- **CompactPCI 3U Architecture:** Fully compliant with PICMG 2.0 R2.1 CompactPCI specifications, supporting 32‑bit bus operation. - **Rear I/O Configuration:** Equipped with the cBP‑3208R backplane, enabling rear I/O connectivity for enhanced system integration and cable management. - **Integrated Display:** Built‑in 6.4‑inch high‑brightness TFT LCD (640×480 resolution, 300 cd/m²) with optional touch screen interface. - **Universal AC Power Supply:** Incorporates the cPS‑150R 175 W redundant AC power supply, providing hot‑swappable operation and high reliability. - **Redundant Power Option:** Supports dual cPS‑150R modules for fault‑tolerant power delivery. - **Cooling System:** Two high‑efficiency 50 CFM DC brushless fans with removable air filters and fan‑failure detection circuitry. - **Mechanical Design:** 19‑inch rack‑mountable 3U chassis (4U overall height with feet), aluminum alloy construction with side handles for portability. - **EMC Shielding:** Comprehensive electromagnetic compatibility protection with conductive gaskets on front, rear, and side panels. - **Modular Sub‑system:** Compatible with ADLINK’s cPCI‑PSF power supply frame, cPCI‑DBF drive bay frame, and various CompactPCI backplanes. - **Flexible Slot Allocation:** 8‑slot backplane (6 I/O + 1 system + 1 spare) supporting multiple CompactPCI CPU and peripheral boards. - **LCD Controller Compatibility:** Supports cPCI‑8215 (C&T 69000, 2 MB RAM) or cPCI‑8217 (SMI chipset, 4 MB RAM) LCD controller cards. - **Industrial Durability:** Designed for continuous operation in demanding environments with extended temperature tolerance and vibration resistance.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **Dual‑System CompactPCI Platform:** Supports two independent CompactPCI systems within a single 19" 3U chassis, each with its own system slot and I/O configuration. - **Rear I/O Configuration:** Optimized for rear I/O connectivity using the cBP‑3062A backplane, enabling clean front‑panel integration and cable management. - **High‑Reliability Power Architecture:** Equipped with two redundant 175 W AC power supply modules (model cPS‑175R/AC) for fault‑tolerant operation. - **Integrated Cooling System:** Dual high‑efficiency DC brushless fans with removable air filters ensure stable thermal performance. - **CompactPCI 32‑bit 8‑slot Backplane:** Provides one system slot and multiple I/O slots per system, compliant with PICMG 2.0 R2.1 and PICMG 2.11 power standards. - **Industrial‑Grade Construction:** Rugged 19" rack‑mount chassis with EMC shielding, removable handles, and optional desktop foot stands. - **Flexible Power Input:** Universal AC input (90–264 V AC) with active power factor correction and surge protection. - **Hot‑Swappable Redundant PSU:** Each cPS‑175R/AC module supports hot‑swap replacement and current sharing per PICMG 2.11. - **Comprehensive System Integration:** Compatible with ADLINK CompactPCI CPU boards, I/O modules, and LCD kits for embedded or industrial control applications.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **Dual‑System Architecture:** Two independent CompactPCI subsystems housed in one 3U chassis, each with its own system slot and I/O slots. - **CompactPCI Compliance:** Fully compliant with PICMG 2.0 R2.1 and PICMG 2.11 power interface standards. - **High‑Reliability Power:** Equipped with two cPS‑175R/AC 175 W redundant, hot‑swappable power supply units providing universal AC input (90–264 V AC). - **Integrated Cooling:** Dual or quad 12 V DC brushless fans (depending on configuration) delivering up to 60 CFM airflow per fan, with removable filters and fan‑failure detection. - **Backplane Integration:** Utilizes the cBP‑3062A 32‑bit, 8‑slot CompactPCI backplane supporting dual 47‑pin redundant PSU connectors. - **Mechanical Robustness:** Heavy‑duty aluminum chassis with EMC shielding gaskets on all panels and rails. - **Flexible Mounting:** Rack‑mountable 19‑inch form factor with optional desktop feet and side handles for portable instrumentation. - **Thermal Management:** Bottom‑mounted fan tray with current‑controlled fan operation and fault monitoring. - **Modular Expandability:** Supports multiple backplane and PSU options for customized system configurations. - **Serviceability:** Hot‑swappable power modules and easily removable fan assemblies for minimal downtime.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **CompactPCI Standard Compliance:** Fully compliant with PICMG 2.0 R2.1 CompactPCI specifications. - **Form Factor:** Standard 19‑inch rack‑mount chassis, 4U in height, supporting 3U CompactPCI boards. - **Slot Configuration:** 8‑slot backplane (7 I/O slots + 1 system slot). - **Rear I/O Capability:** Available in standard (front I/O) or “R” variant (rear I/O) configurations. - **Redundant Power Supply:** Equipped with two hot‑swappable 175 W cPS‑150R or cPS‑175/AC redundant AC power supply modules for high availability. - **Backplane:** Uses cBP‑3208P (32‑bit CompactPCI backplane with power interface) and cBP‑3052 or cBP‑3062 redundant power backplane. - **Cooling System:** Two integrated 50 CFM DC brushless fans with removable air filters for efficient self‑cooling. - **EMC Shielding:** Comprehensive electromagnetic compatibility protection with EMC gaskets on front, rear, and side panels. - **Mounting Flexibility:** Suitable for both rack‑mount and desktop use; includes side handles and adjustable foot stands. - **Modular Design:** Supports multiple backplane and power configurations for flexible system integration. - **Industrial Durability:** Rugged aluminum chassis with removable fan modules and high‑reliability connectors. - **Serviceability:** Hot‑swappable power modules and accessible fan assemblies simplify maintenance.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **High-Density Slot Configuration:** Supports up to 14 CompactPCI slots in a 19-inch 6U rackmount chassis, enabling high system integration and modular expansion. - **Dual Independent PCI Buses:** Incorporates two independent PCI buses, allowing up to 13 I/O slots in a single system for enhanced bandwidth and parallel processing. - **Redundant Power Supply System:** Equipped with four hot-swappable, redundant power supply modules to ensure uninterrupted operation and fault tolerance. - **Flexible Board Support:** Accommodates both 3U and 6U CompactPCI boards, providing flexibility for mixed configurations and diverse application requirements. - **Front and Rear I/O Support:** Offers full front and rear I/O accessibility, facilitating versatile system design and simplified cable management. - **Mission-Critical Design:** Built for high reliability and continuous uptime, suitable for defense, aerospace, transportation, and industrial control systems. - **Integrated Storage Options:** Includes two 5.25-inch disk drive bays for optical drives or additional storage devices. - **9U Rackmount Form Factor:** The overall chassis height is 9U, allowing integration into standard 19-inch rack systems with sufficient space for cooling and cable routing. - **Scalable and Modular Architecture:** Designed for easy expansion and maintenance, supporting a wide range of CompactPCI CPU and peripheral boards. - **Optimized Cooling and Airflow:** Engineered with efficient thermal management to maintain stable operation under heavy workloads.

