- **Integrated PCIe-PoE4+ Card:** Provides four independent IEEE 802.3at PoE+ ports, each capable of delivering up to 25.5 W of power to connected devices such as IP cameras, wireless access points, or industrial sensors. - **Neousys Patented Expansion Cassette:** Ensures optimal thermal isolation between the main system and the add-on card, maintaining fanless reliability and stability in harsh environments. - **Back-to-Back Thermal Heat Sink Design:** Enhances heat dissipation efficiency, allowing sustained operation under full load within a 0°C to 55°C ambient temperature range. - **Smart Fan Integration:** Automatically adjusts cooling performance based on thermal conditions, ensuring consistent operation without compromising the fanless system’s integrity. - **Rugged Industrial Design:** Built for vibration, shock, and temperature extremes, compliant with IEC60068-2-64 and IEC60068-2-27 standards. - **Seamless Compatibility:** Designed for direct installation into the Nuvo-2500E expansion cassette, maintaining compact system dimensions and mechanical integrity. - **Wide DC Input Range:** Operates from 8 V to 35 V DC, compatible with industrial and vehicular power systems. - **Fanless Operation:** When installed in the Nuvo-2500E, the system maintains fanless operation up to 55°C ambient temperature.

Manufacturer: Neousys Technology

Category: Nuvo-2000-Series and others

- **High‑Speed USB 3.0 Expansion:** Four SuperSpeed USB 3.0 ports supporting up to 5 Gb/s per port, with a combined bandwidth of 2 GB/s. - **PCI Express Interface:** PCIe x4 mechanical connector operating with 1‑lane Gen 2 signal (5 GT/s). - **Rugged Fanless Design:** Integrated within Neousys’ patented expansion cassette featuring a passive heat‑spreader and back‑to‑back thermal dissipation system. - **Industrial Reliability:** Designed for continuous operation in harsh environments; supports fanless operation from 0 °C to 55 °C. - **Compact Integration:** Fully compatible with Nuvo‑2500E embedded controllers without increasing system footprint. - **High Compatibility:** Supports USB 3.0/2.0/1.1 devices; backward‑compatible with legacy peripherals. - **Optimized Power Delivery:** Each port provides standard USB 3.0 5 V DC power output with over‑current protection. - **Plug‑and‑Play Expansion:** Seamless integration with Neousys BIOS and driver architecture; no external cabling required inside the cassette. - **Thermal Efficiency:** Dual‑sided heat‑sink design minimizes thermal coupling between the host CPU and expansion card. - **Industrial‑Grade Components:** Built with extended‑temperature components for embedded and automation applications.

Manufacturer: Neousys Technology

Category: Nuvo-2000-Series and others

- **GPU‑Computing Capability:** Supports NVIDIA® GeForce® GTX 950 or GTX 1050 (75 W TDP) delivering up to 768 CUDA cores for parallel arithmetic and graphics acceleration. - **Intel® Skylake Platform:** Compatible with 6th‑Gen Intel® Core™ i7/i5/i3, Pentium®, and Celeron® LGA1151 CPUs (35 W / 65 W TDP). - **Fanless Cassette Design:** Neousys’ patented Cassette module (ROC Patent M456527) isolates the GPU in a dedicated chamber with a sealed airflow tunnel (ROC Patent M534371) for efficient heat dissipation. - **Wide‑Temperature Operation:** Reliable performance from –25 °C to 60 °C with 100 % GPU load. - **Rich I/O Connectivity:** - 6 × Gigabit Ethernet (Intel I219 + 5 × I210) - 4 × USB 3.0 + 4 × USB 2.0 - 3 × COM ports (2 × RS‑232/422/485 + 1 × RS‑232) - VGA, DVI‑D, and 2 × DisplayPort (4K support) - Audio I/O (Mic‑in / Speaker‑out) - **Storage Flexibility:** Dual 2.5″ SATA III (6 Gb/s) ports with RAID 0/1 support + 1 × mSATA slot (shared with mini‑PCIe). - **Expansion Options:** - 1 × PCIe x16 (Gen3, 8 lanes) for GPU - 2 × mini‑PCIe slots with dual SIM support - 1 × MezIO™ interface for modular I/O expansion - **Power Input:** 8 – 35 V DC via 3‑pin terminal block; optional ignition control for vehicle use. - **Rugged Reliability:** Fanless aluminum chassis, vibration (5 Grms) and shock (50 Grms) resistance, CE/FCC Class A compliance. - **Manageability:** Intel® AMT 11.0 remote management and TPM 2.0 hardware security.

