Intel 6th-Gen Core vision controller with real-time DTIO V2 I/O

Machine vision controller with Intel 6th-Gen Core i7/i5 LGA1151 CPU support, Intel Q170 chipset, up to 32 GB DDR4-2133, integrated Intel HD Graphics 530, 4x PoE+ Gigabit ports, 4x USB 3.1, 4x USB 2.0, 6x GbE, 2x DisplayPort, 1x VGA, 1x DVI-D, 3x serial ports, support for 75W NVIDIA GPU via PCIe x16 cassette, 4-CH CC/CV LED lighting controller, 4-CH camera trigger, 1-CH quadrature encoder input, 8-CH isolated DI and 8-CH isolated DO, MCU-based real-time I/O control by DTIO V2, dual SATA with RAID 0/1, 1x mSATA, wall-mount chassis.

Manufacturer: Neousys Technology

Category: No category

Intel 6th-Gen Core vision controller with real-time NuMCU I/O

Machine vision controller with Intel 6th-Gen Core i7/i5 LGA1151 CPU support, Intel Q170 chipset, up to 32 GB DDR4-2133, integrated Intel HD Graphics 530, 4x PoE+ Gigabit ports, 4x USB 3.1, 4x USB 2.0, 6x GbE, 2x DisplayPort, 1x VGA, 1x DVI-D, 3x serial ports, support for 75W NVIDIA GPU via PCIe x16 cassette, 4-CH CC/CV LED lighting controller, 4-CH camera trigger, 1-CH quadrature encoder input, 8-CH isolated DI and 8-CH isolated DO, MCU-based real-time I/O control by NuMCU, dual SATA with RAID 0/1, 1x mSATA, wall-mount chassis.

Manufacturer: Neousys Technology

Category: No category

- **Rugged GPU-Computing Platform:** Supports NVIDIA® GPUs up to 120W TDP, enabling 4–6 TFLOPS of inference performance for AI workloads. - **Intel® 8th-Gen Coffee Lake CPU Support:** Compatible with 35W and 65W TDP processors, including Core™ i7/i5/i3, Pentium®, and Celeron® models. - **Enhanced Thermal Design:** Patented Cassette design with guided airflow and smart fan control ensures stable GPU operation at ambient temperatures up to 60°C under full load. - **Rich I/O Connectivity:** Six Gigabit Ethernet ports (five Intel® I210 and one Intel® I219), eight USB ports (four USB 3.1 Gen2 and four USB 3.1 Gen1), four serial ports, and multiple video outputs. - **High-Speed Storage:** Supports dual 2.5" SATA III drives with RAID 0/1, one M.2 2280 NVMe SSD slot (PCIe Gen3 x4), and one full-size mSATA slot. - **Expansion Flexibility:** Includes one PCIe x16 slot (Gen3, 16 lanes) for GPU installation, one full-size mini PCIe slot, one M.2 2242 B-key slot with dual SIM sockets, and one MezIO™ expansion port. - **Wide Operating Range:** Operates from -25°C to +60°C (depending on CPU configuration) and accepts 8–35VDC input voltage. - **Industrial Durability:** Complies with MIL-STD-810G vibration and shock standards, ensuring reliability in mobile and industrial environments. - **Compact and Mountable:** Compact 240 x 225 x 111 mm chassis with wall-mounting standard and optional DIN-rail mounting. - **Optional PoE+ Support:** IEEE 802.3at PoE+ PSE available for GbE ports 3–6, providing up to 100W total power budget for powered devices. - **Advanced Management:** Supports Intel® AMT 12.0 for remote management and TPM 2.0 for hardware-level security.

Manufacturer: Neousys Technology

Category: Embedded with GPU

Intel 8th/9th Gen in-vehicle controller with 4x RJ45 PoE+, CAN, DIO and RAID

Fanless in-vehicle embedded controller supporting Intel 8th/9th-Gen Core i7/i5/i3 LGA1151 CPUs (35W TDP), Intel Q370 chipset, up to 64 GB DDR4 2666/2400 via two SODIMM slots, 2x GbE plus 4x IEEE 802.3at PoE+ ports by Intel I210 with RJ45 connectors, 1x isolated CAN 2.0, 4x isolated DI and 4x isolated DO, 4x USB 3.1 Gen2, 4x USB 3.1 Gen1, VGA, DVI-D, DisplayPort, 4x serial ports, 2x SATA with one hot-swappable 2.5 in tray supporting RAID 0/1, mSATA, M.2 2280 M-key, 2x M.2 2242 B-key, 3x full-size mini-PCIe, 8~35V DC input with ignition control, -40°C to 70°C operation.

