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Industrial Computers

Industrial computers are designed for reliable continuous operation in production, automation, and mechanical engineering. They withstand dust, vibration, and temperature fluctuations and provide a stable platform for control, visualization, and data acquisition.

Subcategories

2.1 - (Artificial Intelligence Robot) Computing platforms, cameras and robotic systems for industrial AI and automation applications.
2.1.1 - (Inference & Deep Learning) Computing platforms for running AI models and deep learning applications in industrial environments.
2.1.2 - (Smart AI Cams) Smart cameras for integrating image-based AI processing into industrial applications.
2.1.3 - (ROS Robots AV) Robotics platforms for developing ROS-based applications and autonomous navigation functions.
2.2 - (Embedded Systems) Embedded computers for integrating computing resources and interfaces into machinery and equipment.
2.2.1 - (Core i7/i5/i3 Embedded) Embedded computers with Intel Core i3, i5 and i7 processors for industrial computing and control tasks.
2.2.1.1 - (Adlink M-Series) ADLINK M-series embedded systems for industrial computing and integration applications.
2.2.1.2 - (Nuvo-6000/7000/8000-Series) Nuvo 6000, 7000 and 8000 series systems for industrial automation and data acquisition.
2.2.1.3 - (Nuvo-5000-Series) Nuvo-5000 series embedded computers for industrial control and processing tasks.
2.2.1.4 - (Nuvo-3000-Series) Nuvo-3000 series embedded computers for integration into machinery and existing installations.
2.2.1.5 - (Nuvo-4000-Series) Nuvo-4000 series embedded computers for industrial computing and interface applications.
2.2.1.6 - (Nuvo-2000-Series and others) Nuvo-2000 series and other embedded computers for industrial integration tasks.
2.2.1.7 - (Embedded with GPU) Embedded systems with GPUs for parallel data processing, image analysis and AI applications.
2.2.1.8 - (Nuvo-9000-Series) Nuvo-9000 series embedded computers for industrial automation and machine vision.
2.2.2 - (Atom Powered Embedded) Embedded computers with Intel Atom processors for compact industrial computing and control systems.
2.2.3 - (ARM Embedded Systems) ARM-based embedded systems for device integration, communication and industrial control tasks.
2.2.3.1 - (LCD HMI) ARM-based operator devices with LCDs for displaying and controlling machine functions.
2.2.3.2 - (IoT Gateway) IoT gateways for connecting devices and operational data to higher-level information systems.
2.2.3.3 - (Automation Controller) Automation controllers for implementing industrial control and communication tasks.
2.2.3.4 - (SBC Modules) ARM-based single-board computers for developing custom devices and embedded applications.
2.2.3.5 - (Accessories) System accessories for installing and expanding ARM-based embedded platforms.
2.2.4 - (IPC Embedded System) Embedded industrial computers for integration into machinery, test benches and automation systems.
2.2.5 - (HMI) HMI systems for operating and visualising industrial machinery and processes.
2.2.6 - (Handheld Android 5.0) Handheld devices with Android 5.0 for compatible mobile data collection and operator applications.
2.2.7 - (Power Modules) Power modules for connecting and operating compatible embedded systems.
2.3 - (PXI/cPCI Controller/Chassis) Controllers and chassis for modular PXI and CompactPCI measurement and control systems.
2.3.1 - (PXIe Platform) PXI Express platforms for building modular measurement and test systems.
2.3.1.1 - (PXIe / PXI Controller 3U) 3U controllers for central processing and control in PXI and PXI Express systems.
2.3.1.2 - (PXIe PXI Chassis) PXI and PXI Express chassis for compatible controllers and measurement modules.
2.3.2 - (cPCI 3U CPU chassis) CompactPCI processor cards and chassis in 3U format for modular industrial systems.
