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- Processor and Chipset:
Equipped with Intel® Core™ i3‑6100E dual‑core, four‑thread CPU (2.7 GHz, 3 MB cache) and Intel® QM170 chipset for enhanced performance and low power consumption.
- Memory:
Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Expansion Flexibility:
One PCI slot and two PCIe Gen3 ×8 slots (or one PCIe ×16 slot, auto‑switching) for add‑on cards.
Two Mini PCIe slots and one USIM socket for 3G/4G communication modules.
- Display Capabilities:
Supports up to three independent displays via two DisplayPort 1.3 and one DVI‑I port.
Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD).
DisplayPort to VGA/DVI/HDMI conversion supported via adapter cables.
- Storage:
Two front‑mounted hot‑swappable 2.5″ SATA III trays and two internal SATA III ports (6 Gb/s) with RAID 0/1/5/10 support.
One internal Type II CFast socket for solid‑state storage.
- Connectivity:
Three Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219LM) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 support.
Six USB 3.0 ports (two × 1600 mA, four × 900 mA) and one internal USB 2.0 port.
Four serial ports: two software‑programmable RS‑232/422/485 and two RS‑232.
Optional 16‑channel isolated digital input/output (DI/O) module with configurable digital filters.
- Power and Reliability:
Wide‑range 9–32 V DC input with remote power on/off connector.
Optional 160 W AC‑DC adapter.
Fanless operation from –20 °C to +70 °C (with industrial SSD/CFast).
Built‑in watchdog timer and SEMA 3.0 system management.
- Mechanical Design:
Compact, cable‑free, fanless aluminum chassis (150 × 200 × 225 mm, 4 kg).
Wall‑mountable with optional fan module for high‑power PCIe cards.
Equipped with Intel® Core™ i3‑6100E dual‑core, four‑thread CPU (2.7 GHz, 3 MB cache) and Intel® QM170 chipset for enhanced performance and low power consumption.
- Memory:
Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Expansion Flexibility:
One PCI slot and two PCIe Gen3 ×8 slots (or one PCIe ×16 slot, auto‑switching) for add‑on cards.
Two Mini PCIe slots and one USIM socket for 3G/4G communication modules.
- Display Capabilities:
Supports up to three independent displays via two DisplayPort 1.3 and one DVI‑I port.
Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD).
DisplayPort to VGA/DVI/HDMI conversion supported via adapter cables.
- Storage:
Two front‑mounted hot‑swappable 2.5″ SATA III trays and two internal SATA III ports (6 Gb/s) with RAID 0/1/5/10 support.
One internal Type II CFast socket for solid‑state storage.
- Connectivity:
Three Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219LM) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 support.
Six USB 3.0 ports (two × 1600 mA, four × 900 mA) and one internal USB 2.0 port.
Four serial ports: two software‑programmable RS‑232/422/485 and two RS‑232.
Optional 16‑channel isolated digital input/output (DI/O) module with configurable digital filters.
- Power and Reliability:
Wide‑range 9–32 V DC input with remote power on/off connector.
Optional 160 W AC‑DC adapter.
Fanless operation from –20 °C to +70 °C (with industrial SSD/CFast).
Built‑in watchdog timer and SEMA 3.0 system management.
- Mechanical Design:
Compact, cable‑free, fanless aluminum chassis (150 × 200 × 225 mm, 4 kg).
Wall‑mountable with optional fan module for high‑power PCIe cards.
Comprehensive Product Summary – ADLINK MXC‑6403D/M4G
### 1. Product Overview
Product Name: MXC‑6403D/M4G
Model: MXC‑6403D
Series: MXC‑6400 Series – Expandable Fanless Embedded Computers
Article Number: MXC‑6403D/M4G
Manufacturer: ADLINK Technology, Inc.
Processor Platform: Intel® Core™ i3‑6100E (6th Generation Skylake) with Intel® QM170 chipset
Product Type: Fanless, ruggedized, expandable embedded computer for industrial and transportation applications
The MXC‑6403D is part of ADLINK’s Matrix MXC‑6400 series, a family of high‑performance, fanless embedded systems designed for industrial automation, intelligent transportation, and mission‑critical embedded control. It integrates Intel’s 6th Generation Core™ processors and the QM170 mobile chipset, offering high computing and graphics performance in a compact, cable‑free, and thermally optimized chassis.