Manufacturer: Adlink Technology Inc.

Category: cPCI CPU Card P-III Level 6U

- **CompactPCI 19" 6U Platform:** Designed according to the PICMG 2.x CompactPCI standard, ensuring compatibility with a wide range of cPCI boards and modules. - **14-Slot Backplane Configuration:** Supports up to 13 I/O slots plus one system slot, enabling extensive expansion and modular system design. - **Dual Independent PCI Buses:** Provides two separate PCI buses for enhanced bandwidth and system segmentation, allowing simultaneous operation of multiple subsystems. - **H.110 Telephony Bus Support:** Fully compliant with the H.110 CTI (Computer Telephony Integration) standard, enabling high-speed time-division multiplexed (TDM) voice and data communication between telephony boards. - **Redundant Hot-Swappable Power Supplies:** Equipped with four redundant power supply modules, ensuring continuous operation and high availability. Each power supply can be replaced without system downtime. - **Flexible 3U/6U Board Combination:** Supports both 3U and 6U CompactPCI boards, allowing mixed configurations for diverse application requirements. - **Front and Rear I/O Capability:** Provides full front and rear I/O access for maximum connectivity and system integration flexibility. - **48V DC Power Input:** Optimized for telecom environments with 48V DC input, ensuring compatibility with standard telecommunications power systems. - **Integrated Drive Bays:** Includes two 5.25-inch drive bays for optical drives, removable storage, or other peripheral devices. - **9U Rackmount Form Factor:** Designed for standard 19-inch rackmount installations, occupying 9U of vertical rack space for efficient use of rack real estate. - **High Reliability and Serviceability:** Modular design with hot-swappable components minimizes downtime and simplifies maintenance. - **Optimized for CTI Applications:** Ideal for computer telephony, voice processing, VoIP gateways, and other communication infrastructure systems.

Manufacturer: Adlink Technology Inc.