2.3.2.1 - (cPCI CPU P-III Level) Pentium III-class CompactPCI processor cards for compatible existing and replacement systems.
2.3.2.2 - (cPCI CPU LPP-266) LPP-266-class CompactPCI processor cards for maintaining compatible systems.
2.3.2.3 - (cPCI Interface Cards) CompactPCI interface cards for expanding modular industrial and control systems.
2.3.2.4 - (cPCI 3U 19'' Chassis) 3U CompactPCI chassis for building modular systems in 19-inch racks.
2.3.2.5 - (cPCI LCD) LCD components for display and operator functions in compatible CompactPCI systems.
2.3.2.6 - (cPCI Backplanes) CompactPCI backplanes for connecting controller and expansion assemblies.
2.3.2.7 - (cPCI Power Supplies) Power supplies for compatible CompactPCI systems.
2.3.3 - (cPCI 6U CPU, Chassis) CompactPCI processor cards and chassis in 6U format for industrial platforms.
2.3.3.1 - (cPCI CPU Card 6U) 6U CompactPCI processor cards for modular computing and control systems.
2.3.3.2 - (cPCI CPU Card P-III Level 6U) 6U Pentium III-class CompactPCI processor cards for compatible existing installations.
2.4 - (Industrial Computer) Industrial computers, panel PCs and displays for computing, operator and visualisation tasks.
2.4.1 - (Industrial Computer 19'' Systems) 19-inch industrial computer systems for integration into racks and automation cabinets.
2.4.1.1 - (Industrial Computer 19'') 19-inch industrial computers for central computing and control tasks.
2.4.1.2 - (IPC 19'' Workstation with LCD, Kbd, Low Mounting Depth) 19-inch workstations with LCD, keyboard and shallow mounting depth for compact racks.
2.4.1.3 - (IPC 19'' Workstation With LCD, Kbd) 19-inch workstations with integrated LCD and keyboard for industrial operator stations.
2.4.1.4 - (IPC 19'' Workstation With LCD) 19-inch workstations with LCDs for integrated processing and display of operational data.
2.4.2 - (Panel LCD PCs) Panel PCs with LCDs for integrating operator functions and computing into machine panels.
2.4.2.1 - (Panel IPCs With Front Controls) Panel industrial computers with front controls for operating machinery and equipment.
2.4.2.2 - (Panel IPCs Without Front Controls) Panel industrial computers without front controls for integrated operator and display solutions.
2.4.2.3 - (Open Frame PC System) Open-frame PC systems for installation in custom enclosures and operator panels.
2.4.3 - (Panel Displays) Panel displays for presenting industrial process, machine and system data.
2.4.3.1 - (Industrial Monitor) Industrial monitors for visualisation and operator stations in machinery and equipment.
2.4.3.1.1 - (LCD Panel 4:3) LCD panels in 4:3 format for integration into industrial display and operator solutions.
2.4.3.1.2 - (LCD Widescreen) Widescreen LCD displays for industrial process and application interfaces.
2.4.3.1.3 - (LCD Rackmount) Rackmount LCD monitors for display and operator stations in 19-inch systems.
2.4.3.1.4 - (LCD Monitor) LCD monitors for display tasks at industrial computer and operator stations.
2.4.3.2 - (LCD Open Metal Frame) LCD displays with open metal frames for integration into custom systems.
2.4.3.3 - (Panel 19") 19-inch display panels for integration into industrial racks and computer cabinets.
2.4.3.4 - (Panel Display 19'' With Keyboard) 19-inch display units with keyboards for central operator stations in rack systems.
2.5 - (Complete) Complete systems for industrial control, distributed I/O connectivity and motion automation.
2.5.1 - (EtherCAT) EtherCAT components for networking controllers, I/O modules and drives.
2.5.1.1 - (Master) EtherCAT masters for coordinating compatible drives and distributed I/O devices.
2.5.1.2 - (Modules) EtherCAT modules for expanding industrial control and automation systems.
2.5.1.3 - (Remote IO Modules) Remote I/O modules for distributed signal acquisition and output in EtherCAT networks.
2.5.2 - (Motion Control) Motion control systems for coordinating drives and industrial positioning tasks.