Manufacturer: Neousys Technology

Category: No category

Intel 8th/9th Gen in-vehicle controller with 8x RJ45 PoE+, CAN, DIO and RAID

Fanless in-vehicle embedded controller supporting Intel 8th/9th-Gen Core i7/i5/i3 LGA1151 CPUs (35W TDP), Intel Q370 chipset, up to 64 GB DDR4 2666/2400 via two SODIMM slots, 2x GbE plus 8x IEEE 802.3at PoE+ ports by Intel I210 with RJ45 connectors, 1x isolated CAN 2.0, 4x isolated DI and 4x isolated DO, 4x USB 3.1 Gen2, 4x USB 3.1 Gen1, VGA, DVI-D, DisplayPort, 4x serial ports, 2x SATA with one hot-swappable 2.5 in tray supporting RAID 0/1, mSATA, M.2 2280 M-key, 2x M.2 2242 B-key, 3x full-size mini-PCIe, 8~35V DC input with ignition control, -40°C to 70°C operation, E-Mark compliance.

Manufacturer: Neousys Technology

Category: No category

- **Processor Options:** - Intel® Atom® x7‑E3950 (quad‑core, 1.6 GHz base / 2.0 GHz burst) - Intel® Atom® x5‑E3930 (dual‑core, 1.3 GHz base / 1.8 GHz burst) - **Compact Fanless Design:** - Dimensions: 140 (W) × 110 (D) × 58 (H) mm - Weight: 0.95 kg (2.06 lb) - Full aluminum alloy enclosure for durability and heat dissipation - **Rich I/O and Expansion:** - 1 × DisplayPort 1.2 (DP++) supporting up to 4096 × 2160 @ 60 Hz - 2 × USB 3.0, 2 × USB 2.0 - 2 × Intel® I210 GbE LAN ports - 2 × COM ports (BIOS‑selectable RS‑232/422/485) - 2 × full‑size Mini PCIe slots - 1 × USIM slot for 3G/4G LTE modules - 1 × mSATA slot, 1 × Micro SD slot - Optional 2.5" SATA SSD or isolated 8 DI / 8 DO module (1.5 kV isolation) - **Optional Features:** - eSIM support (project‑based) - Audio (mic‑in, line‑out/speaker) - Wireless kits (Wi‑Fi, Bluetooth, 3G, 4G LTE, LoRa) - 2.5" SATA HDD/SSD kit (P/N 91‑95223‑0010) - 40 W or 90 W industrial‑grade AC‑DC adapter - **Manageability:** - Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health, watchdog timer, and remote monitoring - Hardware watchdog timer and BMC support - **Certifications:** - Railway EN50121 compliance - CE/FCC Class B (EN61000‑6‑4/‑2) - UL, CB safety certifications

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Processor:** Intel® Atom® x5-E3930 dual-core SoC, base frequency 1.3 GHz, burst up to 1.8 GHz. - **Memory:** 2 GB DDR3L-1600 SODIMM (expandable up to 8 GB). - **Fanless Design:** Fully enclosed aluminum alloy chassis for silent, maintenance-free operation. - **Compact Form Factor:** 140 mm (W) × 110 mm (D) × 58 mm (H). - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) supporting up to 4096×2160 @ 60 Hz. - 2 × Intel® I210 Gigabit Ethernet ports. - 2 × COM ports (RS-232/422/485, BIOS selectable). - 2 × USB 3.0 and 2 × USB 2.0 ports. - **Expansion Options:** - 2 × full-size Mini PCIe slots. - 1 × USIM socket for 3G/4G LTE modules. - 1 × mSATA slot and 1 × MicroSD slot. - Optional 2.5" SATA SSD via internal SATA wafer. - **Power Input:** Wide-range 6–36 VDC input with 3-pin pluggable connector (GND, V-, V+). - **Operating Temperature:** Extended temperature model supports -20°C to +70°C. - **Shock & Vibration Resistance:** 100 G shock, 5 Grms vibration (SSD configuration). - **Certifications:** CE, FCC Class B, EN61000-6-4/-2, EN50121 (railway), UL, CB. - **Manageability:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health monitoring and remote management. - **Security:** TPM 2.0, Intel® Boot Guard, UEFI Secure Boot. - **Mounting Options:** DIN rail (standard) and wall-mount (optional). - **Software Support:** Windows® 10 IoT Enterprise 64-bit, Ubuntu Linux 16.04 LTS 64-bit, Wind River® Pulsar™ Linux (on request).

