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- Processor Platform: 6th Generation Intel® Core™ i3‑6100TE (Skylake) dual‑core CPU, 2.7 GHz, 4 MB L3 cache.
- Chipset: Intel® H110 Platform Controller Hub.
- Memory: Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (4 GB standard).
- Graphics: Integrated Intel® HD Graphics 530 with support for up to three independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
- Fanless Design: Completely fanless thermal solution for silent operation and high reliability in dusty or vibration‑prone environments.
- Networking: Three Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN (WOL) support.
- Serial Communication: Four COM ports (2 × software‑selectable RS‑232/422/485 with auto‑flow control, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external ports (1.6 A each), and 1 × internal USB 2.0 (optional).
- Storage Options: 1 × SATA III (6 Gb/s) port for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear‑mounted).
- Expansion: 1 × Mini PCI Express slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE).
- Audio: 1 × Mic‑in, 1 × Line‑out.
- Power Input: Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (with industrial SSD).
- Mounting: Wall‑mount kit included.
- Construction: Compact, industrial‑grade aluminum chassis with front‑accessible I/O.
- Chipset: Intel® H110 Platform Controller Hub.
- Memory: Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (4 GB standard).
- Graphics: Integrated Intel® HD Graphics 530 with support for up to three independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
- Fanless Design: Completely fanless thermal solution for silent operation and high reliability in dusty or vibration‑prone environments.
- Networking: Three Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN (WOL) support.
- Serial Communication: Four COM ports (2 × software‑selectable RS‑232/422/485 with auto‑flow control, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external ports (1.6 A each), and 1 × internal USB 2.0 (optional).
- Storage Options: 1 × SATA III (6 Gb/s) port for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear‑mounted).
- Expansion: 1 × Mini PCI Express slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE).
- Audio: 1 × Mic‑in, 1 × Line‑out.
- Power Input: Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (with industrial SSD).
- Mounting: Wall‑mount kit included.
- Construction: Compact, industrial‑grade aluminum chassis with front‑accessible I/O.
Comprehensive Product Summary – ADLINK MVP‑5003/M4G Fanless Embedded Computer
### 1. Product Overview
Product Name: MVP‑5003/M4G
Model: MVP‑5003
Series: MVP‑5000 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Fanless Embedded Computers
Article Number: MVP‑5003/M4G
Manufacturer: ADLINK Technology, Inc.
Part Number (Manual): 50‑1Z228‑2000
Revision: 2.00 (March 17, 2017)
The ADLINK MVP‑5003/M4G is a rugged, fanless, and expandable embedded computer designed for industrial automation, machine control, and logistics applications. It integrates a 6th Generation Intel® Core™ i3‑6100TE processor with the Intel® H110 chipset, providing a balance of performance, reliability, and cost efficiency. The system is part of ADLINK’s MVP‑5000 series, which includes the MVP‑5001 (Core i7‑6700TE) and MVP‑5002 (Core i5‑6500TE) variants.
### 2. Key Features
- Processor Platform: 6th Generation Intel® Core™ i3‑6100TE (Skylake) dual‑core CPU, 2.7 GHz, 4 MB L3 cache.
- Chipset: Intel® H110 Platform Controller Hub.
- Memory: Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (4 GB standard).
- Graphics: Integrated Intel® HD Graphics 530 with support for up to three independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
- Fanless Design: Completely fanless thermal solution for silent operation and high reliability in dusty or vibration‑prone environments.
- Networking: Three Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN (WOL) support.
- Serial Communication: Four COM ports (2 × software‑selectable RS‑232/422/485 with auto‑flow control, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external ports (1.6 A each), and 1 × internal USB 2.0 (optional).
- Storage Options: 1 × SATA III (6 Gb/s) port for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear‑mounted).
- Expansion: 1 × Mini PCI Express slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE).
- Audio: 1 × Mic‑in, 1 × Line‑out.
- Power Input: Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (with industrial SSD).
- Mounting: Wall‑mount kit included.