Products

1121 products

No. Code Product Price Quantity
2.2.1.1 i7-6700TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE MVP-6011
i7-6700TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i7-6700TE (quad-core, 2.4 GHz, 35W TDP) with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust-resistant, and maintenance-free performance in harsh industrial environments. - **Memory:** Dual-channel DDR4 SO-DIMM sockets supporting up to 32 GB DDR4 2133 MHz memory. - **Display Support:** Up to two independent displays via 2× DisplayPort, 1× DVI-D, and 1× VGA ports. - **Expansion Capability:** - 1× PCIe Gen3 x16 slot - 3× PCI 32-bit expansion slots - 1× internal Mini PCIe slot with USIM socket - **Networking:** 3× Intel® I211AT Gigabit Ethernet ports with teaming and Wake-on-LAN (WOL) support. - **Serial Communication:** 4× COM ports (2× RS-232/422/485 software-selectable, 2× RS-232). - **Digital I/O:** 8-channel digital input and 8-channel digital output. - **USB Connectivity:** 4× USB 3.0, 2× USB 2.0 external ports, and 1× internal USB 2.0 port. - **Storage Options:** 1× SATA III (6 Gb/s) port for 2.5" HDD/SSD and 1× Type II CFast socket. - **Audio:** 1× Mic-in and 1× Line-out. - **Power Input:** Wide-range 12–24 VDC input via 3-pin pluggable connector with latch. - **Operating Temperature:** 0°C to 50°C (fanless operation). - **Mounting:** Wall-mount kit included. - **Dimensions:** 220 (W) × 210 (D) × 208.7 (H) mm. - **Weight:** 4.7 kg. - **Certifications:** CE, FCC Class A, UL/cUL, CB, CCC.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 i5-6500TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE MVP-6012
i5-6500TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i5‑6500TE (quad‑core, 2.3 GHz, 35 W TDP) with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust‑resistant, and maintenance‑free performance. - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Graphics:** Integrated Intel® HD Graphics 530 supporting dual independent displays. - **Display Interfaces:** 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA, supporting resolutions up to 4096 × 2304 @ 60 Hz. - **Expansion Capability:** - 1 × PCIe Gen3 x16 slot - 3 × PCI 32‑bit slots - 1 × Mini PCIe slot with USIM socket - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support. - **Serial Communication:** 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA). - **Storage Options:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast socket. - **Audio:** 1 × Mic‑in and 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (fanless operation). - **Mounting:** Wall‑mount kit included. - **Construction:** Rugged aluminum chassis for industrial environments. - **Software Support:** Windows 10 / 7 / Embedded Standard 7 and Linux.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 i3-6100TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE MVP-6013
i3-6100TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i3‑6100TE (Skylake architecture, dual‑core, 35 W TDP) with Intel® HD Graphics 530 GPU. Supports Intel® Core™ i5‑6500TE and i7‑6700TE variants in the same series. - **Chipset:** Intel® H110 Express chipset (MVP‑6010 series). - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory. - **Display Support:** Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA. Maximum resolutions: - DisplayPort: 4096 × 2304 @ 60 Hz - DVI‑D: 1920 × 1200 @ 60 Hz - VGA: 1920 × 1080 @ 60 Hz - **Expansion Capability:** 1 × PCIe Gen3 x16 slot and 3 × PCI 32‑bit slots for legacy and modern add‑on cards. 1 × Mini‑PCIe slot with USIM socket for wireless or communication modules. - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with Wake‑on‑LAN (WOL) and teaming support. - **Serial Communication:** 4 × COM ports (DB‑9): - 2 × software‑selectable RS‑232/422/485 (COM1, COM2) - 2 × RS‑232 (COM3, COM4) - RS‑485 auto‑flow control and 2 kV surge protection on RS‑422/485 lines. - **Digital I/O:** 8‑channel digital input (DI) and 8‑channel digital output (DO), open‑drain MOSFET type, 24 mA per channel. - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external ports, and 1 × internal USB 2.0 port (all 1600 mA capable). - **Storage Options:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, and 1 × Type II CFast slot. - **Audio:** 1 × Mic‑in and 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–). Optional 160 W AC‑DC adapter for AC input. - **Mechanical Design:** Fanless aluminum chassis with front‑accessible I/O for simplified maintenance. Wall‑mount kit included. - **Operating Environment:** Fanless operation from 0 °C to 50 °C (with 35 W CPU). Storage temperature: –40 °C to 85 °C (excluding HDD/SSD/CFast). Humidity: 95 % @ 40 °C (non‑condensing).