### 2. Key Features
- Processor and Chipset:
Equipped with Intel® Core™ i3‑6100E dual‑core, four‑thread CPU (2.7 GHz, 3 MB cache) and Intel® QM170 chipset for enhanced performance and low power consumption.
- Memory:
Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Expansion Flexibility:
One PCI slot and two PCIe Gen3 ×8 slots (or one PCIe ×16 slot, auto‑switching) for add‑on cards.
Two Mini PCIe slots and one USIM socket for 3G/4G communication modules.
- Display Capabilities:
Supports up to three independent displays via two DisplayPort 1.3 and one DVI‑I port.
Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD).
DisplayPort to VGA/DVI/HDMI conversion supported via adapter cables.
- Storage:
Two front‑mounted hot‑swappable 2.5″ SATA III trays and two internal SATA III ports (6 Gb/s) with RAID 0/1/5/10 support.
One internal Type II CFast socket for solid‑state storage.
- Connectivity:
Three Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219LM) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 support.
Six USB 3.0 ports (two × 1600 mA, four × 900 mA) and one internal USB 2.0 port.
Four serial ports: two software‑programmable RS‑232/422/485 and two RS‑232.
Optional 16‑channel isolated digital input/output (DI/O) module with configurable digital filters.
- Power and Reliability:
Wide‑range 9–32 V DC input with remote power on/off connector.
Optional 160 W AC‑DC adapter.
Fanless operation from –20 °C to +70 °C (with industrial SSD/CFast).
Built‑in watchdog timer and SEMA 3.0 system management.
- Mechanical Design:
Compact, cable‑free, fanless aluminum chassis (150 × 200 × 225 mm, 4 kg).
Wall‑mountable with optional fan module for high‑power PCIe cards.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑6100E, 2 C/4 T, 2.7 GHz, 3 MB cache |
| Chipset | Intel® QM170 Mobile PCH |
| Memory | 2 × DDR4 SO‑DIMM 2133 MHz, up to 32 GB |
| Graphics | Intel® Gen9 HD Graphics GT2e, 4K UHD support |
| Display Outputs | 2 × DisplayPort 1.3, 1 × DVI‑I (VGA/DVI/HDMI via adapter) |
| Max Resolution | 4096 × 2304 @ 60 Hz (3 independent displays) |
| Expansion Slots | 1 × PCI, 2 × PCIe Gen3 ×8 or 1 × PCIe ×16 (auto switch) |
| Mini PCIe Slots | 2 × Mini PCIe (full/half size) + 1 × USIM socket |
| Ethernet | 3 × Intel GbE (2 × I210IT + 1 × I219LM) with teaming and iAMT 11.0 |
| Serial Ports | 2 × RS‑232/422/485 (COM1/2), 2 × RS‑232 (COM3/4) |
| USB Ports | 6 × USB 3.0 (front), 1 × internal USB 2.0 |
| Audio | Realtek ALC262 HD Audio (Line‑out + Mic‑in) |
| Digital I/O (optional) | 16 × DI + 16 × DO isolated, COS interrupt, digital filter |
| Storage Interfaces | 4 × SATA III (6 Gb/s) – 2 front hot‑swap + 2 internal RAID 0/1/5/10 |
| CFast Socket | 1 × Type II (push‑push) SATA interface |
| Power Input | 9–32 V DC (3‑pin latch connector), optional 160 W AC‑DC adapter |
| Power Consumption | 23.85 W idle / 56.88 W full load @ 24 V DC |
| Dimensions (W×H×D) | 150 × 200 × 225 mm |
| Weight | 4 kg (8.82 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C to 50 °C (standard, HDD) / –20 °C to 70 °C (industrial SSD/CFast) |
| Storage Temperature | –40 °C to 85 °C (excl. HDD) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration Resistance | 5 Grms (SSD/CFast) / 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock Resistance | 50 G, 11 ms half‑sine (SSD/CFast) |
| ESD Protection | ±4 kV contact, ±8 kV air |
| Certifications | CE, FCC Class A, UL/cUL, CB Safety |
### 4. Functionality and Applications
The MXC‑6403D operates as a high‑reliability embedded controller for industrial automation, transportation, and mission‑critical systems. Its fanless, cable‑free design ensures long‑term stability in environments subject to vibration, dust, and temperature extremes.
