Comprehensive Product Summary – ADLINK MXE‑210 Series Ultra‑Compact Embedded Platform

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### 1. Product Overview

Product Name: MXE‑210 Series
Model Variants: MXE‑211, MXE‑212, MXE‑211‑ET, MXE‑212‑ET, MXE‑212‑WT, MXE‑211‑S, MXE‑212‑S
Series: Matrix Embedded Platform Series
Article Number: MXE‑210‑Series
Manufacturer: ADLINK Technology, Inc.
Product Type: Intel® Atom® E3900‑based ultra‑compact fanless embedded computer
Part Number (Manual): 50‑1Z242‑1000
Revision: 1.0 (Nov. 30, 2017)

The ADLINK MXE‑210 Series is a rugged, fanless, ultra‑compact embedded computing platform designed for industrial automation, intelligent transportation, facility management, and IoT edge applications. It integrates Intel® Atom® x7‑E3950 or x5‑E3930 processors, providing a balance of performance, power efficiency, and extended environmental endurance in a small form factor.

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### 2. Key Features

- Processor Options:
- Intel® Atom® x7‑E3950 (quad‑core, 1.6 GHz base / 2.0 GHz burst)
- Intel® Atom® x5‑E3930 (dual‑core, 1.3 GHz base / 1.8 GHz burst)

- Compact Fanless Design:
- Dimensions: 140 (W) × 110 (D) × 58 (H) mm
- Weight: 0.95 kg (2.06 lb)
- Full aluminum alloy enclosure for durability and heat dissipation

- Rich I/O and Expansion:
- 1 × DisplayPort 1.2 (DP++) supporting up to 4096 × 2160 @ 60 Hz
- 2 × USB 3.0, 2 × USB 2.0
- 2 × Intel® I210 GbE LAN ports
- 2 × COM ports (BIOS‑selectable RS‑232/422/485)
- 2 × full‑size Mini PCIe slots
- 1 × USIM slot for 3G/4G LTE modules
- 1 × mSATA slot, 1 × Micro SD slot
- Optional 2.5" SATA SSD or isolated 8 DI / 8 DO module (1.5 kV isolation)

- Optional Features:
- eSIM support (project‑based)
- Audio (mic‑in, line‑out/speaker)
- Wireless kits (Wi‑Fi, Bluetooth, 3G, 4G LTE, LoRa)
- 2.5" SATA HDD/SSD kit (P/N 91‑95223‑0010)
- 40 W or 90 W industrial‑grade AC‑DC adapter

- Manageability:
- Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health, watchdog timer, and remote monitoring
- Hardware watchdog timer and BMC support

- Certifications:
- Railway EN50121 compliance
- CE/FCC Class B (EN61000‑6‑4/‑2)
- UL, CB safety certifications

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### 3. Technical Specifications

Processor & Chipset:
- Intel® Atom® E3900 SoC (x7‑E3950 or x5‑E3930)
- Integrated Intel® HD Graphics 500

Memory:
- 1 × DDR3L 1600 MHz SO‑DIMM, 2 GB standard (up to 8 GB supported)

Storage:
- 1 × full‑size mSATA slot
- 1 × Micro SD slot (up to 32 GB)
- Optional 1 × 2.5" SATA SSD or HDD via internal SATA wafer

I/O Interfaces:
- Display: 1 × DisplayPort 1.2 (DP++)
- Ethernet: 2 × Intel® I210 GbE LAN ports (IEEE 802.3az, 1588, 802.1AS)
- Serial: 2 × COM ports (RS‑232/422/485 BIOS‑selectable)
- USB: 2 × USB 3.0 + 2 × USB 2.0
- Audio: Optional mic‑in and line‑out/speaker
- Expansion: 2 × full‑size Mini PCIe slots (1 with USIM support)
- Internal I/O: 2 × I²C wafer, 1 × UART wafer, 1 × USB 2.0 wafer, 1 × USB 2.0 type A dongle

Power Supply:
- DC Input: 6 – 36 VDC (3‑pin pluggable connector with latch)
- Optional AC Input: 40 W or 90 W AC‑DC adapter
- Power Consumption:
- Power off: 3.6 W
- Idle: 11.2 W
- CPU full load: 35.2 W
- System full load: 25 W

Mechanical:
- Dimensions: 140 × 110 × 58 mm (5.5 × 4.3 × 2.3 in)
- Weight: 0.95 kg (2.06 lb)
- Mounting: DIN rail (default), optional wall mount

Environmental:
- Operating Temperature:
- Standard: 0 °C to 50 °C
- Extended: –20 °C to 70 °C (with industrial SSD)
- Wide: –40 °C to 85 °C (with industrial SSD and ETTS kit)
- Storage Temperature: –40 °C to 85 °C
- Humidity: 95 % @ 40 °C (non‑condensing)
- Vibration: 5 Grms (5–500 Hz, 3 axes with SSD)
- Shock: 100 G (half sine 11 ms with SSD)
- ESD: Contact ±4 kV, Air ±8 kV

Security:
- TPM 2.0, Intel® Boot Guard, UEFI Secure Boot

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### 4. Functionality

The MXE‑210 operates as a compact, fanless embedded controller optimized for edge computing and industrial control. It integrates compute, storage, and communication interfaces within a sealed aluminum chassis for reliable operation in harsh environments.