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **GPU‑Computing Capability:** Supports 75 W NVIDIA® GPUs such as GeForce® GTX 950 or GTX 1050 Ti, providing up to 768 CUDA cores for parallel arithmetic and graphics processing. - **Thermal Innovation:** Employs Neousys’ patented Cassette and thermal tunnel design (ROC Patent Nos. M456527 and M534371) enabling sustained 100 % GPU load at ambient temperatures up to 60 °C. - **Fanless Industrial Design:** Completely fanless system core with sealed airflow tunnel for GPU cooling, ensuring silent and dust‑resistant operation. - **Compact Form Factor:** 240 mm (W) × 225 mm (D) × 111 mm (H) footprint, optimized for space‑constrained industrial installations. - **Wide‑Temperature Operation:** ‑25 °C to 60 °C (with 35 W CPUs) or up to 50 °C (with 65 W CPUs). - **Rich I/O Connectivity:** Six Intel® Gigabit Ethernet ports, eight USB ports (4 × USB 3.0 + 4 × USB 2.0), triple independent display outputs (VGA, DVI‑D, 2 × DisplayPort), three COM ports, audio I/O, and dual SATA III interfaces. - **Expansion Flexibility:** One PCIe x16 (Gen3, 8‑lane) slot for GPU, two full‑size mini‑PCIe sockets with dual SIM support, and one proprietary MezIO™ expansion interface for modular I/O. - **Security & Management:** Supports Intel® AMT 11.0 for remote management and TPM 2.0 for hardware‑based security. - **Power Versatility:** 8 – 35 V DC input via 3‑pin terminal block; optional ignition control for in‑vehicle use. - **Reliability:** CE/FCC Class A compliance, vibration tolerance 5 Grms, shock resistance 50 Grms, and humidity tolerance 10 – 90 % non‑condensing.

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **Industrial GPU Computing:** First ruggedized embedded system capable of hosting a full‑length, high‑power NVIDIA® GPU (up to 250 W TDP). - **Processor Support:** Intel® Xeon® E3 v5 or 6th‑Gen Core™ i7/i5 (Skylake) LGA1151 CPUs. - **Chipset:** Intel® C236 platform controller hub. - **Memory:** Up to 32 GB DDR4‑2133 MHz ECC or non‑ECC SODIMM (2 slots). - **PCIe Expansion:** - 1 × PCIe x16 Gen3 slot (16 lanes) for GPU - 2 × PCIe x8 Gen3 slots (4 lanes each) for additional expansion cards - **Storage:** 4 × 2.5″ SATA III ports supporting RAID 0/1/5/10. - **Networking:** Dual Intel® Gigabit Ethernet ports (I219‑LM and I210‑IT). - **Video Output:** Dual DVI‑D connectors supporting up to 1920 × 1200 resolution. - **Serial Communication:** 2 × software‑programmable RS‑232/422/485 ports. - **USB Connectivity:** 4 × USB 3.0 external ports, 1 × internal USB 2.0 port. - **Audio:** 1 × 3.5 mm speaker‑out jack (Realtek ALC262 codec). - **Thermal Design:** Patented cold‑air intake system ensuring stable GPU operation at 60 °C under full load. - **Mechanical Design:** Shock‑absorbing wall‑mount brackets and anti‑vibration grommets for field deployment. - **Power Input:** 24 V DC via 3‑pin terminal block; optional 280 W or 480 W AC/DC adapters. - **Operating Range:** ‑25 °C to +60 °C with 100 % CPU/GPU load; vibration resistance 1 Grms (5–500 Hz, 3 axes). - **Compliance:** CE/FCC Class A, EN 55022/55024/55032, IEC 60068‑2‑64 vibration standard.