- Construction: Compact, industrial‑grade aluminum chassis with front‑accessible I/O.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑6100TE, 2.7 GHz, dual‑core, 4 MB L3 cache |
| Chipset | Intel® H110 |
| Memory | 2 × DDR4 SO‑DIMM 2133 MHz, up to 32 GB (4 GB standard) |
| Graphics | Intel® HD Graphics 530; 2 × DisplayPort (4096 × 2304 @ 60 Hz), 1 × DVI‑D (1920 × 1080 @ 60 Hz), 1 × VGA (1920 × 1200) |
| Ethernet | 3 × Intel® I211AT GbE ports with teaming and WOL |
| Serial Ports | 2 × RS‑232/422/485 (COM1/2, BIOS‑selectable), 2 × RS‑232 (COM3/4) with 2 kV surge protection |
| USB | 4 × USB 3.0 + 2 × USB 2.0 (front) + 1 × internal USB 2.0 (optional) – 1.6 A each |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Expansion | 1 × Mini PCIe slot (Rev. 1.2) with USIM socket |
| Storage | 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear) |
| Power Input | 12 – 24 V DC (3‑pin pluggable connector with latch) |
| Power Consumption | 2.9 W (off), 20.1 W (idle), 41.3 W (full load) @ 24 V DC |
| Dimensions | 220 (W) × 210 (D) × 121 (H) mm (8.67 × 8.27 × 4.77 in.) |
| Weight | 3.6 kg (7.9 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 50 °C (industrial SSD required for full range) |
| Storage Temperature | −40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.4 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB |
### 4. Functionality
The MVP‑5003/M4G operates as a compact, high‑reliability embedded controller for industrial automation. Its fanless design ensures silent, maintenance‑free operation in environments with dust, vibration, or temperature variation. The system’s Intel® Core™ i3 processor and DDR4 memory deliver strong computational performance for control, monitoring, and data acquisition tasks.
Typical Applications:
- Machine and factory automation control systems
- Logistics and warehouse management
- Industrial vision and inspection systems
- Kiosk and digital signage controllers
- Data acquisition and process monitoring
Compatibility:
- Operating Systems: Windows 7 Pro, Windows Embedded Standard 7, Windows 10 IoT Enterprise, Linux (Ubuntu 12.04, Fedora 18 – by request).
- Supports BIOS‑level configuration for serial modes, LAN PXE boot, and USB boot devices.
### 5. Components & Accessories
Included Items:
- MVP‑5003/M4G embedded computer
- Wall‑mount kit and screws
- Accessory pack for HDD/SSD installation
- Quick Start Guide
Optional Accessories:
- DDR4 SO‑DIMM modules (8 GB, 16 GB, 32 GB)
- 2.5″ SSD/HDD or CFast storage (pre‑installed and tested)
- 160 W industrial AC‑DC adapter
- Wireless modules (Wi‑Fi/Bluetooth, 3G, 4G/LTE Mini PCIe with antenna kit)
- DisplayPort adapter cables:
- DP → HDMI (P/N 30‑01119‑0010)
- DP → DVI (P/N 30‑01120‑0010)
- DP → VGA (P/N 30‑01121‑0010)
Connectors:
- Front panel: Power button, reset, LED indicators (Watchdog, HDD, Diagnostic), audio jacks, 2 × DisplayPort, DVI‑D, VGA, 6 × USB, 3 × GbE, 4 × COM, 8 × DI/DO, DC power input.
- Rear panel: CFast slot.
- Internal: Mini PCIe, USIM slot, SATA connector, USB 2.0 header, fan connector, clear CMOS jumper, extended PWR/RESET header.
### 6. Installation & Setup
Power Requirements:
12 – 24 V DC input via 3‑pin connector (GND, V‑, V+). Optional 160 W AC‑DC adapter available.
Mounting:
Wall‑mount brackets included. For safety, mount with front and rear panels facing sideways to maintain ventilation.
Storage Installation:
- 2.5″ HDD/SSD mounted internally via SATA connector.
- CFast card inserted through rear panel slot.
Driver Installation:
Download chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, and Serial I/O drivers from ADLINK’s website.
BIOS Configuration:
Access via DEL key at POST. Supports boot device selection (F7), Hyper‑Threading, VT‑d, SpeedStep, and watchdog timer settings.
### 7. Performance & Capabilities
- Processing Power: Dual‑core Intel® Core™ i3‑6100TE (2.7 GHz) with Intel® HD Graphics 530.
- Memory Bandwidth: DDR4 2133 MHz dual‑channel (up to 32 GB).
- Graphics Output: Up to 4096 × 2304 @ 60 Hz (DisplayPort), 1920 × 1080 (DVI‑D), 1920 × 1200 (VGA).