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Processor:** Intel® Atom® x5-E3930 dual-core SoC, base frequency 1.3 GHz, burst frequency up to 1.8 GHz. - **Memory:** 2 GB DDR3L-1600 SODIMM (expandable up to 8 GB). - **Fanless Design:** Fully enclosed aluminum alloy chassis for passive cooling and silent operation. - **Compact Form Factor:** 140 mm (W) × 110 mm (D) × 58 mm (H); weight 0.95 kg. - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) supporting up to 4096 × 2160 @ 60 Hz - 2 × Intel® I210 GbE LAN ports - 2 × COM ports (BIOS-selectable RS-232/422/485) - 2 × USB 3.0 and 2 × USB 2.0 ports - **Expansion Options:** - 2 × full-size Mini PCIe slots - 1 × USIM socket for 3G/4G LTE modules - 1 × mSATA slot - 1 × Micro SD slot (up to 32 GB) - **Storage Options:** - mSATA SSD (factory-installed 16/32/64 GB options) - Optional 2.5" SATA SSD/HDD via internal SATA wafer - **Power Input:** Wide-range 6–36 VDC input with 3-pin pluggable connector (GND, V-, V+). - **Operating Temperature:** - Standard: 0°C to +50°C - Extended: -20°C to +70°C (with industrial SSD) - Wide Temperature (WT model): -40°C to +85°C (with industrial SSD and ETTS kit) - **Shock and Vibration Resistance:** - Shock: 100 G, half sine 11 ms duration - Vibration: 5 Grms, 5–500 Hz, 3 axes - **Certifications:** CE, FCC Class B, EN61000-6-4/-2, EN50121 (railway), UL, CB. - **Manageability:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health monitoring, watchdog timer, and remote management. - **Security:** TPM 2.0, Intel® Boot Guard, UEFI Secure Boot. - **Mounting Options:** DIN rail (standard), wall mount (optional). - **Software Support:** Windows® 10 IoT Enterprise 64-bit, Ubuntu Linux 16.04 LTS 64-bit, Wind River® Pulsar™ Linux LTS 17 (on request).

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Processor:** Intel® Atom® x5-E3930 dual-core SoC, base frequency 1.3 GHz, burst frequency up to 1.8 GHz. - **Memory:** 2 GB DDR3L-1600 SODIMM (expandable up to 8 GB). - **Fanless Design:** Completely fanless operation for silent, maintenance-free performance. - **Compact Form Factor:** 140 mm (W) × 110 mm (D) × 58 mm (H). - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) - 2 × Intel® I210 GbE LAN ports - 2 × COM ports (RS-232/422/485, BIOS selectable) - 2 × USB 3.0 and 2 × USB 2.0 ports - **Expansion Options:** - 2 × full-size Mini PCIe slots - 1 × USIM socket for 3G/4G LTE modules - 1 × mSATA slot - 1 × Micro SD slot (up to 32 GB) - **Optional Storage:** 2.5" SATA SSD/HDD via internal SATA wafer. - **Power Input:** Wide-range 6–36 VDC input with 3-pin pluggable connector. - **Operating Temperature:** - Standard: 0°C to 50°C - Extended: -20°C to 70°C (with industrial SSD) - Wide: -40°C to 85°C (with industrial SSD and ETTS kit) - **Rugged Construction:** Aluminum alloy chassis, shock tolerance up to 100 G, vibration resistance 5 Grms. - **Certifications:** CE, FCC Class B, EN50121 (railway), UL, CB. - **Manageability:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system monitoring and remote management. - **Security:** TPM 2.0, Intel Boot Guard, UEFI Secure Boot. - **Mounting Options:** DIN rail (standard) and wall mount (optional). - **Software Support:** Windows 10 IoT Enterprise 64-bit, Ubuntu 16.04 LTS 64-bit, Wind River Pulsar Linux (on request).