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **GPU Computing Capability:** Supports one high-end NVIDIA® GPU card up to 250W TDP, enabling CUDA®, AI inference, deep learning, and GPU-accelerated analytics. - **Processor Support:** Compatible with Intel® Xeon® E3 v5 and 6th-Gen Core™ i7/i5 LGA1151 CPUs (Skylake architecture) using the Intel® C236 chipset. - **Memory:** Up to 32GB DDR4-2133 ECC or non-ECC SODIMM memory across two slots, ensuring both performance and data integrity. - **Thermal Design:** Patented cold air intake and optimized airflow architecture for stable GPU operation at ambient temperatures up to 60°C under full load. - **Ignition Control:** Integrated ignition power control for in-vehicle and mobile applications, allowing synchronized system startup/shutdown with vehicle ignition. - **Storage Flexibility:** Three 2.5" SATA III drive bays supporting RAID 0/1/5; two bays feature Neousys’ patented easy-swap trays for quick HDD/SSD replacement. - **Expansion Capability:** One PCIe x16 Gen3 slot for GPU, plus two PCIe x8 Gen3 slots for additional high-bandwidth expansion cards. - **Connectivity:** Dual Intel® Gigabit Ethernet ports (I219-LM and I210-IT), four USB 3.0 ports, two software-programmable RS-232/422/485 serial ports, and dual DVI-D video outputs. - **Industrial Reliability:** Wide operating temperature range (-25°C to +60°C), vibration resistance up to 1Grms (5–500Hz, 3 axes), and compliance with IEC60068-2-64. - **Compact Form Factor:** 178 mm (W) × 360 mm (D) × 174 mm (H) rugged chassis with wall-mounting brackets. - **Power Input:** 24 VDC input via 3-pin pluggable terminal block (IGN/GND/V+).

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **High-Performance GPU Support:** Supports up to 250W NVIDIA® GeForce® GTX 1080 Ti GPU via PCIe x16 Gen3 slot, enabling CUDA-based parallel computing, AI inference, and deep learning workloads. - **Powerful CPU Options:** Compatible with Intel® Xeon® E3 v5 and 6th-Gen Core™ i7/i5 LGA1151 CPUs (Skylake architecture) using Intel® C236 chipset. - **ECC/Non-ECC Memory Support:** Dual 260-pin DDR4-2133 SODIMM slots supporting up to 32GB ECC or non-ECC memory for data integrity and performance. - **Advanced Thermal Design:** Patented cold air intake system ensures stable GPU operation at up to 60°C under full load, maintaining reliability in harsh industrial environments. - **Comprehensive I/O Connectivity:** Dual Intel® Gigabit Ethernet ports (I219-LM and I210-IT), four USB 3.0 ports, two software-programmable RS-232/422/485 ports, dual DVI-D video outputs, and audio output. - **Flexible Expansion:** One PCIe x16 Gen3 slot for GPU, two PCIe x8 Gen3 slots for additional high-bandwidth cards, one M.2 B-key socket with SIM slot for 3G/4G modules, and one full-size mini-PCIe slot. - **Industrial Reliability:** Operating temperature range of -25°C to +60°C, vibration resistance up to 1Grms (5–500Hz, 3 axes), and CE/FCC Class A compliance. - **Storage Flexibility:** Four SATA III ports supporting 2.5” HDD/SSD with RAID 0/1/5/10 configurations for performance and redundancy. - **Rugged Mechanical Design:** Compact aluminum chassis (164 x 360 x 174 mm), wall-mountable with damping brackets, and anti-vibration grommets for in-vehicle or field deployment.