- Network Throughput: Three Gigabit Ethernet ports with teaming for redundancy or load balancing.
- I/O Performance: USB 3.0 ports support SuperSpeed (5 Gb/s) and 1.6 A power output per port.
- Reliability: Fanless design extends MTBF and reduces maintenance.
- Power Efficiency: Typical consumption ≈ 20 W idle, 41 W full load @ 24 V DC.
- Environmental Robustness: Operates 0 – 50 °C, vibration resistance up to 5 Grms, shock tolerance 100 Grms.
Limitations:
- Operating temperature limited to 50 °C with industrial SSD only.
- HDD use reduces vibration tolerance.
- No active cooling fan by default (optional 9 V fan module available).
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant.
- Safety: UL/cUL and CB certified.
- Environmental: RoHS and WEEE compliant (manufacturer environmental responsibility policy).
- Ethernet Standards: IEEE 802.3az (Energy Efficient Ethernet), IEEE 1588/802.1AS (Precision Time Protocol), IEEE 802.3Qav (Traffic Shaping).
- Quality Assurance: Rigorous testing for shock, vibration, and temperature resilience ensures industrial reliability.
### 9. Additional Information
Warranty & Support:
ADLINK provides global technical support and service through regional offices in Taiwan, USA, China, Europe, Japan, Korea, Singapore, and India. Warranty terms follow ADLINK’s standard industrial product policy.
Maintenance:
- Fanless design minimizes maintenance requirements.
- Regularly check ventilation openings for dust accumulation.
- Use industrial‑grade SSD for optimal thermal and vibration performance.
Software & API Support:
- Watchdog Timer (WDT): Hardware reset protection with API support for Windows and Linux.
- Digital I/O Library: Matrix DI/O API for C/C++ integration (matrix_dio.h and matrix_dio.lib).
- BIOS Features: Advanced power management, USB configuration, CSM support, and UEFI network stack.
Environmental Responsibility:
ADLINK ensures compliance with RoHS and WEEE directives and encourages proper end‑of‑life disposal and recycling of electronic equipment.
Safety Precautions:
- Operate within specified temperature and voltage ranges.
- Avoid exposure to moisture and dust ingress.
- Disconnect power before servicing or mounting.
- Replace battery only with approved type to avoid explosion risk.
Service Contacts:
- Global Support: service@adlinktech.com
- Ask an Expert: http://askanexpert.adlinktech.com
- Website: [www.adlinktech.com](http://www.adlinktech.com)
### Summary
The ADLINK MVP‑5003/M4G is a robust, fanless embedded controller optimized for industrial automation and embedded computing. Powered by a 6th Generation Intel® Core™ i3‑6100TE processor and Intel® H110 chipset, it delivers reliable performance with low power consumption. Its comprehensive I/O—including triple Gigabit Ethernet, multiple USB 3.0/2.0 ports, four serial ports, and digital I/O—makes it ideal for machine control, data acquisition, and networked industrial applications.
With a rugged aluminum chassis, wide DC input range, and certified compliance to industrial standards, the MVP‑5003/M4G offers a long‑life, maintenance‑free solution for demanding environments requiring stable operation and flexible expansion capabilities.
### 1. Product Overview
Product Name: MVP‑5003/M4G
Model: MVP‑5003
Series: MVP‑5000 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Fanless Embedded Computers
Article Number: MVP‑5003/M4G
Manufacturer: ADLINK Technology, Inc.
Part Number (Manual): 50‑1Z228‑2000
Revision: 2.00 (March 17, 2017)
The ADLINK MVP‑5003/M4G is a rugged, fanless, and expandable embedded computer designed for industrial automation, machine control, and logistics applications. It integrates a 6th Generation Intel® Core™ i3‑6100TE processor with the Intel® H110 chipset, providing a balance of performance, reliability, and cost efficiency. The system is part of ADLINK’s MVP‑5000 series, which includes the MVP‑5001 (Core i7‑6700TE) and MVP‑5002 (Core i5‑6500TE) variants.
### 2. Key Features
- Processor Platform: 6th Generation Intel® Core™ i3‑6100TE (Skylake) dual‑core CPU, 2.7 GHz, 4 MB L3 cache.
- Chipset: Intel® H110 Platform Controller Hub.
- Memory: Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (4 GB standard).