Typical Applications:
- Intelligent Transportation Systems (ITS) and railway rolling stock control
- Maritime and in‑vehicle infotainment systems
- Factory automation and process control
- Machine vision and data acquisition
- Edge computing and industrial IoT gateways
Operation:
The system boots from internal SATA or CFast storage, supports Windows 10/7/Embedded Standard 7 and Linux (Ubuntu 12.04/Fedora 18 or later), and can be remotely managed via Intel® AMT 11.0 and ADLINK SEMA 3.0. It supports RAID for data redundancy and high‑speed I/O for real‑time control.
Compatibility:
Standard PCI/PCIe Gen3 cards, Mini PCIe modules (Wi‑Fi, LTE, GPS), and USB 3.0 devices are supported. DisplayPort adapters enable connection to HDMI, DVI, or VGA monitors.
### 5. Components & Accessories
Included:
- MXC‑6403D controller unit
- Wall‑mount kit and screw pack
- Quick Start Guide
- Accessory box for mounting hardware
Optional Accessories:
- Hot‑pluggable fan module for PCI/PCIe heat dissipation
- DDR4 memory modules (8 GB / 16 GB / 32 GB)
- Factory‑installed HDD (500 GB / 1 TB) or industrial SSD (32 GB SLC / 64 GB MLC)
- Industrial CFast modules (8 GB / 16 GB)
- 160 W AC‑DC adapter (–20 °C to 70 °C rated)
- Extended temperature screening service (–20 °C to 70 °C operation)
- DIN‑68S‑01 and ACL‑10568‑1 VHDCI cables for DI/O connection
### 6. Installation & Setup
Power Connection:
The 3‑pin DC input connector (V+, GND, V–) accepts 9–32 V DC. A remote power on/off switch connector is available on the front panel. Optional 160 W AC‑DC adapter provides AC input support.
Mounting:
Wall‑mount brackets and M4 screws are included. Maintain ≥ 5 cm clearance above the unit for heat dissipation.
Storage Installation:
Two internal 2.5″ SATA drives and two front hot‑swappable trays support HDD or SSD installation. Drives can be configured in RAID 0/1/5/10 via Intel® Rapid Storage Technology.
Expansion Cards:
Remove the top cover to install PCI or PCIe cards. The optional fan module is recommended for high‑power cards.
Display Connection:
Connect monitors via DisplayPort or DVI‑I. Adapters support HDMI and VGA outputs.
Software Setup:
Install drivers from ADLINK’s support site: chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, and serial I/O drivers. BIOS configuration supports RAID, AMT, and TPM 1.2.
### 7. Performance & Capabilities
- Processing Power: Dual‑core Intel Core i3‑6100E (2.7 GHz) delivers desktop‑class performance for industrial tasks.
- Graphics: Integrated Intel HD Graphics supports 4K UHD output and three independent displays.
- Storage Throughput: SATA III 6 Gb/s with RAID 0/1/5/10 ensures high data integrity and speed.
- Network Performance: Triple Intel GbE ports with teaming and AMT 11.0 enable redundant and remote management links.
- Power Efficiency: Typical consumption ≈ 24 W idle / 57 W full load @ 24 V DC.
- Environmental Resilience: Operates fanlessly from –20 °C to 70 °C (with industrial SSD/CFast), shock tolerance 50 G, vibration 5 Grms.
- Reliability: Cable‑free internal layout reduces failure points; watchdog timer ensures system recovery from software faults.
Limitations:
Standard temperature range (0–50 °C) applies when using mechanical HDDs. Extended range requires solid‑state storage. High‑power PCIe cards may necessitate the optional fan module.