Operation & Use Cases:
- Industrial Automation: PLC gateway, machine control, data acquisition
- Intelligent Transportation: vehicle control units, fleet monitoring, railway systems
- Facility Management: building automation, HVAC control, security monitoring
- IoT Edge Computing: sensor aggregation, data pre‑processing, remote monitoring

Compatibility:
- Operating Systems:
- Windows 10 IoT Enterprise 64‑bit
- Ubuntu Linux 16.04 LTS 64‑bit
- Wind River Pulsar Linux LTS 17 (by request)

Connectivity:
Dual Mini PCIe slots and USIM support enable wireless communication via Wi‑Fi, Bluetooth, 3G, 4G LTE, and LoRa modules. Dual Intel I210 LAN controllers provide redundant network paths and support for IEEE 1588 time synchronization.

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### 5. Components & Accessories

Included Items:
- MXE‑210 main unit
- DIN rail brackets and screw pack
- Quick Start Guide

Optional Accessories:
- mSATA / Micro SD Storage: 16 / 32 / 64 GB industrial MLC SSD
- 2.5" SATA HDD/SSD Kit: P/N 91‑95223‑0010 (cable and bracket assembly)
- Wireless Kit: Wi‑Fi, Bluetooth, 3G, 4G LTE, LoRa with antennas
- AC Adapters: 40 W and 90 W industrial grade
- Mounting Kits: DIN rail (default), optional wall mount brackets

Internal Connectors:
- RTC battery header, clear CMOS jumper, I²C and UART headers, SATA wafer, GPS antenna power (+5 V), extended power and reset headers, optional audio and speaker connectors.

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### 6. Installation & Setup

Power Connection:
- Input voltage range: 6 – 36 VDC (LPS/SELV compliant)
- Connector pins: V+, V–, GND
- Ensure correct polarity and voltage before power‑on

Mounting Options:
- DIN Rail Mounting: Attach brackets using M4 screws and secure to rail.
- Wall Mounting: Use included brackets and M4 screws; mount vertically with front/rear panels on sides for proper ventilation.

Cooling Considerations:
- Passive heat dissipation through aluminum chassis; maintain ≥ 5 cm clearance above unit.

Module Installation:
- Remove bottom cover to install Mini PCIe modules (mSATA, Wi‑Fi, 3G/4G LTE).
- Insert modules at an angle, secure with M2.5 screws, and reassemble chassis.
- For LTE modules, insert SIM card into USIM slot before installation.

Driver Installation (Windows 10 IoT):
1. Install chipset driver
2. Install graphics driver
3. Install Ethernet driver
4. Install USB 3.0 driver
5. Install I/O driver
6. Install SEMA utility and WDT/DI‑O drivers

Administrator privileges are required for driver installation.

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### 7. Performance & Capabilities

Processing Performance:
- Quad‑core x7‑E3950 or dual‑core x5‑E3930 delivers efficient multi‑threaded performance for edge applications.
- Integrated Intel® HD Graphics supports 4K display output via DisplayPort 1.2.

Power Efficiency:
- Typical system consumption 11–25 W depending on load.
- Wide DC input range (6–36 V) supports vehicle and industrial power systems.

Environmental Ruggedness:
- Shock resistance up to 100 G, vibration 5 Grms.
- Extended temperature operation (–40 °C to 85 °C with industrial SSD).
- Fanless design eliminates moving parts for enhanced MTBF.

Limitations:
- Single DisplayPort output (no dual display support).
- Limited internal storage capacity without optional 2.5" drive kit.

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### 8. Standards & Compliance

Regulatory Compliance:
- EMC: CE and FCC Class B (EN61000‑6‑4 / EN61000‑6‑2)
- Safety: UL, CB, CCC
- Railway: EN50121 certified
- Environmental: RoHS and WEEE compliant

Security Standards:
- TPM 2.0 hardware security module
- Intel® Boot Guard and UEFI Secure Boot for firmware integrity

Software Support & Manageability:
- ADLINK SEMA 3.5 middleware for remote monitoring and control
- Watchdog Timer (WDT) for system recovery
- Hardware monitoring of voltage, temperature, and power consumption

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### 9. Additional Information

Warranty & Support:
- Standard manufacturer warranty (terms vary by region)
- Technical support via ADLINK regional offices and Ask an Expert portal
- [http://askanexpert.adlinktech.com](http://askanexpert.adlinktech.com)
- Global service centers in Taiwan, USA, China, and Germany

Maintenance:
- No user‑serviceable internal components; service by qualified technicians only.
- Periodically inspect connectors and mounting hardware for tightness.
- Dispose of unit and battery according to local WEEE and RoHS guidelines.

Firmware & BIOS Updates:
- BIOS updates available from ADLINK website.
- BIOS features include CPU configuration, power management, TPM settings, and secure boot options.

Safety Precautions:
- Operate within specified temperature and voltage ranges.
- Avoid exposure to moisture and conductive dust.
- Disconnect power before servicing or mounting changes.
- Lithium battery replacement must use correct type to avoid explosion risk.

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### Summary

The ADLINK MXE‑210 Series represents a robust, energy‑efficient, and highly integrated embedded platform for industrial and IoT applications. Its Intel® Atom® E3900 processors deliver reliable performance in a compact fanless form factor with wide temperature and voltage tolerance. Comprehensive I/O interfaces, dual LAN, and wireless expansion options enable flexible connectivity for edge computing deployments. With ADLINK’s SEMA manageability, TPM security, and industrial certifications, the MXE‑210 Series is engineered for mission‑critical operations in harsh environments where reliability, longevity, and remote serviceability are paramount.