Category: cPCI CPU Card P-III Level 6U

- **CompactPCI Standard Compliance:** Fully compliant with PICMG 2.0 R2.1 CompactPCI specifications, ensuring interoperability with standard CompactPCI CPU and I/O boards. - **Form Factor:** Standard 19‑inch rack‑mount width, 3U height chassis. - **Integrated Display:** Built‑in high‑brightness 6.4‑inch TFT LCD panel (640×480 resolution, 300 cd/m² brightness) for system monitoring and user interface display. - **Power Supply:** Integrated 175 W universal AC input power supply (model cPS‑150R) supporting redundant operation and hot‑swappable capability. - **Backplane:** Equipped with cBP‑3106P 32‑bit CompactPCI backplane with 6 slots (1 system slot + 5 I/O slots). - **EMC Shielding:** Comprehensive electromagnetic compatibility protection with EMC gaskets on front and rear rails. - **Construction:** Rugged aluminum chassis for industrial durability and thermal stability. - **Cooling:** External fan recommended for optimal thermal management. - **Expandability:** Supports up to 8 CompactPCI slots (depending on configuration) with modular backplane and PSU options. - **Display Control:** Compatible with optional LCD controller cards (cPCI‑8215 or cPCI‑8217). - **Ease of Integration:** Modular sub‑system design allows flexible configuration for embedded, industrial, or instrumentation applications.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **CompactPCI 3U Form Factor:** Fully compliant with PICMG 2.0 R2.1 CompactPCI standards, supporting 32‑bit bus architecture. - **Integrated Display:** Built‑in 6.4‑inch high‑brightness TFT LCD (640×480, 262K colors) for local monitoring and control. - **Universal AC Power Supply:** Equipped with a 175 W cPS‑150R power supply supporting 90–264 VAC input range. - **8‑Slot Backplane:** Utilizes the cBP‑3108P 32‑bit CompactPCI backplane, providing one system slot and up to six I/O slots. - **Cooling System:** Two integrated 50 CFM DC brushless fans with removable air filters for efficient thermal management. - **Mechanical Design:** 19‑inch rack‑mountable 4U chassis with side handles for portability and adjustable foot stands for desktop use. - **EMC Shielding:** Comprehensive electromagnetic compatibility protection with gaskets on front, rear, and side panels. - **Hot‑Swappable Power Supply:** Supports redundant PSU configurations for high availability. - **Modular Architecture:** Compatible with multiple ADLINK backplanes, power modules, and LCD controller cards (cPCI‑8215 or cPCI‑8217). - **Industrial Durability:** Designed for continuous operation in harsh environments with extended temperature tolerance and vibration resistance.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **CompactPCI 3U Rear I/O Platform:** Designed for 19‑inch rack‑mount integration, supporting 8 CompactPCI slots with rear I/O capability. - **Integrated Display:** Built‑in 6.4‑inch high‑brightness TFT LCD (350 cd/m² typical) with VGA interface for local system monitoring. - **Rear I/O Configuration:** Utilizes the cBP‑3206R 32‑bit CompactPCI backplane with rear I/O connectors for enhanced system flexibility. - **High‑Reliability Power System:** Equipped with dual redundant 175 W power supplies (cPS‑150R) for continuous operation and hot‑swappable maintenance. - **Modular Architecture:** Supports multiple backplane and PSU configurations (cBP‑3052E, cBP‑3206R, cPS‑150R) for scalable system design. - **Industrial‑Grade Construction:** Aluminum chassis with EMC shielding, designed for high mechanical rigidity and thermal stability. - **Cooling Support:** External fan recommended; compatible with ADLINK’s modular fan assemblies for forced‑air cooling. - **Compact Form Factor:** 3U height, 19‑inch rack width, optimized for embedded and industrial computing environments. - **Compliant with PICMG Standards:** Fully compliant with CompactPCI PICMG 2.0 R2.1 and power interface PICMG 2.11 specifications. - **Flexible Mounting:** Suitable for rack‑mount or desktop use; optional handles and foot stands available. - **System Expandability:** Supports CPU, I/O, and peripheral modules in standard CompactPCI 3U format.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **CompactPCI 3U/4U Architecture:** Standard 19‑inch rack‑mountable 4U enclosure designed for 3U CompactPCI boards. - **Rear I/O Configuration:** Supports rear I/O connectivity via cBP‑3208R backplane, enabling high‑density signal routing and improved cable management. - **Redundant Power System:** Equipped with two cPS‑150R 175 W universal AC redundant power supply units for high availability and hot‑swappable operation. - **Backplane Integration:** Uses cBP‑3208P or cBP‑3208R 32‑bit CompactPCI backplane with PICMG 2.0 R2.1 compliance and optional rear I/O. - **Cooling System:** Dual 50 CFM DC brushless fans with removable air filters for efficient forced‑air cooling and easy maintenance. - **Mechanical Design:** Rugged 19‑inch 4U chassis with side handles for portability and adjustable foot stands for desktop use. - **EMC Shielding:** Comprehensive electromagnetic compatibility protection with EMC gaskets on front/rear rails and side panels. - **Scalability:** Supports up to 8 CompactPCI slots (1 system + 7 I/O) with flexible backplane and power configurations. - **Hot‑Swappable PSU Modules:** Power modules can be replaced without system shutdown, ensuring continuous operation. - **Compliance:** Fully compliant with PICMG 2.0 R2.1 (CompactPCI) and PICMG 2.11 (Power Interface) standards.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **CompactPCI Standard Compliance:** Fully compliant with PICMG 2.0 R2.1 CompactPCI specifications. - **Form Factor:** Standard 19‑inch rack‑mountable 3U chassis (4U height with feet). - **Rear I/O Configuration:** Equipped with cBP‑3206R backplane supporting rear I/O connectivity for system and peripheral modules. - **Integrated Display:** High‑brightness 6.4‑inch TFT LCD (640×480, 18‑bit color, 300 cd/m²) with optional touchscreen interface. - **Redundant Power System:** Dual 175 W universal AC input redundant power supplies (cPS‑175R/AC) for high availability and hot‑swappable operation. - **Cooling System:** Two high‑efficiency 50 CFM DC brushless fans with removable air filters and fan‑failure detection. - **Mechanical Design:** Rugged aluminum chassis with side handles for portability and adjustable foot stands for desktop use. - **EMC Shielding:** Comprehensive electromagnetic compatibility protection with EMC gaskets on front, rear, and side panels. - **Modular Architecture:** Supports up to 8 CompactPCI slots (6+3 configuration) with 32‑bit bus width and rear I/O capability. - **System Integration:** Designed for industrial computing, instrumentation, and embedded control applications requiring high reliability and modular expandability.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **CompactPCI Standard Compliance:** Fully compliant with PICMG 2.0 R2.1 (CompactPCI) and PICMG 2.11 (power interface) specifications. - **13‑Slot Backplane:** Integrated cBP‑3213P 32‑bit backplane supporting one system slot and up to 12 peripheral I/O slots. - **Rear I/O Capability:** Rear transition module support for enhanced connectivity and cable management. - **Integrated Power Supply:** Factory‑installed AC power supply (3AC) providing stable, redundant power for industrial applications. - **High Mechanical Integrity:** Rugged 19‑inch rack‑mount chassis with 4U height, designed for both rack and desktop use. - **Efficient Cooling:** Dual or quad 12 V DC brushless fans with removable air filters and bottom‑mounted airflow design. - **EMC Shielding:** Comprehensive electromagnetic compatibility protection with conductive gaskets on front, rear, and side panels. - **Flexible Configuration:** Supports multiple CompactPCI backplane options, redundant PSU configurations, and optional LCD or drive bay modules. - **Serviceability:** Hot‑swappable power modules and easily removable fan assemblies for quick maintenance. - **Industrial Reliability:** Designed for continuous operation in harsh environments, with wide temperature tolerance and high MTBF components.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **CompactPCI Standard Compliance:** Fully compliant with PICMG 2.0 R2.1 CompactPCI specifications, supporting 3U form factor boards. - **High‑Density Backplane:** Integrated 13‑slot 32‑bit CompactPCI backplane (model cBP‑3213P) with bridge card for system expansion and bus segmentation. - **Integrated Power Supply:** Equipped with a built‑in AC power supply unit (3AC configuration) providing stable and redundant power for industrial operation. - **Modular Design:** Supports multiple configurations using ADLINK’s cBP‑3100/3200 backplane series and cPS‑150R or cPS‑175 redundant power supplies. - **Mechanical Robustness:** 19‑inch rack‑mountable 4U enclosure with reinforced aluminum frame, removable air filters, and EMC shielding. - **Cooling System:** Dual or quad 12 V DC brushless fans (50–60 CFM each) with fan controller, current regulation, and failure detection. - **Flexible Mounting:** Suitable for both rack‑mount and desktop use; includes side handles and adjustable foot stands. - **EMC Protection:** Comprehensive electromagnetic compatibility shielding with conductive gaskets on front, rear, and side panels. - **Serviceability:** Hot‑swappable power modules and easily removable fans and filters for simplified maintenance. - **Scalability:** Supports single or dual system configurations, optional LCD front panel, and rear I/O capability.