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Processor:** Intel® Atom® x5-E3930 dual-core SoC (1.3 GHz base, 1.8 GHz burst frequency) - **Fanless Design:** Fully enclosed aluminum alloy chassis for silent operation and enhanced durability. - **Compact Form Factor:** 140 mm (W) × 110 mm (D) × 58 mm (H), ideal for space-constrained environments. - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) supporting up to 4096×2160 @ 60Hz - 2 × Intel® I210 Gigabit Ethernet ports - 2 × RS-232/422/485 serial ports (BIOS selectable) - 2 × USB 3.0 and 2 × USB 2.0 ports - **Expansion Options:** - 2 × full-size Mini PCIe slots - 1 × USIM socket for 3G/4G LTE communication - 1 × mSATA slot - 1 × Micro SD slot (up to 32GB) - **Storage:** 1 × 2.5" SATA drive bay (via internal SATA wafer) - **Power Input:** Wide-range 6–36 VDC input with 3-pin pluggable connector (GND, V-, V+) - **Operating Temperature:** - Standard: 0°C to 50°C - Extended: -20°C to 70°C (with industrial SSD) - Wide: -40°C to 85°C (with industrial SSD and ETTS option) - **Ruggedness:** - Shock tolerance: 100 G, 11 ms half-sine - Vibration resistance: 5 Grms, 5–500 Hz, 3 axes - **Certifications:** CE, FCC Class B, EN50121 (railway), UL, CB - **Manageability:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health monitoring, watchdog timer, and remote management. - **Security:** TPM 2.0, Intel® Boot Guard, and UEFI Secure Boot support. - **Mounting Options:** DIN rail (standard) and wall mount (optional).

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Integrated Edge Computing Platform:** Combines data acquisition, signal conditioning, computation, and network communication in one compact system. - **Intel Atom x7-E3950 Quad-Core Processor:** Delivers efficient performance for real-time data processing and analytics at the edge. - **High-Precision Vibration Measurement:** 4-channel, 24-bit resolution, up to 128 kS/s sampling rate for accurate vibration and condition monitoring. - **Built-in IEPE Excitation:** Each channel includes a 2 mA IEPE current source, eliminating the need for external signal conditioning. - **Fanless, Rugged Design:** Full aluminum alloy construction ensures durability in harsh industrial environments. - **Wide Power Input Range:** Operates from 6–36 VDC, with optional 40W AC/DC adapter. - **Comprehensive Connectivity:** Includes dual Gigabit Ethernet ports, multiple USB interfaces, serial ports, DisplayPort, and dual Mini PCIe slots for expansion. - **Flexible Mounting Options:** DIN-rail and wall-mountable for easy integration into existing systems. - **Wide Environmental Tolerance:** Operating temperature range of 0–55°C and storage temperature range of -20–70°C. - **Software Ecosystem:** Supports Windows 10 IoT Enterprise/Core and Ubuntu Linux, with SDKs for LabVIEW, MATLAB, C/C++, Visual Basic, and Visual Studio .NET. - **Predictive Maintenance Enablement:** Enables continuous monitoring, early fault detection, and data-driven maintenance scheduling. - **Reduced Downtime:** Up to 70% reduction in unplanned downtime and related expenses through proactive monitoring.

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Processor:** Intel® Atom® x7-E3950, quad-core, 1.6 GHz base frequency, 2.0 GHz burst frequency. - **Memory:** 2 GB DDR3L-1600 SODIMM (expandable up to 8 GB). - **Fanless Design:** Fully fanless aluminum alloy enclosure for silent operation and enhanced durability. - **Compact Dimensions:** 140 mm (W) × 110 mm (D) × 58 mm (H). - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) supporting up to 4096×2160 @ 60 Hz. - 2 × Intel® I210IT Gigabit Ethernet ports. - 2 × COM ports (RS-232/422/485, BIOS selectable). - 2 × USB 3.0 and 2 × USB 2.0 ports. - **Expansion Options:** - 2 × full-size Mini PCIe slots. - 1 × USIM socket for 3G/4G LTE modules. - 1 × mSATA slot (full-size Mini PCIe). - 1 × Micro SD slot (up to 32 GB). - **Power Input:** Wide-range 6–36 VDC input with 3-pin pluggable connector (GND, V-, V+). - **Operating Temperature:** Extended range -20°C to +70°C with industrial SSD. - **Ruggedness:** - Shock tolerance: 100 G, half sine 11 ms. - Vibration resistance: 5 Grms, 5–500 Hz, 3 axes. - Humidity: up to 95% @ 40°C (non-condensing). - **Certifications:** CE, FCC Class B, EN61000-6-4/-2, EN50121 (railway), UL, CB. - **Manageability:** Integrated ADLINK SEMA (Smart Embedded Management Agent) 3.5 with BMC for remote monitoring and watchdog timer control. - **Security:** TPM 2.0, Intel® Boot Guard, UEFI Secure Boot. - **Mounting Options:** DIN rail (standard), wall mount (optional). - **Software Support:** Windows® 10 IoT Enterprise 64-bit, Ubuntu Linux 16.04 LTS 64-bit, Wind River® Pulsar™ Linux LTS 17 (by request).