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **Rugged GPU-Computing Platform:** Supports NVIDIA® GPUs up to 120W TDP, enabling 4–6 TFLOPS of inference performance for AI workloads. - **Intel® 8th-Gen Coffee Lake CPU Support:** Compatible with 35W and 65W TDP processors, including Core™ i7/i5/i3, Pentium®, and Celeron® models. - **Enhanced Thermal Design:** Patented Cassette design with guided airflow and smart fan control ensures stable GPU operation at ambient temperatures up to 60°C under full load. - **Rich I/O Connectivity:** Six Gigabit Ethernet ports (five Intel® I210 and one Intel® I219), eight USB ports (four USB 3.1 Gen2 and four USB 3.1 Gen1), four serial ports, and multiple video outputs. - **High-Speed Storage:** Supports dual 2.5" SATA III drives with RAID 0/1, one M.2 2280 NVMe SSD slot (PCIe Gen3 x4), and one full-size mSATA slot. - **Expansion Flexibility:** Includes one PCIe x16 slot (Gen3, 16 lanes) for GPU installation, one full-size mini PCIe slot, one M.2 2242 B-key slot with dual SIM sockets, and one MezIO™ expansion port. - **Wide Operating Range:** Operates from -25°C to +60°C (depending on CPU configuration) and accepts 8–35VDC input voltage. - **Industrial Durability:** Complies with MIL-STD-810G vibration and shock standards, ensuring reliability in mobile and industrial environments. - **Compact and Mountable:** Compact 240 x 225 x 111 mm chassis with wall-mounting standard and optional DIN-rail mounting. - **Optional PoE+ Support:** IEEE 802.3at PoE+ PSE available for GbE ports 3–6, providing up to 100W total power budget for powered devices. - **Advanced Management:** Supports Intel® AMT 12.0 for remote management and TPM 2.0 for hardware-level security.

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **AI Inference Platform:** Optimized for NVIDIA® Tesla T4 GPU, delivering up to **8.1 TFLOPS (FP32)** and **130 TOPS (INT8)** for real-time inference. - **High-Performance CPU Support:** Compatible with **Intel® 8th/9th-Gen Core™ i7/i5/i3** processors (LGA1151 socket, 35W/65W TDP). - **Advanced Thermal Design:** Patented **Cassette and air tunnel cooling** ensures efficient heat dissipation, enabling continuous GPU operation at ambient temperatures up to **60°C**. - **Flexible Expansion:** - 1× PCIe x16 Gen3 slot (16 lanes) for GPU installation. - 1× full-size mini PCIe socket with internal SIM slot (mux with mSATA). - 1× M.2 2242 B key socket with dual SIM support for LTE modules. - 1× MezIO™ expansion port for modular I/O expansion. - **High-Speed Storage:** - 2× internal 2.5" SATA III ports supporting RAID 0/1. - 1× M.2 2280 M key NVMe socket (PCIe Gen3 x4) for ultra-fast SSDs. - **Comprehensive Connectivity:** - 6× Gigabit Ethernet ports (Intel® I219 + I210 controllers). - Optional **IEEE 802.3at PoE+** (100W total) for ports 3–6. - 8× USB ports (4× USB 3.1 Gen2, 4× USB 3.1 Gen1). - 4× serial ports (2× RS-232/422/485 software-programmable, 2× RS-232). - 3× video outputs (VGA, DVI-D, DisplayPort). - 1× 3.5mm audio jack (mic-in/speaker-out). - **Rugged Industrial Design:** - Operating temperature: -25°C to +60°C (35W CPU) / -25°C to +50°C (65W CPU). - MIL-STD-810G compliance for vibration and shock resistance. - **Power Flexibility:** Wide-range **8–35V DC input** via 3-pin pluggable terminal block. - **Security & Management:** Supports **Intel® AMT 12.0** and **TPM 2.0** for remote management and hardware-level security.