Manufacturer: Adlink Technology Inc.

Category: cPCI 3U 19'' Chassis

- **Dual Independent CAN Channels:** Two fully isolated CAN ports capable of independent or bridged operation. - **CAN Specification Compliance:** Fully compatible with Bosch CAN Specification 2.0A (11‑bit ID) and 2.0B (29‑bit ID). - **Optical Isolation:** 2500 Vrms galvanic isolation between CAN channels and system bus for enhanced noise immunity and protection. - **High‑Speed Communication:** Programmable transfer rates up to 1 Mbps; supports standard DeviceNet baud rates of 125 Kbps, 250 Kbps, and 500 Kbps. - **Bridge Function:** Enables inter‑CAN communication or network bridging between two CAN buses. - **Direct Memory Mapping:** Provides direct memory‑mapped access to CAN controllers for low‑latency data exchange. - **Integrated CAN Controller:** Utilizes Philips SJA1000 CAN controller for robust bus arbitration, error detection, and automatic retransmission. - **CAN Transceiver:** Employs Philips 82C250 transceivers for reliable differential signaling (CAN_H, CAN_L). - **Plug‑and‑Play Configuration:** Fully compliant with CompactPCI plug‑and‑play architecture; no manual jumper configuration required. - **Software Support:** Includes DOS libraries, Windows 95/98/NT drivers, and example programs. - **Application Layer Support:** Provides master interface support for CANopen, DeviceNet, and Smart Distributed System (SDS) protocols. - **Industrial‑Grade Design:** Wide operating temperature range (0 °C – 60 °C) and humidity tolerance (5 % – 95 % non‑condensing). - **Comprehensive Software API:** Extensive function library for CAN and DeviceNet operations, including message handling, error management, and event callbacks.