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant
- Safety: UL/cUL and CB certified
- Environmental: RoHS and WEEE compliant manufacturing
- Software Support: Windows 10/7/Embedded Standard 7, Linux (Ubuntu 12.04, Fedora 18 or later)
- Management and Security: Intel® AMT 11.0, TPM 1.2 support, BIOS watchdog and RAID configuration
- Mechanical and Electrical Standards: PCI Express Gen3, SATA III 6 Gb/s, USB 3.0 SuperSpeed, DisplayPort 1.3
### 9. Additional Information
Warranty & Support:
ADLINK provides standard limited warranty coverage and global technical support through regional offices in Taiwan, USA, Europe, China, Japan, Korea, Singapore, and India. Online support and driver downloads are available at [www.adlinktech.com](http://www.adlinktech.com).
Maintenance:
The fanless design minimizes maintenance requirements. Periodic dust removal and connector inspection are recommended. Firmware and BIOS updates can be applied via USB or network.
System Management:
Integrated SEMA 3.0 (ADLINK Smart Embedded Management Agent) provides real‑time monitoring of temperature, voltage, and system health parameters for predictive maintenance.
End‑of‑Life and Environmental Responsibility:
Compliant with EU RoHS and WEEE directives. ADLINK encourages proper recycling and disposal of electronic equipment and batteries.
### Summary
The ADLINK MXC‑6403D/M4G is a robust, fanless, and highly expandable embedded computer engineered for industrial and transportation environments requiring reliable, long‑life operation. With its Intel® Core™ i3‑6100E processor, triple Gigabit Ethernet, multi‑display 4K graphics, and comprehensive I/O suite, it delivers a balanced combination of performance, ruggedness, and flexibility. Its wide temperature tolerance, shock and vibration resistance, and support for RAID storage and remote management make it ideal for automation control, edge computing, and mission‑critical applications in harsh industrial settings.
### 1. Product Overview
Product Name: MXC‑6403D/M4G
Model: MXC‑6403D
Series: MXC‑6400 Series – Expandable Fanless Embedded Computers
Article Number: MXC‑6403D/M4G
Manufacturer: ADLINK Technology, Inc.
Processor Platform: Intel® Core™ i3‑6100E (6th Generation Skylake) with Intel® QM170 chipset
Product Type: Fanless, ruggedized, expandable embedded computer for industrial and transportation applications
The MXC‑6403D is part of ADLINK’s Matrix MXC‑6400 series, a family of high‑performance, fanless embedded systems designed for industrial automation, intelligent transportation, and mission‑critical embedded control. It integrates Intel’s 6th Generation Core™ processors and the QM170 mobile chipset, offering high computing and graphics performance in a compact, cable‑free, and thermally optimized chassis.
### 2. Key Features
- Processor and Chipset:
Equipped with Intel® Core™ i3‑6100E dual‑core, four‑thread CPU (2.7 GHz, 3 MB cache) and Intel® QM170 chipset for enhanced performance and low power consumption.
- Memory:
Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Expansion Flexibility:
One PCI slot and two PCIe Gen3 ×8 slots (or one PCIe ×16 slot, auto‑switching) for add‑on cards.
Two Mini PCIe slots and one USIM socket for 3G/4G communication modules.
- Display Capabilities:
Supports up to three independent displays via two DisplayPort 1.3 and one DVI‑I port.
Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD).
DisplayPort to VGA/DVI/HDMI conversion supported via adapter cables.
- Storage:
Two front‑mounted hot‑swappable 2.5″ SATA III trays and two internal SATA III ports (6 Gb/s) with RAID 0/1/5/10 support.
One internal Type II CFast socket for solid‑state storage.
- Connectivity:
Three Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219LM) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 support.
Six USB 3.0 ports (two × 1600 mA, four × 900 mA) and one internal USB 2.0 port.
Four serial ports: two software‑programmable RS‑232/422/485 and two RS‑232.
Optional 16‑channel isolated digital input/output (DI/O) module with configurable digital filters.
- Power and Reliability:
Wide‑range 9–32 V DC input with remote power on/off connector.
Optional 160 W AC‑DC adapter.
Fanless operation from –20 °C to +70 °C (with industrial SSD/CFast).
Built‑in watchdog timer and SEMA 3.0 system management.
- Mechanical Design:
Compact, cable‑free, fanless aluminum chassis (150 × 200 × 225 mm, 4 kg).