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Processor:** Intel® Atom™ x7‑E3950 (quad‑core, 1.6 GHz base / 2.0 GHz burst) - **Memory:** 2 GB DDR3L‑1600 SODIMM (expandable up to 8 GB) - **Fanless Design:** Completely fanless thermal solution for silent, maintenance‑free operation - **Compact Form Factor:** 140 (W) × 110 (D) × 58 (H) mm, weight 0.95 kg - **Rich I/O Connectivity:** - 1 × DisplayPort 1.2 (DP++) - 2 × Intel® I210 GbE LAN ports - 2 × COM ports (BIOS‑selectable RS‑232/422/485) - 2 × USB 3.0 and 2 × USB 2.0 ports - **Expansion Capability:** - 2 × full‑size Mini PCI Express slots - 1 × USIM socket for 3G/4G LTE modules - 1 × mSATA slot and 1 × Micro SD slot - Optional 2.5″ SATA SSD via internal SATA wafer - **Wide Power Input:** 6 – 36 V DC input range with 3‑pin pluggable connector - **Rugged Construction:** Full aluminum alloy chassis, shock tolerance up to 100 G, vibration resistance 5 Grms - **Operating Temperature:** - Standard: 0 °C – 50 °C - Extended: –20 °C – 70 °C (with industrial SSD) - **Manageability:** Integrated ADLINK SEMA 3.5 (BMC) for system health monitoring, watchdog timer, and remote management - **Security:** TPM 2.0, Intel Boot Guard, UEFI Secure Boot - **Certifications:** CE, FCC Class B, EN50121 (Railway), UL, CB - **Software Support:** Windows 10 IoT Enterprise 64‑bit, Ubuntu Linux 16.04 LTS 64‑bit, Wind River Pulsar Linux LTS 17 (by request)

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Processor:** Intel® Atom® x7-E3950, quad-core, 1.6 GHz base frequency (2.0 GHz burst). - **Memory:** 2 GB DDR3L-1600 SODIMM (expandable up to 8 GB). - **Storage:** - 1× mSATA slot (full-size Mini PCIe) - 1× 2.5" SATA SSD/HDD bay (via internal SATA wafer, included in “S” model) - 1× Micro SD slot (up to 32 GB) - **Display:** 1× DisplayPort 1.2 (DP++) supporting resolutions up to 4096×2160 @ 60 Hz. - **Networking:** 2× Intel® I210IT Gigabit Ethernet ports with advanced features (IEEE 1588, VLAN, PXE, Wake-on-LAN). - **Serial Communication:** 2× COM ports (RS-232/422/485, BIOS selectable). - **USB Connectivity:** 2× USB 3.0 and 2× USB 2.0 ports. - **Expansion:** - 2× full-size Mini PCIe slots - 1× USIM socket for 3G/4G LTE modules - Optional eSIM support (project-based) - **Manageability:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for system health monitoring, watchdog timer, and remote management. - **Power Input:** 6–36 VDC wide-range input with 3-pin pluggable connector. - **Design:** Fanless, full aluminum alloy enclosure for rugged industrial use. - **Mounting Options:** DIN rail (standard) and wall mount (optional). - **Certifications:** CE/FCC Class B, EN50121 (railway), UL, CB, and RoHS/WEEE compliant. - **Operating Temperature:** Standard 0°C to 50°C; extended -20°C to +70°C (with industrial SSD).

Manufacturer: Adlink Technology Inc.

Category: Atom Powered Embedded

- **Processor Options:** Intel® Atom® x5‑E3930 (dual‑core, 1.3/1.9 GHz) or x7‑E3950 (quad‑core, 1.6/2.0 GHz) for low‑power, high‑efficiency computing. - **Touch Interface:** Choice of 5‑point projected capacitive or 1‑point 5‑wire resistive touch screen, full‑flat design for durability and easy cleaning. - **Display Sizes:** 7”, 10.1”, 12.1”, 15.6”, 18.5”, and 21.5” LCD panels with resolutions up to 1920 × 1080 and luminance up to 700 nits. - **Fanless Architecture:** Passive cooling design ensures silent operation and long‑term reliability in dust‑prone or vibration‑intensive environments. - **Comprehensive I/O:** - **External:** 1 × DisplayPort (DP++), 1 × USB 2.0, 1 × USB 3.0, 2 × GbE (Intel® I211‑AT or optional I210IT), 2 × COM (RS‑232/422/485). - **Internal:** 1 × mPCIe slot, 1 × USIM slot, 1 × USB 2.0 wafer, 2 × I²C, 1 × 8‑bit GPIO, 1 × keypad port (up to 32 keys), 1 × volume/backlight control port. - **Storage Flexibility:** Integrated eMMC 5.0 (up to 64 GB), 1 × SATA header for 2.5” SSD/HDD, and 1 × M.2 2280 slot. - **Audio & Multimedia:** Built‑in 2 × 2 W stereo speakers, microphone‑in and line‑out support. - **Power Input:** 12 V ± 5% or 9–36 V DC input range with OVP/UVP protection. - **Environmental Protection:** IP65‑rated front panel, SGCC chassis, and wide operating temperature support (up to –20 °C to 70 °C depending on model). - **System Management:** Integrated ADLINK SEMA 3.5 (Smart Embedded Management Agent) for remote monitoring, power management, and health diagnostics. - **Software Compatibility:** Supports Windows® 10 64‑bit, Linux Ubuntu 16.04 LTS, and Android (availability from Q1 2019).