Manufacturer: Adlink Technology Inc.

Category: CAN Bus

- **Dual Independent CAN Channels:** Two fully independent CAN 2.0A/B compliant ports, each capable of operating separately or bridged for network redundancy or gateway applications. - **Optical Isolation:** 2500 Vrms galvanic isolation between CAN channels and system bus, ensuring robust protection against electrical noise and ground loops. - **High‑Speed Communication:** Supports programmable baud rates up to 1 Mbps; standard DeviceNet rates of 125 kbps, 250 kbps, and 500 kbps are pre‑configured. - **Bridge Functionality:** Allows inter‑CAN communication bridging for network segmentation or protocol conversion. - **CAN Controller:** Philips/NXP SJA1000 CAN controller with advanced error detection, bus arbitration, and automatic retransmission. - **CAN Transceiver:** Philips 82C250 transceivers providing differential signal interface (CAN_H, CAN_L). - **Plug‑and‑Play Configuration:** Fully PCI Plug‑and‑Play compliant; no manual jumper or address configuration required. - **Rear I/O Connectivity:** CompactPCI rear I/O interface for backplane signal routing, minimizing front‑panel cabling. - **Software Support:** Comprehensive driver and library support for DOS, Windows 95/98, and Windows NT environments. - **Application Layer Support:** Built‑in software library for CANopen, DeviceNet, and SDS (Smart Distributed System) protocols. - **Diagnostic and Control Functions:** LED status indicators, error counters, and programmable error warning limits. - **Industrial‑Grade Design:** Operating temperature 0 °C – 60 °C, humidity 5 % – 95 % non‑condensing.

Manufacturer: Adlink Technology Inc.

Category: CAN Bus

- **High-Speed Data Transfer:** - Achieves up to **12 MB/s** transfer rate using bus-mastering DMA. - Supports multiple transfer modes: programmed I/O, interrupt-driven, timer pacer, external clock, and handshaking. - **Digital I/O Configuration:** - **32 TTL-compatible digital inputs** and **32 TTL-compatible digital outputs**. - **4 auxiliary digital input/output channels** (exclusive to cPCI-7200). - **2k + 8-word (32-bit) FIFO buffer** for digital input channels, ensuring stable high-speed data acquisition. - **Programmable Timing and Control:** - Integrated **82C54-10 programmable counter/timer** with 4 MHz base clock. - Independent timers for input and output pacing (Timer 0 for DI, Timer 1 for DO). - Supports cascaded timer configurations for extended frequency control. - **Bus Interface:** - CompactPCI 32-bit, 33 MHz bus interface. - Fully Plug-and-Play compliant; no jumper or DIP switch configuration required. - Automatic resource allocation via system BIOS. - **Electrical Isolation and Protection:** - 2.5 kV isolation between channels for signal integrity and protection. - Schottky diode termination on input channels to minimize signal reflection and noise. - **Software and OS Support:** - Compatible with **Windows 7/Vista/XP/2000/2003** and **Linux**. - Supported by ADLINK’s **DAQPilot**, **DAQBench**, **PCIS-DASK**, and **DAQ-MTLB** drivers. - Integration with **LabVIEW®**, **MATLAB®**, **HP-VEE**, and **ISaGRAF™** environments. - **Industrial Design:** - Rugged 3U CompactPCI construction with a **100-pin SCSI-II connector**. - Designed for high-reliability industrial automation, test, and measurement systems.

Manufacturer: Adlink Technology Inc.