Wall‑mountable with optional fan module for high‑power PCIe cards.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑6100E, 2 C/4 T, 2.7 GHz, 3 MB cache |
| Chipset | Intel® QM170 Mobile PCH |
| Memory | 2 × DDR4 SO‑DIMM 2133 MHz, up to 32 GB |
| Graphics | Intel® Gen9 HD Graphics GT2e, 4K UHD support |
| Display Outputs | 2 × DisplayPort 1.3, 1 × DVI‑I (VGA/DVI/HDMI via adapter) |
| Max Resolution | 4096 × 2304 @ 60 Hz (3 independent displays) |
| Expansion Slots | 1 × PCI, 2 × PCIe Gen3 ×8 or 1 × PCIe ×16 (auto switch) |
| Mini PCIe Slots | 2 × Mini PCIe (full/half size) + 1 × USIM socket |
| Ethernet | 3 × Intel GbE (2 × I210IT + 1 × I219LM) with teaming and iAMT 11.0 |
| Serial Ports | 2 × RS‑232/422/485 (COM1/2), 2 × RS‑232 (COM3/4) |
| USB Ports | 6 × USB 3.0 (front), 1 × internal USB 2.0 |
| Audio | Realtek ALC262 HD Audio (Line‑out + Mic‑in) |
| Digital I/O (optional) | 16 × DI + 16 × DO isolated, COS interrupt, digital filter |
| Storage Interfaces | 4 × SATA III (6 Gb/s) – 2 front hot‑swap + 2 internal RAID 0/1/5/10 |
| CFast Socket | 1 × Type II (push‑push) SATA interface |
| Power Input | 9–32 V DC (3‑pin latch connector), optional 160 W AC‑DC adapter |
| Power Consumption | 23.85 W idle / 56.88 W full load @ 24 V DC |
| Dimensions (W×H×D) | 150 × 200 × 225 mm |
| Weight | 4 kg (8.82 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C to 50 °C (standard, HDD) / –20 °C to 70 °C (industrial SSD/CFast) |
| Storage Temperature | –40 °C to 85 °C (excl. HDD) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration Resistance | 5 Grms (SSD/CFast) / 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock Resistance | 50 G, 11 ms half‑sine (SSD/CFast) |
| ESD Protection | ±4 kV contact, ±8 kV air |
| Certifications | CE, FCC Class A, UL/cUL, CB Safety |
### 4. Functionality and Applications
The MXC‑6403D operates as a high‑reliability embedded controller for industrial automation, transportation, and mission‑critical systems. Its fanless, cable‑free design ensures long‑term stability in environments subject to vibration, dust, and temperature extremes.
Typical Applications:
- Intelligent Transportation Systems (ITS) and railway rolling stock control
- Maritime and in‑vehicle infotainment systems
- Factory automation and process control
- Machine vision and data acquisition
- Edge computing and industrial IoT gateways
Operation:
The system boots from internal SATA or CFast storage, supports Windows 10/7/Embedded Standard 7 and Linux (Ubuntu 12.04/Fedora 18 or later), and can be remotely managed via Intel® AMT 11.0 and ADLINK SEMA 3.0. It supports RAID for data redundancy and high‑speed I/O for real‑time control.
Compatibility:
Standard PCI/PCIe Gen3 cards, Mini PCIe modules (Wi‑Fi, LTE, GPS), and USB 3.0 devices are supported. DisplayPort adapters enable connection to HDMI, DVI, or VGA monitors.
### 5. Components & Accessories
Included:
- MXC‑6403D controller unit
- Wall‑mount kit and screw pack
- Quick Start Guide
- Accessory box for mounting hardware
Optional Accessories:
- Hot‑pluggable fan module for PCI/PCIe heat dissipation
- DDR4 memory modules (8 GB / 16 GB / 32 GB)
- Factory‑installed HDD (500 GB / 1 TB) or industrial SSD (32 GB SLC / 64 GB MLC)
- Industrial CFast modules (8 GB / 16 GB)
- 160 W AC‑DC adapter (–20 °C to 70 °C rated)
- Extended temperature screening service (–20 °C to 70 °C operation)
- DIN‑68S‑01 and ACL‑10568‑1 VHDCI cables for DI/O connection
### 6. Installation & Setup
Power Connection:
The 3‑pin DC input connector (V+, GND, V–) accepts 9–32 V DC. A remote power on/off switch connector is available on the front panel. Optional 160 W AC‑DC adapter provides AC input support.