Manufacturer: No category

Category: LCD Open Metal Frame

- **Architecture:** 3rd Generation Intel® Core™ (Ivy Bridge) - **Socket Type:** PGA988 / Socket G2 - **Core Configuration:** Dual-core, four-thread processor with Intel® Hyper-Threading Technology - **Base Clock Frequency:** 2.4 GHz - **Integrated Graphics:** Intel® HD Graphics 4000 with dynamic frequency scaling - **Process Technology:** 22nm tri-gate transistor technology for improved energy efficiency - **Thermal Design Power (TDP):** 35 Watts - **Memory Support:** Dual-channel DDR3/DDR3L memory up to 1600 MHz - **Embedded Lifecycle Support:** Extended availability for embedded and industrial applications - **Virtualization Support:** Intel® Virtualization Technology (VT-x) and Intel® VT-d for hardware-assisted virtualization - **Security Features:** Intel® AES New Instructions (AES-NI), Intel® Secure Key, and Execute Disable Bit for enhanced data protection - **Graphics Capabilities:** Support for DirectX 11, OpenGL 4.0, and OpenCL 1.1; capable of driving multiple displays - **Integrated Media Engine:** Hardware acceleration for HD video playback and encoding - **Energy Efficiency:** Optimized power management with Intel® SpeedStep® and Deep Power Down (C-states)