Category: DIO Isolated PXI/PXIe/cPCI

- **CompactPCI Compliance:** Fully compliant with PICMG 2.0 CompactPCI R2.1 and PCI Rev. 2.1 standards. - **Processor Support:** Socket 370 FC‑PGA Pentium III (up to 850 MHz) or Celeron (up to 733 MHz). - **Chipset:** Intel 440BX AGPset (82443BX + 82371EB PIIX4E). - **Memory:** One 144‑pin SO‑DIMM socket supporting up to 256 MB unbuffered SDRAM; optional ECC support. - **Storage:** Integrated 2.5‑inch HDD bay (supports Flash2000™ flash disk 8 MB–1 GB); DiskOnChip socket up to 144 MB. - **Display:** SMI Lynx3DM SM721 AGP 2× VGA/LCD controller with 4 MB VRAM; supports dual and simultaneous VGA/LCD output. - **Networking:** Intel 82559 10/100 Mb Ethernet controller with PXE remote boot support. - **I/O Interfaces:** - 2 × USB 1.1 ports (front) - 2 × serial ports (COM1 RS‑232; COM2 RS‑232/422/485) - 1 × parallel port (SPP/EPP/ECP) - PS/2 keyboard and mouse connectors - VGA (DB‑15) and LCD (44‑pin) outputs - **Watchdog Timer:** Programmable 1–255 seconds/minutes with software library support. - **Hardware Monitoring:** Winbond W83782D monitors CPU/system temperature, fan speed, and voltages. - **Form Factor:** 3U CompactPCI, 2‑slot (8 TE/HP) width for the ‑2S variant. - **Environmental Robustness:** Designed for harsh industrial environments with extended temperature and vibration tolerance. - **Certifications:** CE, FCC, HALT tested.

Manufacturer: Adlink Technology Inc.

Category: cPCI CPU P-III Level

- **CompactPCI 3U Form Factor:** Fully compliant with PICMG 2.0 R2.1 and PCI Rev. 2.1 specifications. - **Processor Support:** Socket-370 FC-PGA Pentium III (up to 850 MHz) or Celeron (up to 733 MHz). - **Chipset:** Intel 440BX AGPset (82443BX + 82371EB PIIX4E). - **Memory:** One 144-pin SO-DIMM socket supporting up to 256 MB SDRAM (optional ECC). - **Storage:** Integrated 2.5" HDD bay (up to 4.8 GB standard), optional slim 3.5" FDD, and DiskOnChip socket (up to 144 MB). - **Graphics:** SMI Lynx3DM SM721 AGP 2x VGA/LCD controller with 4 MB VRAM (8 MB optional). - **Display Support:** VGA up to 1600×1200, LCD up to 1024×768 (24-bit RGB-TFT), dual/simultaneous display. - **Networking:** Intel 82559 10/100Base-TX Ethernet controller with PXE remote boot support. - **I/O Interfaces:** - 2× USB 1.1 ports - 2× serial ports (COM1 RS-232, COM2 RS-232/422/485) - 1× parallel port (SPP/EPP/ECP) - PS/2 keyboard and mouse ports - **Watchdog Timer:** Programmable 1–255 seconds/minutes with software library support. - **Hardware Monitoring:** Winbond W83782D monitors CPU/system temperature, fan speed, and voltages. - **Power Management:** ACPI and BIOS-level green functions. - **Form Factor Options:** - cPCI-3700A: 3-slot (12TE/HP) with HDD and FDD - cPCI-3700A-2S: 2-slot (8TE/HP) with HDD only - **Operating Systems Supported:** Windows 95/98/ME/NT/2000, Linux, OS/2, SCO Unix, QNX, Solaris. - **Industrial Design:** Built for harsh environments with vibration and shock resistance.

Manufacturer: Adlink Technology Inc.

Category: cPCI CPU P-III Level

- **CompactPCI Compliance:** Fully compliant with PICMG 2.0 CompactPCI Specification Revision 2.1 and PCI 2.1 standards. - **Processor Support:** Socket‑370 FC‑PGA Pentium‑III (up to 850 MHz) or Celeron (up to 733 MHz) CPUs with on‑die L2 cache. - **Chipset:** Intel 440BX AGPset (82443BX + 82371EB PIIX4E). - **Memory:** One 144‑pin SO‑DIMM socket supporting up to 256 MB unbuffered SDRAM; optional ECC support for OEM configurations. - **Storage:** Integrated 2.5‑inch HDD bay (supports Flash2000™ flash disks 8 MB–1 GB) and DiskOnChip socket (up to 144 MB). - **Display:** On‑board SMI Lynx3DM SM721 AGP 2× VGA/LCD controller with 4 MB VRAM (8 MB optional); supports dual and simultaneous VGA/LCD display. - **Networking:** Intel 82559 10/100 Mb Ethernet controller with PXE remote‑boot capability. - **I/O Interfaces:** - 2 × USB 1.1 ports (front) - 2 × serial ports (COM1 RS‑232; COM2 RS‑232/422/485) - 1 × parallel port (SPP/EPP/ECP) - PS/2 keyboard and mouse connectors - VGA (DB‑15) and 24‑bit RGB‑TFT LCD connector - **Peripheral Expansion:** Supports up to 7 bus‑master PCI devices on CompactPCI peripheral slots. - **Watchdog Timer:** Programmable 1–255 seconds/minutes with software library support for DOS/Windows. - **Hardware Monitoring:** Winbond W83782D monitors CPU/system temperature, fan speed, and DC voltages. - **Power Management:** Award PnP BIOS with green functions, DMI support, and BIOS write protection. - **Environmental Robustness:** Designed for industrial environments with extended temperature, vibration, and shock tolerance. - **Rear I/O Transition Module:** cPCI‑R3700A provides additional connectors for COM2 and LCD interfaces.