- Graphics: Integrated Intel® HD Graphics 530 with support for up to three independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
- Fanless Design: Completely fanless thermal solution for silent operation and high reliability in dusty or vibration‑prone environments.
- Networking: Three Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN (WOL) support.
- Serial Communication: Four COM ports (2 × software‑selectable RS‑232/422/485 with auto‑flow control, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external ports (1.6 A each), and 1 × internal USB 2.0 (optional).
- Storage Options: 1 × SATA III (6 Gb/s) port for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear‑mounted).
- Expansion: 1 × Mini PCI Express slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE).
- Audio: 1 × Mic‑in, 1 × Line‑out.
- Power Input: Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (with industrial SSD).
- Mounting: Wall‑mount kit included.
- Construction: Compact, industrial‑grade aluminum chassis with front‑accessible I/O.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑6100TE, 2.7 GHz, dual‑core, 4 MB L3 cache |
| Chipset | Intel® H110 |
| Memory | 2 × DDR4 SO‑DIMM 2133 MHz, up to 32 GB (4 GB standard) |
| Graphics | Intel® HD Graphics 530; 2 × DisplayPort (4096 × 2304 @ 60 Hz), 1 × DVI‑D (1920 × 1080 @ 60 Hz), 1 × VGA (1920 × 1200) |
| Ethernet | 3 × Intel® I211AT GbE ports with teaming and WOL |
| Serial Ports | 2 × RS‑232/422/485 (COM1/2, BIOS‑selectable), 2 × RS‑232 (COM3/4) with 2 kV surge protection |
| USB | 4 × USB 3.0 + 2 × USB 2.0 (front) + 1 × internal USB 2.0 (optional) – 1.6 A each |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Expansion | 1 × Mini PCIe slot (Rev. 1.2) with USIM socket |
| Storage | 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear) |
| Power Input | 12 – 24 V DC (3‑pin pluggable connector with latch) |
| Power Consumption | 2.9 W (off), 20.1 W (idle), 41.3 W (full load) @ 24 V DC |
| Dimensions | 220 (W) × 210 (D) × 121 (H) mm (8.67 × 8.27 × 4.77 in.) |
| Weight | 3.6 kg (7.9 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 50 °C (industrial SSD required for full range) |
| Storage Temperature | −40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.4 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB |
### 4. Functionality
The MVP‑5003/M4G operates as a compact, high‑reliability embedded controller for industrial automation. Its fanless design ensures silent, maintenance‑free operation in environments with dust, vibration, or temperature variation. The system’s Intel® Core™ i3 processor and DDR4 memory deliver strong computational performance for control, monitoring, and data acquisition tasks.
Typical Applications:
- Machine and factory automation control systems
- Logistics and warehouse management
- Industrial vision and inspection systems
- Kiosk and digital signage controllers
- Data acquisition and process monitoring
Compatibility:
- Operating Systems: Windows 7 Pro, Windows Embedded Standard 7, Windows 10 IoT Enterprise, Linux (Ubuntu 12.04, Fedora 18 – by request).
- Supports BIOS‑level configuration for serial modes, LAN PXE boot, and USB boot devices.
### 5. Components & Accessories
Included Items:
- MVP‑5003/M4G embedded computer
- Wall‑mount kit and screws
- Accessory pack for HDD/SSD installation
- Quick Start Guide
Optional Accessories:
- DDR4 SO‑DIMM modules (8 GB, 16 GB, 32 GB)
- 2.5″ SSD/HDD or CFast storage (pre‑installed and tested)
- 160 W industrial AC‑DC adapter
- Wireless modules (Wi‑Fi/Bluetooth, 3G, 4G/LTE Mini PCIe with antenna kit)
- DisplayPort adapter cables:
- DP → HDMI (P/N 30‑01119‑0010)
- DP → DVI (P/N 30‑01120‑0010)
- DP → VGA (P/N 30‑01121‑0010)
Connectors:
- Front panel: Power button, reset, LED indicators (Watchdog, HDD, Diagnostic), audio jacks, 2 × DisplayPort, DVI‑D, VGA, 6 × USB, 3 × GbE, 4 × COM, 8 × DI/DO, DC power input.
- Rear panel: CFast slot.
- Internal: Mini PCIe, USIM slot, SATA connector, USB 2.0 header, fan connector, clear CMOS jumper, extended PWR/RESET header.
