MVP-6022

i5-6500TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

Powerful processors combined with PCI/PCIe high-speed expansion slots in a compact chassis that enables integration of a wide range of applications.

Description

  • Fanless expandable embedded computer with Intel Q170 chipset
  • Intel Core i7-6700TE Skylake CPU
  • 2* DDR4-SODIMM RAM slots (up to 32GB total capacity)
  • 2* PCIe x8 and 2* PCI expansion slots
  • 1* MiniPCIe with USIM socket
  • 1* internal SATA III high speed 6Gb/s port
  • 3* Intel I211AT GbE ports with teaming function
  • 8* DIO
  • 2* RS232/422/485 and 2* RS232 ports
  • 4* USB 3.0 and 2* USB 2.0 (all 1600mA) and 1* internal USB 2.0 ports
  • 12...24VDC power input
  • operating temperature 0...50°C
  • wall mount kit included
  • 208.7*210*220mm
  • 4.7 kg
  • Adlink

Details

  • Width: 220 mm
  • Height: 210 mm
  • Depth: 208.7 mm
  • Net weight: 4.7 kg
  • Weight: 5.2kg
  • Manufacturer: Adlink Technology Inc.
  • Country of Origin: Taiwan R.O.C.
  • Customs code: 8471 5000 000

Data Sheets

Manuals

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