Manufacturer: Adlink Technology Inc.

Category: cPCI CPU P-III Level

- **CompactPCI Compliance:** Fully compliant with PICMG 2.0 CompactPCI Specification Revision 2.1 and PCI Revision 2.1. - **Processor Support:** Socket-370 FC-PGA Pentium III (up to 850 MHz) or Celeron (up to 733 MHz) CPUs. - **Memory:** One 144-pin SO-DIMM socket supporting up to 256 MB unbuffered SDRAM; optional ECC support for OEM configurations. - **Chipset:** Intel 440BX AGPset (82443BX + 82371EB PIIX4E). - **Integrated Graphics:** SMI Lynx3DM SM721 AGP 2x VGA/LCD controller with 4 MB VRAM (8 MB optional for OEM). Supports resolutions up to 1600×1200 (VGA) and 1024×768 (LCD). - **Networking:** Intel 82559 10/100 Mbps Ethernet controller with PXE remote boot support. - **Storage:** Built-in 2.5" HDD housing, two 44-pin EIDE connectors, and one DiskOnChip socket (up to 144 MB). - **I/O Interfaces:** Two USB 1.1 ports, two serial ports (COM1 RS-232, COM2 RS-232/422/485), one parallel port, PS/2 keyboard and mouse connectors. - **Form Factor:** 3U CompactPCI (160 mm × 100 mm), available in 12TE/HP (with FDD) or 8TE/HP (without FDD) widths. - **Environmental Design:** Operates from 0°C to 60°C, designed for industrial vibration and shock tolerance. - **System Monitoring:** Onboard Winbond W83782D hardware monitor for temperature, fan speed, and voltage. - **Watchdog Timer:** Programmable watchdog with 1–255 second or minute intervals. - **BIOS:** Award PnP BIOS with 2 Mb Flash ROM, DMI support, and BIOS write protection. - **Power Management:** ACPI and APM support, BIOS-controlled green functions. - **Certifications:** CE, FCC, HALT tested for temperature and vibration stress.

Manufacturer: Adlink Technology Inc.

Category: cPCI CPU P-III Level

- **CompactPCI Compliance:** Fully compliant with PICMG 2.0 CompactPCI R2.1 and PCI Rev. 2.1 standards. - **Processor Support:** Socket‑370 FC‑PGA Pentium III (up to 850 MHz, 256 KB L2 cache, 100 MHz FSB) or Celeron (up to 733 MHz, 128 KB L2 cache, 66 MHz FSB). - **Memory:** One 144‑pin SO‑DIMM socket supporting up to 256 MB SDRAM (optional ECC). - **Chipset:** Intel 440BX AGPset (82443BX + 82371EB PIIX4E). - **Graphics:** SMI Lynx3DM SM721 AGP 2× controller with 4 MB VRAM (8 MB optional OEM). - VGA up to 1600×1200 (16‑bit color) or 1280×1024 (24‑bit color). - LCD support up to 1024×768 24‑bit RGB‑TFT. - Dual display (VGA + LCD) and simultaneous output. - **Networking:** Intel 82559 10/100 Mb Ethernet controller with PXE remote boot support. - **Storage:** - Integrated 2.5″ HDD bay (20 GB standard). - Two 44‑pin EIDE connectors supporting up to four IDE devices (UDMA/33). - DiskOnChip socket (up to 144 MB). - **I/O Interfaces:** - 2 × USB 1.1 ports (front). - 2 × serial ports (COM1 RS‑232 front, COM2 RS‑232/422/485 rear). - 1 × parallel port (Mini D‑Sub 26‑pin). - PS/2 keyboard and mouse connectors. - VGA (DB‑15), Ethernet (RJ‑45), Reset switch, LED indicators. - **Watchdog Timer:** Programmable 1–255 seconds or minutes with software library support for DOS/Windows. - **Hardware Monitoring:** Winbond W83782D monitors CPU temperature, fan speed, voltages. - **Form Factor:** 3U CompactPCI (160 × 100 mm), available in 2‑slot (8 TE/HP) and 3‑slot (12 TE/HP) widths. - **Environmental Design:** Industrial‑grade operation (0 – 60 °C), shock and vibration tested. - **Certifications:** CE, FCC, HALT tested for temperature and vibration stress. - **Power Management:** Award PnP BIOS with green function and DMI support. - **Software Support:** Drivers for Windows 95/98/ME/NT/2000, Linux, OS/2, Novell, SCO Unix, QNX, Solaris.