### 6. Installation & Setup
Power Requirements:
12 – 24 V DC input via 3‑pin connector (GND, V‑, V+). Optional 160 W AC‑DC adapter available.
Mounting:
Wall‑mount brackets included. For safety, mount with front and rear panels facing sideways to maintain ventilation.
Storage Installation:
- 2.5″ HDD/SSD mounted internally via SATA connector.
- CFast card inserted through rear panel slot.
Driver Installation:
Download chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, and Serial I/O drivers from ADLINK’s website.
BIOS Configuration:
Access via DEL key at POST. Supports boot device selection (F7), Hyper‑Threading, VT‑d, SpeedStep, and watchdog timer settings.
### 7. Performance & Capabilities
- Processing Power: Dual‑core Intel® Core™ i3‑6100TE (2.7 GHz) with Intel® HD Graphics 530.
- Memory Bandwidth: DDR4 2133 MHz dual‑channel (up to 32 GB).
- Graphics Output: Up to 4096 × 2304 @ 60 Hz (DisplayPort), 1920 × 1080 (DVI‑D), 1920 × 1200 (VGA).
- Network Throughput: Three Gigabit Ethernet ports with teaming for redundancy or load balancing.
- I/O Performance: USB 3.0 ports support SuperSpeed (5 Gb/s) and 1.6 A power output per port.
- Reliability: Fanless design extends MTBF and reduces maintenance.
- Power Efficiency: Typical consumption ≈ 20 W idle, 41 W full load @ 24 V DC.
- Environmental Robustness: Operates 0 – 50 °C, vibration resistance up to 5 Grms, shock tolerance 100 Grms.
Limitations:
- Operating temperature limited to 50 °C with industrial SSD only.
- HDD use reduces vibration tolerance.
- No active cooling fan by default (optional 9 V fan module available).
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant.
- Safety: UL/cUL and CB certified.
- Environmental: RoHS and WEEE compliant (manufacturer environmental responsibility policy).
- Ethernet Standards: IEEE 802.3az (Energy Efficient Ethernet), IEEE 1588/802.1AS (Precision Time Protocol), IEEE 802.3Qav (Traffic Shaping).
- Quality Assurance: Rigorous testing for shock, vibration, and temperature resilience ensures industrial reliability.
### 9. Additional Information
Warranty & Support:
ADLINK provides global technical support and service through regional offices in Taiwan, USA, China, Europe, Japan, Korea, Singapore, and India. Warranty terms follow ADLINK’s standard industrial product policy.
Maintenance:
- Fanless design minimizes maintenance requirements.
- Regularly check ventilation openings for dust accumulation.
- Use industrial‑grade SSD for optimal thermal and vibration performance.
Software & API Support:
- Watchdog Timer (WDT): Hardware reset protection with API support for Windows and Linux.
- Digital I/O Library: Matrix DI/O API for C/C++ integration (matrix_dio.h and matrix_dio.lib).
- BIOS Features: Advanced power management, USB configuration, CSM support, and UEFI network stack.
Environmental Responsibility:
ADLINK ensures compliance with RoHS and WEEE directives and encourages proper end‑of‑life disposal and recycling of electronic equipment.
Safety Precautions:
- Operate within specified temperature and voltage ranges.
- Avoid exposure to moisture and dust ingress.
- Disconnect power before servicing or mounting.
- Replace battery only with approved type to avoid explosion risk.
Service Contacts:
- Global Support: service@adlinktech.com
- Ask an Expert: http://askanexpert.adlinktech.com
- Website: [www.adlinktech.com](http://www.adlinktech.com)
### Summary
The ADLINK MVP‑5003/M4G is a robust, fanless embedded controller optimized for industrial automation and embedded computing. Powered by a 6th Generation Intel® Core™ i3‑6100TE processor and Intel® H110 chipset, it delivers reliable performance with low power consumption. Its comprehensive I/O—including triple Gigabit Ethernet, multiple USB 3.0/2.0 ports, four serial ports, and digital I/O—makes it ideal for machine control, data acquisition, and networked industrial applications.
With a rugged aluminum chassis, wide DC input range, and certified compliance to industrial standards, the MVP‑5003/M4G offers a long‑life, maintenance‑free solution for demanding environments requiring stable operation and flexible expansion capabilities.
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