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** Based on Intel’s 14 nm Skylake microarchitecture, offering improved performance-per-watt and enhanced integrated graphics compared to previous generations. - **Core Configuration:** Dual-core, four-thread processor with Intel® Hyper-Threading Technology, enabling efficient parallel processing for multitasking workloads. - **Clock Speed:** Fixed base frequency of 2.70 GHz, optimized for consistent performance in thermally constrained environments. - **Cache:** 4 MB Intel® Smart Cache shared dynamically between cores for faster data access and reduced latency. - **Integrated Graphics:** Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, with a base frequency of 350 MHz and a maximum dynamic frequency up to 1.00 GHz. - **Memory Support:** Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for both legacy and modern systems. - **Thermal Design Power (TDP):** 35 W, making it suitable for compact and fanless systems where thermal efficiency is critical. - **Socket Compatibility:** LGA 1151 socket, compatible with Intel® 100-series chipsets (e.g., H110, Q170, B150, H170). - **Virtualization Support:** Intel® VT-x and VT-d technologies for hardware-assisted virtualization and efficient resource allocation in virtualized environments. - **Security Features:** Intel® AES-NI for accelerated encryption, Intel® Secure Key, and Intel® OS Guard for enhanced data protection and system integrity. - **Display Capabilities:** Supports up to three independent displays with resolutions up to 4096x2304 @ 60 Hz via DisplayPort or HDMI. - **Energy Efficiency:** Optimized for low-power embedded and industrial applications, maintaining performance while minimizing heat output.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** 3rd Generation Intel® Core™ (Ivy Bridge) - **Core Configuration:** Dual-core with four threads (2 cores / 4 threads) via Intel® Hyper-Threading Technology - **Base Clock Speed:** 2.7 GHz - **Max Turbo Frequency:** Up to 3.3 GHz with Intel® Turbo Boost Technology 2.0 - **Integrated Graphics:** Intel® HD Graphics 4000 with dynamic frequency scaling - **Graphics Base Frequency:** 650 MHz - **Graphics Max Dynamic Frequency:** Up to 1.1 GHz - **Cache:** 3 MB Intel® Smart Cache shared between cores - **Instruction Set:** 64-bit, supporting Intel® SSE4.1/4.2 and AVX instructions - **Thermal Design Power (TDP):** 35 watts - **Socket Type:** G2 / rPGA988B - **Process Technology:** 22 nm tri-gate transistor technology - **Memory Support:** Dual-channel DDR3/DDR3L memory up to 1600 MHz - **Embedded Lifecycle Support:** Extended availability for embedded and industrial markets - **Virtualization Support:** Intel® VT-x and VT-d for hardware-assisted virtualization - **Security Features:** Intel® AES-NI, Intel® Secure Key, Intel® Trusted Execution Technology (TXT) - **Power Management:** Enhanced Intel® SpeedStep® Technology, Thermal Monitoring, and configurable TDP options The i5-3610ME is engineered for embedded computing environments requiring high reliability, long-term availability, and consistent performance under extended operating conditions.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Quad-Core Architecture:** The i5-6500TE features four physical cores and supports four threads, providing robust multitasking and parallel processing performance for industrial and embedded workloads. - **Base and Turbo Frequencies:** Operates at a base frequency of 2.3 GHz with Intel® Turbo Boost Technology 2.0 enabling dynamic acceleration up to 3.3 GHz for demanding tasks. - **Integrated Graphics:** Equipped with Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, enabling smooth rendering for 2D/3D graphics, video playback, and light gaming or visualization workloads. - **Cache Memory:** 6 MB Intel® Smart Cache shared dynamically among cores to improve data access speed and reduce latency. - **Thermal Design Power (TDP):** Optimized 35 W TDP for energy-efficient operation in thermally constrained environments such as fanless or small-form-factor systems. - **Memory Support:** Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for various system configurations. - **Virtualization and Security:** Supports Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT), and Intel® Software Guard Extensions (SGX) for secure and isolated computing environments. - **Advanced Power Management:** Features Intel® SpeedStep® Technology and power gating for dynamic power optimization. - **Embedded Lifecycle Support:** Designed for embedded and industrial markets with extended availability and reliability.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Quad-Core Architecture:** Four physical cores with Hyper-Threading Technology, supporting up to eight simultaneous threads for enhanced multitasking and parallel processing. - **Base and Turbo Frequencies:** Operates at a base clock speed of 2.3 GHz with Intel® Turbo Boost Technology 2.0 enabling dynamic frequency scaling up to 3.3 GHz for demanding workloads. - **Ivy Bridge Microarchitecture:** Built on Intel’s 22nm process technology featuring 3D Tri-Gate transistors for improved performance-per-watt efficiency compared to previous generations. - **Integrated Graphics:** Intel® HD Graphics 4000 integrated GPU with support for DirectX 11, OpenGL 4.0, and OpenCL 1.1, enabling advanced visual performance without the need for a discrete GPU. - **Embedded Platform Support:** Part of Intel’s embedded product line with extended availability and lifecycle support, ideal for industrial, medical, and military-grade systems. - **Virtualization and Security:** Supports Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT), and Intel® AES New Instructions (AES-NI) for secure and efficient virtualization and encryption. - **Memory Support:** Dual-channel DDR3/DDR3L memory controller supporting up to 32 GB of system memory at speeds up to 1600 MHz. - **Thermal Design Power (TDP):** 45 watts, optimized for performance in thermally constrained environments. - **Socket Compatibility:** Designed for Socket G2 (rPGA988B) platforms, ensuring compatibility with a wide range of embedded and mobile motherboards.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Architecture:** Based on Intel’s 22nm Ivy Bridge microarchitecture, offering improved performance-per-watt compared to the previous Sandy Bridge generation. - **Core Configuration:** Quad-core design with Hyper-Threading Technology, enabling up to eight simultaneous processing threads for enhanced multitasking. - **Clock Speed:** Base frequency of 2.30 GHz with Intel® Turbo Boost Technology 2.0 allowing dynamic acceleration up to 3.30 GHz depending on workload and thermal conditions. - **Integrated Graphics:** Intel® HD Graphics 4000 integrated GPU, supporting DirectX 11, OpenGL 4.0, and Intel® Quick Sync Video for hardware-accelerated media encoding and decoding. - **Cache Memory:** 6 MB Intel® Smart Cache shared dynamically among cores for optimized data access and reduced latency. - **Thermal Design Power (TDP):** 45 watts, balancing high performance with efficient thermal management for mobile platforms. - **Instruction Set Support:** 64-bit instruction set with support for Intel® SSE4.1, SSE4.2, and AVX instruction extensions for enhanced computational performance. - **Virtualization and Security:** Includes Intel® Virtualization Technology (VT-x), Intel® Virtualization Technology for Directed I/O (VT-d), and Intel® Trusted Execution Technology (TXT) for secure and efficient virtualized environments. - **Memory Support:** Dual-channel DDR3/DDR3L memory controller supporting up to 32 GB of system memory at speeds up to 1600 MHz. - **Advanced Power Management:** Intel® Enhanced SpeedStep® Technology and Deep Power Down (C-states) for optimized energy efficiency.

