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MXC-6402D/M4G

Core i5-QM170 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16
  • Manufacturer Adlink Technology Inc.
  • Category: Adlink M-Series
  • The MXC‑6402D is a rugged, fanless, and cable‑free embedded computer designed for industrial and transportation applications requiring high reliability, extended temperature operation, and flexible expansion. It integrates a 6th Generation Intel® Core™ i5‑6440EQ processor and Intel® QM170 chipset, providing a balance of performance, power efficiency, and scalability. The system supports multiple expansion slots, triple independent displays, and a wide range of I/O interfaces, making it suitable for automation, machine vision, intelligent transportation, and mission‑critical control systems.
- Processor Platform:
6th Generation Intel® Core™ i5‑6440EQ (Skylake) CPU, 4 cores / 4 threads, 2.7 GHz base frequency, 3.4 GHz Turbo, 6 MB cache.
Integrated Intel® Gen9 HD Graphics (GT2e/GT4e) supporting 4K UHD output.

- Chipset:
Intel® QM170 Mobile Platform Controller Hub.

- Memory:
Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.

- Display Support:
Three independent displays via dual DisplayPort 1.3 and one DVI‑I port.
Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD).
Supports VGA/DVI/HDMI through converter cables.

- Expansion Capability:
1 × PCI slot and either 2 × PCIe Gen3 x8 or 1 × PCIe Gen3 x16 slot (auto‑switching).
2 × Mini PCIe slots (one with USIM socket for 3G/4G connectivity).

- Storage:
2 × front‑mounted hot‑swappable SATA III trays (2.5″ HDD/SSD).
2 × internal SATA III ports with RAID 0/1/5/10 support (6 Gb/s).
1 × Type II CFast socket (front or internal).

- Networking:
3 × Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219).
Features include teaming, Wake‑on‑LAN, Intel® iAMT 11.0, PXE boot, and EEE 802.3az.

- I/O Interfaces:
- 6 × USB 3.0 (2 × 1600 mA, 4 × 900 mA)
- 1 × internal USB 2.0
- 2 × RS‑232/422/485 (COM1–2, software‑selectable)
- 2 × RS‑232 (COM3–4)
- 1 × PS/2 keyboard and 1 × PS/2 mouse
- Audio in/line out (Realtek ALC262 HD Audio)
- Optional 16 × DI + 16 × DO isolated digital I/O with configurable filters and COS interrupt

- Power Input:
9 – 32 V DC wide‑range input with 3‑pin pluggable connector (V+, V–, GND).
Optional 160 W AC‑DC adapter for AC operation.
Remote power on/off connector on front panel.

- Environmental Design:
Fanless, cable‑free construction with optional hot‑pluggable fan module.
Standard operating range 0 – 50 °C (with HDD).
Extended range –20 – 70 °C (with industrial SSD/CFast).
Vibration 5 Grms (SSD/CFast), 0.5 Grms (HDD); Shock 50 G 11 ms.
Humidity 95 % @ 40 °C non‑condensing.

- Certifications:
CE, FCC Class A EMC; UL/cUL and CB Safety; RoHS and WEEE compliant.

Country of origin: Taiwan R.O.C.

Customs tariff number: 8471 5000 000

Comprehensive Product Summary: ADLINK MXC‑6402D/M4G Embedded Computer
*(Approx. 3000 tokens / ~12,000 characters)*




### 1. Product Overview

Product Name: ADLINK Matrix MXC‑6402D/M4G
Model: MXC‑6402D
Series: MXC‑6400 Series – Expandable Fanless Embedded Computers
Article Number: MXC‑6402D/M4G
Manufacturer: ADLINK Technology, Inc.

The MXC‑6402D is a rugged, fanless, and cable‑free embedded computer designed for industrial and transportation applications requiring high reliability, extended temperature operation, and flexible expansion. It integrates a 6th Generation Intel® Core™ i5‑6440EQ processor and Intel® QM170 chipset, providing a balance of performance, power efficiency, and scalability. The system supports multiple expansion slots, triple independent displays, and a wide range of I/O interfaces, making it suitable for automation, machine vision, intelligent transportation, and mission‑critical control systems.




### 2. Key Features

- Processor Platform:
6th Generation Intel® Core™ i5‑6440EQ (Skylake) CPU, 4 cores / 4 threads, 2.7 GHz base frequency, 3.4 GHz Turbo, 6 MB cache.
Integrated Intel® Gen9 HD Graphics (GT2e/GT4e) supporting 4K UHD output.

- Chipset:
Intel® QM170 Mobile Platform Controller Hub.

- Memory:
Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.

- Display Support:
Three independent displays via dual DisplayPort 1.3 and one DVI‑I port.
Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD).
Supports VGA/DVI/HDMI through converter cables.

- Expansion Capability:
1 × PCI slot and either 2 × PCIe Gen3 x8 or 1 × PCIe Gen3 x16 slot (auto‑switching).
2 × Mini PCIe slots (one with USIM socket for 3G/4G connectivity).