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **AI Inference Platform:** Supports NVIDIA® Tesla T4 GPU with 8.1 TFLOPS (FP32) and 130 TOPS (INT8) for real-time inference acceleration. - **Dual PCIe Expansion:** Two PCIe x16 slots (Gen3, 8-lane each) in Cassette design for GPU and additional add-on card. - **High-Performance CPU:** Compatible with Intel® 8th/9th-Gen Core™ i7/i5/i3 processors (LGA1151 socket, 35W/65W TDP). - **Advanced Cooling System:** Patented Cassette and air tunnel design ensures efficient heat dissipation for sustained GPU operation up to 60°C ambient temperature. - **Rugged Industrial Design:** Complies with MIL-STD-810G vibration and shock standards for reliable operation in demanding environments. - **Flexible Storage Options:** Supports dual 2.5” SATA III drives with RAID 0/1, one M.2 2280 NVMe SSD (PCIe Gen3 x4), and one mSATA (mux with mini-PCIe). - **Comprehensive Connectivity:** 6x Intel® Gigabit Ethernet ports (I219 + I210), optional PoE+ (IEEE 802.3at) on ports 3–6 with 100W total budget. - **Rich I/O Interface:** 4x USB 3.1 Gen2, 4x USB 3.1 Gen1, 4x COM ports (2x RS-232/422/485, 2x RS-232), 1x VGA, 1x DVI-D, 1x DisplayPort, and audio I/O. - **Wide Temperature Operation:** -25°C to +60°C (35W CPU) or -25°C to +50°C (65W CPU) with Tesla T4 GPU installed. - **Flexible Mounting:** Wall-mount standard, optional DIN-rail kit available. - **Security and Management:** Supports Intel® AMT 12.0 and TPM 2.0 for remote management and hardware-level security. - **Expandable I/O:** One MezIO™ expansion port for Neousys modular I/O extensions (serial, digital I/O, PoE, GigE, USB, etc.).

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **High-Performance Edge AI Computing:** Supports a full-length, high-power **250W NVIDIA® GPU**, delivering up to **14 TFLOPS FP32** performance for AI inference, deep learning, and GPU-accelerated analytics. - **Flexible CPU Options:** Compatible with **Intel® Xeon® E** and **8th/9th Gen Core™ i3/i5/i7** processors (LGA1151 socket), offering up to **8 cores / 16 threads** for parallel processing and multitasking. - **Workstation-Grade Chipset:** Integrated **Intel® C246 Platform Controller Hub (PCH)** ensures robust I/O performance, ECC memory support, and enterprise-level reliability. - **Memory Capacity:** Up to **128 GB DDR4-2133** ECC or non-ECC SODIMM memory across **four slots**, enabling large-scale data processing and AI model deployment. - **Rugged Industrial Design:** Features **Neousys’ patented thermal design**, **damping brackets**, and a **GPU press bar** for mechanical stability under vibration and shock. Operates reliably in **-25°C to +60°C** environments (depending on CPU configuration). - **Wide-Range DC Input:** Accepts **8–35 VDC** input with **built-in ignition control**, making it suitable for in-vehicle and mobile deployments. - **Comprehensive Expansion Options:** Includes **PCIe Gen3 x16/x8 slots**, **M.2**, and **mini-PCIe** interfaces for flexible system expansion, communication modules, and storage upgrades. - **Front-Accessible I/O with Locking Mechanisms:** Front-panel **USB 3.1 Gen1/Gen2** and **Gigabit Ethernet** ports feature screw-lock connectors for secure industrial connections. - **Storage Flexibility:** Provides **one hot-swappable 2.5” HDD/SSD tray**, **one internal 2.5” drive bay**, and **M.2 NVMe** support for high-speed data access. - **Vehicle-Grade Reliability:** Complies with **MIL-STD-810G** vibration and shock standards, ensuring durability in harsh environments.