Manufacturer: Intel

Category: CPU i3 / i5 / i7

- **Processor Options:** Intel® Core™ i7-7600U (2.8/3.9 GHz Turbo), i5-7300U (2.6/3.5 GHz Turbo), or i3-7100U (2.4 GHz), all with 15W TDP. - **Touch Interface:** Choice of 5-point capacitive or 1-point 5-wire resistive touch screen, full-flat design. - **Display Sizes:** Available in 7”, 10.1”, 12.1”, 15.6”, 18.5”, and 21.5” LCD panels with resolutions up to 1920×1080. - **Fanless Design:** Ensures silent operation and enhanced reliability in harsh environments. - **Front IP65 Protection:** Dust-tight and water-resistant front panel suitable for industrial and outdoor use. - **Comprehensive I/O:** - External: 1× DisplayPort, 1× USB 2.0, 1× USB 3.0, 2× GbE ports, 2× COM ports (RS-232/422/485). - Internal: 1× mPCIe slot, 1× USIM slot, 1× USB 2.0, 2× I²C, 1× 8 GPIO, 1× DisplayPort, 1× keypad port. - **Storage Flexibility:** Supports 1× eMMC (up to 64GB), 1× SATA 6Gbps, 1× Micro SD, and 1× M.2 (M key 2280). - **Audio & Notification:** Integrated 2× 2W speakers, mic-in/line-out, buzzer, and LED indicators. - **Expansion Capability:** Function module (FM) board for customized I/O expansion. - **Built-in ADLINK SEMA 3.5:** Smart Embedded Management Agent for system monitoring and remote management. - **Operating System Support:** Windows® 10 IoT Enterprise (64-bit) and Linux Ubuntu 16.04 LTS. - **Optional eSIM Support:** For 3G/4G LTE communication.

Manufacturer: No category

Category: LCD Open Metal Frame

Intel Core machine vision controller with DTIO V2 real-time I/O and 120W GPU support.

All-in-one machine vision controller with Intel 9th/8th Gen Core i7/i5 CPU, Q370 chipset, up to 64 GB DDR4 memory and patented DTIO V2 real-time I/O control. It provides four PoE+ ports, eight USB 3.1 ports, four lighting outputs, four isolated 12 V camera triggers, one A/B/Z encoder input, eight isolated digital inputs and eight isolated digital outputs. Two PCIe x16 slots support a 120W NVIDIA GPU and camera interface cards.

Manufacturer: Neousys Technology

Category: Industrial Computer

Intel Core machine vision controller with NuMCU real-time I/O and 120W GPU support.

All-in-one machine vision controller with Intel 9th/8th Gen Core i7/i5 CPU, Q370 chipset, up to 64 GB DDR4 memory and patented NuMCU real-time I/O control. It provides four PoE+ ports, eight USB 3.1 ports, four lighting outputs, four isolated 12 V camera triggers, one A/B/Z encoder input, eight isolated digital inputs and eight isolated digital outputs. Two PCIe x16 slots support a 120W NVIDIA GPU and camera interface cards.

Manufacturer: Neousys Technology

Category: Industrial Computer

Intel Core Ultra 200S compact fanless computer with 4x 2.5GbE and 4x USB 3.2

Compact fanless embedded computer with Intel Core Ultra 200S series LGA1851 processors (35W/65W), Intel H810 chipset, integrated Intel Xe LPG graphics, integrated NPU, up to 64GB DDR5-6400 via 1x SODIMM, 4x 2.5GBASE-T Ethernet, optional 4-port PoE+ PSE, 4x USB 3.2 Gen1, 2x USB 2.0, HDMI, DisplayPort, 4x isolated DI and 4x isolated DO, 4x serial ports, 1x M.2 2280 M-key PCIe Gen4x4 NVMe, 1x easy-swappable 2.5-inch SATA HDD/SSD tray, 2x mini PCIe, 1x M.2 2230 E-key, 8V to 48V DC input, -25°C to 60°C operation, wall-mount standard.

Manufacturer: Neousys Technology

Category: Industrial Computer