- Storage:
2 × front‑mounted hot‑swappable SATA III trays (2.5″ HDD/SSD).
2 × internal SATA III ports with RAID 0/1/5/10 support (6 Gb/s).
1 × Type II CFast socket (front or internal).

- Networking:
3 × Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219).
Features include teaming, Wake‑on‑LAN, Intel® iAMT 11.0, PXE boot, and EEE 802.3az.

- I/O Interfaces:
- 6 × USB 3.0 (2 × 1600 mA, 4 × 900 mA)
- 1 × internal USB 2.0
- 2 × RS‑232/422/485 (COM1–2, software‑selectable)
- 2 × RS‑232 (COM3–4)
- 1 × PS/2 keyboard and 1 × PS/2 mouse
- Audio in/line out (Realtek ALC262 HD Audio)
- Optional 16 × DI + 16 × DO isolated digital I/O with configurable filters and COS interrupt

- Power Input:
9 – 32 V DC wide‑range input with 3‑pin pluggable connector (V+, V–, GND).
Optional 160 W AC‑DC adapter for AC operation.
Remote power on/off connector on front panel.

- Environmental Design:
Fanless, cable‑free construction with optional hot‑pluggable fan module.
Standard operating range 0 – 50 °C (with HDD).
Extended range –20 – 70 °C (with industrial SSD/CFast).
Vibration 5 Grms (SSD/CFast), 0.5 Grms (HDD); Shock 50 G 11 ms.
Humidity 95 % @ 40 °C non‑condensing.

- Certifications:
CE, FCC Class A EMC; UL/cUL and CB Safety; RoHS and WEEE compliant.




### 3. Technical Specifications

| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i5‑6440EQ (4C/4T, 2.7 GHz base, 3.4 GHz Turbo, 6 MB cache) |
| Chipset | Intel® QM170 PCH |
| Memory | 2 × DDR4 SO‑DIMM 2133 MHz, up to 32 GB |
| Graphics | Intel® HD Graphics Gen9 GT2e/GT4e, 4K UHD support |
| Display Outputs | 2 × DisplayPort 1.3, 1 × DVI‑I (analog VGA via adapter) |
| Expansion Slots | 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (auto‑switch) |
| Mini PCIe | 2 × Mini PCIe (full/half‑size), 1 × USIM slot |
| Ethernet | 3 × GbE (2 × Intel I210IT, 1 × Intel I219), teaming, iAMT 11.0 |
| Serial Ports | 2 × RS‑232/422/485 + 2 × RS‑232 |
| USB | 6 × USB 3.0 (front), 1 × internal USB 2.0 |
| Audio | Realtek ALC262 HD Audio (24‑bit/192 kHz) |
| Digital I/O (optional) | 16 × DI + 16 × DO isolated, 1500 V DC isolation |
| Storage | 2 × hot‑swappable SATA III (6 Gb/s) + 2 × internal SATA III (RAID 0/1/5/10) + 1 × CFast Type II |
| Power Input | 9 – 32 V DC input (3‑pin terminal), optional 160 W AC‑DC adapter |
| Dimensions (W × H × D) | 150 × 200 × 225 mm |
| Weight | 4 kg (8.82 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temp. | 0 – 50 °C standard / –20 – 70 °C extended (with industrial SSD) |
| Storage Temp. | –40 – 85 °C (excluding HDD) |
| Humidity | 95 % @ 40 °C non‑condensing |
| Vibration/Shock | 5 Grms (SSD/CFast), 50 G 11 ms shock |
| EMC/Safety | CE, FCC Class A, UL/cUL, CB |
| Power Consumption | Idle 24 W, Full Load ≈ 58 W @ 24 V DC input |
| Recommended PSU | 160 W industrial adapter (–20 – 70 °C rated) |




### 4. Functionality and Applications

The MXC‑6402D operates as a high‑performance embedded controller for industrial automation, transportation, and data acquisition. Its fanless design ensures silent, maintenance‑free operation in dusty or vibration‑prone environments.

Operation Principle:
The system integrates CPU, chipset, memory, and I/O on a rugged aluminum chassis acting as a passive heat sink. Data storage is handled via SATA III interfaces with RAID support, while expansion slots allow integration of motion control, vision capture, or communication cards.

Typical Use Cases:
- Factory automation and process control
- Machine vision and inspection systems
- Intelligent transportation (railway, maritime, in‑vehicle)
- Data logging and edge computing
- Industrial IoT gateways and SCADA nodes

Compatibility:
Supports Windows 10/7/Embedded Standard 7 and Linux (Ubuntu 12.04, Fedora 18 or later on request). BIOS and drivers are optimized for Intel® Skylake architecture.