Manufacturer: Neousys Technology

Category: Embedded with GPU

- **Dual 250W GPU Support:** Accommodates two full-length, full-height NVIDIA® GPUs (up to 250W each), providing exceptional parallel computing power for AI and deep learning workloads. - **High-Performance CPU Options:** Supports Intel® Xeon® E-2176G/E-2124G or 8th-Gen Core™ i7/i5 processors (LGA1151 socket), offering up to 6 cores and 12 threads for intensive computational tasks. - **Workstation-Grade Chipset:** Integrated **Intel® C246** platform controller hub ensures stable performance, ECC memory support, and enterprise-level reliability. - **Wide Temperature Operation:** Patented thermal design enables reliable operation from **-25°C to +60°C** under full CPU/GPU load. - **Rugged Mechanical Design:** Features patented damping brackets and a GPU press bar to withstand **3 Grms vibration** and harsh industrial conditions. - **Flexible Power Input:** Wide-range **8–48 VDC** input with ignition control supports in-vehicle and field deployments. - **Extensive Expansion Capability:** Offers multiple PCIe slots (2x x16, 2x x8, 1x x4), M.2, and mini-PCIe interfaces for additional cards and modules. - **Comprehensive I/O Connectivity:** Includes dual Gigabit Ethernet ports, multiple USB 3.1 Gen1/Gen2 ports, serial ports, and triple display outputs (VGA, DVI-D, DisplayPort). - **Hot-Swappable Storage:** Two front-accessible 2.5” HDD/SSD trays and an M.2 NVMe slot for high-speed storage and easy maintenance. - **Industrial Compliance:** Meets **MIL-STD-810G** vibration and shock standards, and **CE/FCC Class A** EMC compliance.

Manufacturer: Neousys Technology

Category: Embedded with GPU

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 1× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, Neousys

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 1× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, UL certified,Neousys

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Ultra-low-profile embedded computer supporting Intel 14th/13th/12th Gen Core™ i9/i7/i5/i3 processors (LGA1700, 35/65?W TDP), Intel® Q670E chipset, up to 64?GB DDR5-4800 via 2× SODIMM. Integrated Intel UHD Graphics 770/730, 2× 2.5GbE + 1× GbE, USB 3.2 Gen2x2 Type-C, 6× USB 3.2, 2× USB 2.0, 1× VGA, 1× DVI-D, 1× DP, 2× RS-232/422/485, 2× RS-232, Audio, 2× 2.5" SATA (RAID 0/1), 1× M.2 Gen4 NVMe, 1× mini-PCIe, 1× M.2 B-Key with SIM, 1× MezIO® slot, ignition control optional, rugged ?25?°C…+70?°C fanless, 240×225×90??mm, 3.35?kg.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Ultra-low-profile embedded computer supporting Intel 14th/13th/12th Gen Core™ i9/i7/i5/i3 processors (LGA1700, 35/65?W TDP), Intel® Q670E chipset, up to 64?GB DDR5-4800 via 2× SODIMM. Integrated Intel UHD Graphics 770/730, 2× 2.5GbE + 1× GbE, USB 3.2 Gen2x2 Type-C, 6× USB 3.2, 2× USB 2.0, 1× VGA, 1× DVI-D, 1× DP, 2× RS-232/422/485, 2× RS-232, Audio, 2× 2.5" SATA (RAID 0/1), 1× M.2 Gen4 NVMe, 1× mini-PCIe, 1× M.2 B-Key with SIM, 1× MezIO® slot, ignition control optional, rugged ?25?°C…+70?°C fanless, ultra-low-profile chassis 240×225×78?mm, 3.35?kg.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 1× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 1× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 1× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 1× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, PoE+, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, PoE+, UL certified, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, dual PCIe x16 (8-lane) slots in Dual Cassette, 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×110.5 mm, 3.89 kg, UL certified, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, Neousys.

Manufacturer: Neousys Technology

Category: Nuvo-9000-Series