Manufacturer: Adlink Technology Inc.

Category: cPCI CPU P-III Level

- **CompactPCI Compliance:** Fully compliant with PICMG 2.0 CompactPCI Specification Revision 2.1 and PCI Revision 2.1. - **Processor Support:** Socket-370 FC-PGA Pentium III (up to 850 MHz) or Celeron (up to 733 MHz) CPUs. - **Chipset:** Intel 440BX AGPset (82443BX + 82371EB PIIX4E). - **Memory:** One 144-pin SO-DIMM socket supporting up to 256 MB unbuffered SDRAM; optional ECC support. - **Storage Integration:** Built-in housing for 2.5" low-profile HDD and separable slim-type 3.5" FDD. - **Display:** Onboard SMI Lynx3DM SM721 AGP 2x VGA/LCD controller with 4 MB VRAM (8 MB optional for OEM). - VGA up to 1600×1200 resolution. - LCD up to 1024×768 (24-bit RGB-TFT). - Dual and simultaneous VGA/LCD display support. - **Networking:** Integrated Intel 82559 10/100 Mbps Ethernet controller with PXE remote boot support. - **I/O Interfaces:** - 2 × USB 1.1 ports. - 2 × serial ports (COM1 RS-232; COM2 RS-232/422/485 selectable). - 1 × parallel port (SPP/EPP/ECP). - PS/2 keyboard and mouse connectors. - **Expansion:** Supports up to 7 PCI bus-mastering devices on CompactPCI peripheral slots. - **Watchdog Timer:** Programmable 1–255 seconds/minutes with software library support. - **Hardware Monitoring:** Winbond W83782D monitors CPU/system temperature, fan speed, and voltages. - **Form Factor:** 3U CompactPCI (160 mm × 100 mm), available in 12TE/HP (with FDD) or 8TE/HP (without FDD). - **Environmental Robustness:** Designed for industrial environments with extended temperature and vibration tolerance. - **Certifications:** CE, FCC, HALT tested for temperature and vibration stress.

Manufacturer: Adlink Technology Inc.

Category: cPCI CPU P-III Level

- **High‑Density Gigabit Switching:** 12×10/100/1000Base‑T(X) ports (4×RJ‑45 front, 8×backplane) with auto‑negotiation and auto‑MDI/MDI‑X. - **CompactPCI Integration:** Fully compliant with PICMG 2.0 Rev. 3.0; supports 3U, 8HP form factor with hot‑swap capability. - **Industrial‑Grade Design:** EN50155‑certified for railway and vehicle applications; wide operating temperature range from ‑40 °C to +70 °C. - **Advanced Redundancy:** Supports ORing’s proprietary O‑Ring and O‑Chain technologies (recovery

Manufacturer: Oring

Category: Switch Card

- **CompactPCI 3U 8HP form factor** with hot‑swap capability - **12×10/100/1000Base‑T(X)** ports (4 M12 A‑coded front, 8 CompactPCI backplane) - **EN50155 railway compliance** for vibration, shock, and temperature extremes - **Fast Ethernet redundancy** via ORing’s proprietary **O‑Ring** (

Manufacturer: Oring

Category: Switch Card

- **CompactPCI 3U Form Factor:** 16HP width, hot-swappable design compatible with PICMG 2.0 CompactPCI systems. - **High Port Density:** 14 Gigabit Ethernet ports (10/100/1000Base-T(X)) plus 2 two-wire extension ports. - **Redundant Ethernet Ring:** Supports ORing’s proprietary O-Ring and O-Chain redundancy technologies with recovery times under 30 ms across up to 250 units. - **EN50155 Compliance:** Certified for railway and transportation applications, ensuring vibration, shock, and temperature resilience. - **Wide Temperature Range:** Operates reliably from **–40°C to +70°C**, suitable for harsh industrial environments. - **Advanced Network Management:** Web-based GUI, Telnet, CLI (console), and centralized management via ORing’s management software. - **Comprehensive Protocol Support:** STP/RSTP/MSTP, MRP, VLAN, QoS, IGMP Snooping, Modbus TCP, DHCP, SNMPv3, HTTPS, SSH. - **Enhanced Security:** Device Binding, 802.1x authentication, MAC-based port security, RADIUS integration, and DoS/DDoS prevention. - **Energy Efficiency:** IEEE 802.3az Energy-Efficient Ethernet reduces power consumption during low data activity. - **High Switching Performance:** 28.4 Gbps switching bandwidth, 7 µs latency, 8K MAC address table, and 9.6K jumbo frame support. - **CompactPCI Bus Powered:** 5VDC input, typical power consumption 21.5W with overload protection. - **Long-Term Reliability:** 5-year warranty and industrial-grade components for extended service life.

Manufacturer: Oring

Category: Switch Card