### 5. Components & Accessories

Included Items:
- MXC‑6402D controller unit
- Wall‑mount brackets and screw pack
- Accessory box and Quick Start Guide

Optional Accessories:
- Hot‑pluggable fan module for PCI/PCIe heat dissipation
- DDR4 memory upgrades (8 GB / 16 GB / 32 GB)
- Factory‑installed HDD (500 GB / 1 TB) or industrial SSD (32 GB SLC / 64 GB MLC)
- Industrial CFast modules (8 GB / 16 GB)
- 160 W AC‑DC adapter (–20 – 70 °C rated)
- Extended temperature screening service
- DIN‑68S‑01 and ACL‑10568‑1 VHDCI cables for digital I/O

Connectors:
Front panel includes power, dual SATA trays, CFast/USIM slot, DVI‑I, 2 × DisplayPort, 6 × USB 3.0, 3 × RJ‑45 GbE, 4 × COM, audio jacks, PS/2 ports, and digital I/O connector.




### 6. Installation & Setup

Requirements:
- DC power supply within 9–32 V range (24 V recommended).
- Stable mounting surface or wall mount brackets.
- Adequate ventilation (≥ 5 cm clearance above unit).

Mounting Options:
Wall‑mount kit included; DIN‑rail mount optional.

Configuration Steps:
1. Install HDD/SSD via internal bracket or front SATA trays.
2. Insert Mini PCIe modules and SIM card if required.
3. Connect display devices to DisplayPort/DVI‑I.
4. Connect power and I/O cables using latching connectors.
5. Power on and enter BIOS (DEL key) for initial setup.
6. Install OS and drivers (chipset, graphics, LAN, audio, USB 3.0, Intel ME).

Optional RAID Setup:
Enable RAID mode in BIOS → Intel® Matrix Storage Manager (Ctrl + I) → Create RAID volume (0/1/5/10).




### 7. Performance & Capabilities

- Processing Power:
Quad‑core Intel® Core™ i5‑6440EQ delivers desktop‑class performance in a 35 W TDP envelope.
Supports Intel® VT‑x, VT‑d, AES‑NI, and SpeedStep™ for virtualization and power efficiency.

- Graphics:
Integrated Intel® HD Graphics supports DirectX 12, OpenGL 4.4, and hardware video acceleration for 4K UHD output.

- Storage Throughput:
SATA III 6 Gb/s interfaces with RAID 0/1/5/10 enable high‑speed and redundant data storage.

- Networking:
Triple Intel GbE ports support link aggregation (teaming) and remote management via Intel® AMT 11.0.

- Reliability:
Fanless design eliminates moving parts; shock tolerance 50 G and vibration resistance 5 Grms ensure operation in harsh conditions.

- Power Efficiency:
Typical consumption ≈ 24 W idle / 58 W full load @ 24 V input.
Wide input range (9–32 V) supports vehicle and industrial power systems.

- Limitations:
No integrated display panel or battery; requires external storage for OS installation; extended temperature operation requires industrial SSD/CFast.




### 8. Standards & Compliance

- Environmental & Safety:
- CE and FCC Class A EMC compliance
- UL/cUL and CB safety certifications
- RoHS and WEEE directives compliant
- ESD protection: ±4 kV contact, ±8 kV air

- Industry Standards:
- Intel® iAMT 11.0 for remote management
- IEEE 802.3 Ethernet standards (10/100/1000 Mbps, EEE 802.3az)
- SATA III 6 Gb/s and RAID 0/1/5/10 support
- USB 3.0 SuperSpeed (5 Gb/s)
- DisplayPort 1.3 and DVI‑I video standards

- Environmental Responsibility:
ADLINK ensures compliance with global environmental regulations and encourages proper recycling of electronic equipment.




### 9. Additional Information

Warranty & Support:
Standard ADLINK limited warranty (typically 2 years, region‑dependent).
Technical support available via ADLINK service centers and Ask‑an‑Expert portal (http://askanexpert.adlinktech.com).

Maintenance:
Fanless design minimizes maintenance. Periodic dust inspection and connector tightening recommended.
Optional fan module requires occasional cleaning if installed.

Firmware & Updates:
BIOS updates and driver packages available from www.adlinktech.com.
Supports Intel® Rapid Storage Technology and SEMA 3.0 for system monitoring and remote management.

Safety Precautions:
Operate within specified temperature and voltage ranges. Disconnect power before servicing. Use only qualified technicians for internal installation.

Global Service Locations:
ADLINK maintains service centers in Taiwan, USA, China (Shanghai, Beijing, Shenzhen), Germany, France, Japan, Korea, Singapore, India, Israel, and the UK.




### Summary

The ADLINK MXC‑6402D/M4G is a robust, fanless embedded computer engineered for industrial and transportation environments demanding high reliability, flexible expansion, and long‑term availability. Powered by a 6th Gen Intel® Core™ i5 processor and QM170 chipset, it delivers strong computing and graphics performance while maintaining low power consumption. Its triple‑display capability, extensive I/O, RAID‑enabled storage, and wide‑range DC input make it ideal for automation control, machine vision, and edge computing applications.

With compliance to CE/FCC/UL standards, extended temperature operation, and ADLINK’s proven industrial design, the MXC‑6402D/M4G provides a dependable platform for mission‑critical embedded deployments.

No accessories available.