits. Proof of purchase required for service.

Support & Service:
ADLINK provides global technical support and service through regional offices and email contacts:
- General Service: service@adlink.com.tw
- NuIPC Product Support: nuipc@adlink.com.tw
- Web Resources: [www.adlinktech.com](http://www.adlinktech.com)

Maintenance:
- Periodically inspect and clean air filters and fan assemblies.
- Ensure all module connectors are free of dust and properly seated.
- Replace power supply if output voltages deviate beyond tolerance.
- Verify grounding and EMC gaskets for continued shielding effectiveness.

Firmware/Hardware Updates:
As a passive chassis, the cPCIS‑1101R itself requires no firmware updates. System functionality depends on installed CompactPCI CPU and I/O modules, which may have their own update procedures.

Serviceability:
Modular design allows quick replacement of PSU, backplane, or mechanical sub‑assemblies without specialized tools. All internal components are accessible from the front or rear after removing slot panels.

Environmental Considerations:
Constructed from recyclable aluminum and compliant with ADLINK’s environmental manufacturing policies. Operates reliably in industrial environments with proper cooling and grounding.

---

### Summary

The ADLINK cPCIS‑1101R is a robust, modular 3U CompactPCI chassis engineered for industrial and embedded computing applications requiring rear I/O connectivity and high reliability. Its eight‑slot backplane capacity, 300 W ATX power supply, and standard 19″ rack‑mount form factor make it ideal for system integrators building CompactPCI platforms for automation, data acquisition, or telecommunications. The chassis adheres to PICMG 2.0 and 2.11 standards, ensuring full interoperability with CompactPCI boards and redundant power modules. With its aluminum construction, EMC shielding, and modular accessory ecosystem, the cPCIS‑1101R delivers a durable, serviceable foundation for high‑performance industrial computing systems.