Mounting:
Wall‑mount brackets and M4 screws are included. Maintain ≥ 5 cm clearance above the unit for heat dissipation.
Storage Installation:
Two internal 2.5″ SATA drives and two front hot‑swappable trays support HDD or SSD installation. Drives can be configured in RAID 0/1/5/10 via Intel® Rapid Storage Technology.
Expansion Cards:
Remove the top cover to install PCI or PCIe cards. The optional fan module is recommended for high‑power cards.
Display Connection:
Connect monitors via DisplayPort or DVI‑I. Adapters support HDMI and VGA outputs.
Software Setup:
Install drivers from ADLINK’s support site: chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, and serial I/O drivers. BIOS configuration supports RAID, AMT, and TPM 1.2.
### 7. Performance & Capabilities
- Processing Power: Dual‑core Intel Core i3‑6100E (2.7 GHz) delivers desktop‑class performance for industrial tasks.
- Graphics: Integrated Intel HD Graphics supports 4K UHD output and three independent displays.
- Storage Throughput: SATA III 6 Gb/s with RAID 0/1/5/10 ensures high data integrity and speed.
- Network Performance: Triple Intel GbE ports with teaming and AMT 11.0 enable redundant and remote management links.
- Power Efficiency: Typical consumption ≈ 24 W idle / 57 W full load @ 24 V DC.
- Environmental Resilience: Operates fanlessly from –20 °C to 70 °C (with industrial SSD/CFast), shock tolerance 50 G, vibration 5 Grms.
- Reliability: Cable‑free internal layout reduces failure points; watchdog timer ensures system recovery from software faults.
Limitations:
Standard temperature range (0–50 °C) applies when using mechanical HDDs. Extended range requires solid‑state storage. High‑power PCIe cards may necessitate the optional fan module.
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant
- Safety: UL/cUL and CB certified
- Environmental: RoHS and WEEE compliant manufacturing
- Software Support: Windows 10/7/Embedded Standard 7, Linux (Ubuntu 12.04, Fedora 18 or later)
- Management and Security: Intel® AMT 11.0, TPM 1.2 support, BIOS watchdog and RAID configuration
- Mechanical and Electrical Standards: PCI Express Gen3, SATA III 6 Gb/s, USB 3.0 SuperSpeed, DisplayPort 1.3
### 9. Additional Information
Warranty & Support:
ADLINK provides standard limited warranty coverage and global technical support through regional offices in Taiwan, USA, Europe, China, Japan, Korea, Singapore, and India. Online support and driver downloads are available at [www.adlinktech.com](http://www.adlinktech.com).
Maintenance:
The fanless design minimizes maintenance requirements. Periodic dust removal and connector inspection are recommended. Firmware and BIOS updates can be applied via USB or network.
System Management:
Integrated SEMA 3.0 (ADLINK Smart Embedded Management Agent) provides real‑time monitoring of temperature, voltage, and system health parameters for predictive maintenance.
End‑of‑Life and Environmental Responsibility:
Compliant with EU RoHS and WEEE directives. ADLINK encourages proper recycling and disposal of electronic equipment and batteries.
### Summary
The ADLINK MXC‑6403D/M4G is a robust, fanless, and highly expandable embedded computer engineered for industrial and transportation environments requiring reliable, long‑life operation. With its Intel® Core™ i3‑6100E processor, triple Gigabit Ethernet, multi‑display 4K graphics, and comprehensive I/O suite, it delivers a balanced combination of performance, ruggedness, and flexibility. Its wide temperature tolerance, shock and vibration resistance, and support for RAID storage and remote management make it ideal for automation control, edge computing, and mission‑critical applications in harsh industrial settings.
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MXC-6400Series_Datasheet_en_1.pdf
PDF Catalog
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MXC-6400_PRE_en.pdf
Manual
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