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 i7-6700 H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE MVP-6015
i7-6700 H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i7-6700 (65W) Skylake CPU with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust-resistant, and maintenance-free performance. - **Memory Support:** Dual-channel DDR4 SO-DIMM sockets supporting up to 32 GB DDR4 2133 MHz memory. - **Display Capability:** Supports two independent displays via 2× DisplayPort, 1× DVI-D, and 1× VGA outputs. - **Expansion Slots:** - 1× PCIe Gen3 x16 slot - 3× PCI 32-bit slots - 1× internal Mini PCIe slot with USIM socket - **Networking:** 3× Intel® I211AT Gigabit Ethernet ports with teaming and Wake-on-LAN (WOL) support. - **Serial Communication:** 4× COM ports (2× RS-232/422/485 software-selectable, 2× RS-232). - **Digital I/O:** 8-channel digital input and 8-channel digital output. - **USB Connectivity:** 4× USB 3.0, 2× USB 2.0 external ports, and 1× internal USB 2.0 port. - **Storage Options:** 1× SATA III (6 Gb/s) port for 2.5" HDD/SSD and 1× Type II CFast socket. - **Audio Interface:** 1× Mic-in and 1× Line-out. - **Power Input:** Wide-range 12–24 VDC input via 3-pin pluggable connector with latch. - **Operating Temperature:** 0°C to 40°C (for 65W CPU). - **Mounting:** Wall-mount kit included for flexible installation. - **Dimensions:** 220 (W) × 210 (D) × 208.7 (H) mm. - **Weight:** 4.7 kg (10.36 lbs). - **Certifications:** CE, FCC Class A, UL/cUL, CB, CCC compliant.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 i7-6700TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE MVP-6021
i7-6700TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i7/i5/i3 (Skylake) processors with Intel® Q170 chipset. - **Memory:** Dual-channel DDR4 SO-DIMM sockets supporting up to 32 GB DDR4 2133 MHz memory. - **Display Support:** Up to two independent displays via 2× DisplayPort, 1× DVI-D, and 1× VGA ports. - **Expansion Capability:** - 2× PCIe Gen3 x8 slots - 2× PCI 32-bit slots - 1× internal Mini PCIe slot with USIM socket - **Networking:** 3× Intel® I211AT Gigabit Ethernet ports with teaming and Wake-on-LAN (WOL) support. - **Serial Communication:** 4× COM ports (2× RS-232/422/485 software-selectable, 2× RS-232). - **Digital I/O:** 8-channel digital input and 8-channel digital output. - **USB Connectivity:** 4× USB 3.0, 2× USB 2.0 external ports, and 1× internal USB 2.0 port. - **Storage Options:** 1× SATA III (6 Gb/s) port for 2.5" HDD/SSD and 1× Type II CFast socket. - **Audio:** 1× Mic-in and 1× Line-out. - **Power Input:** Wide-range 12–24 VDC input via 3-pin pluggable connector with latch. - **Operating Temperature:** 0°C to 50°C (fanless operation). - **Mounting:** Wall-mount kit included. - **Construction:** Rugged, fanless aluminum chassis for industrial environments. - **Software Support:** Windows® 10/7/Embedded Standard 7 and Linux. - **Optional Accessories:** Fan module, DDR4 memory upgrades, HDD/SSD options, and 160W AC-DC adapter.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 i5-6500TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE MVP-6022
i5-6500TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i5‑6500TE (Skylake, 4 cores, 35 W TDP) - **Chipset:** Intel® Q170 Express - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets, up to 32 GB DDR4‑2133 - **Display Support:** Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA - **Expansion Capability:** - 2 × PCIe Gen3 x8 slots (x16 mechanical) - 2 × PCI 32‑bit slots - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN - **I/O Interfaces:** - 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232) - 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 - 8 × Digital Input (DI) and 8 × Digital Output (DO) channels - 1 × Mic‑in, 1 × Line‑out - **Storage:** - 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD - 1 × Type II CFast socket - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector - **Operating Temperature:** 0 °C – 50 °C (fanless operation) - **Construction:** Fanless aluminum chassis, front‑accessible I/O, wall‑mountable - **Dimensions:** 220 (W) × 210 (D) × 208.7 (H) mm - **Weight:** 4.7 kg The MVP‑6022 delivers high computing performance with Intel® HD Graphics 530, supports dual independent displays, and provides robust I/O and expansion options for industrial environments requiring reliability and long lifecycle operation.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 i3-6100TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE MVP-6023
i3-6100TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

- **Processor Support:** 6th Generation Intel® Core™ i7/i5/i3 (Skylake) processors; MVP‑6023 specifically equipped with Intel® Core™ i3‑6100TE (dual‑core, 3.2 GHz, 35 W TDP). - **Chipset:** Intel® Q170 Express for extended I/O and industrial‑grade reliability. - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Display Capability:** Supports two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA; maximum resolution up to 4096 × 2304 @ 60 Hz. - **Expansion Slots:** - 2 × PCIe Gen3 x8 (mechanical x16 slots with x8 signals) - 2 × PCI 32‑bit/33 MHz slots - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support. - **Serial Communication:** 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA). - **Storage Interfaces:** 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot. - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (fanless operation with 35 W CPU). - **Mounting:** Wall‑mount kit included. - **Construction:** Rugged fanless aluminum chassis for high MTBF and silent operation.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 i7-6700 Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE MVP-6025
i7-6700 Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i7‑6700 (quad‑core, 3.4 GHz base, 4.0 GHz turbo, 65 W TDP) with Intel® Q170 chipset. - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory. - **Display Support:** Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA. Maximum resolutions: - DisplayPort: 4096 × 2304 @ 60 Hz - DVI‑D: 1920 × 1200 @ 60 Hz - VGA: 1920 × 1080 @ 60 Hz - **Expansion Capability:** 4 total slots: 2 × PCIe Gen3 x8 (x16 mechanical) and 2 × PCI 32‑bit slots. - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support. - **Serial Communication:** 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232), with 2 kV surge protection on RS‑422/485 lines. - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (open‑drain MOSFET, 24 mA sink/source). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA). - **Storage Interfaces:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast slot, and 1 × Mini‑PCIe slot with USIM socket. - **Audio:** 1 × Mic‑in and 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–). - **Operating Environment:** Fanless operation from 0 °C – 40 °C (with 65 W CPU). - **Mechanical Design:** Rugged aluminum chassis with wall‑mount kit included; front‑accessible I/O for simplified maintenance. - **Reliability:** Fanless design eliminates moving parts, improving MTBF and reducing maintenance in harsh environments.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Coffee Lake-S Fanless Configurable IPC with PCIe / PCI MVP-6100
Coffee Lake-S Fanless Configurable IPC with PCIe / PCI

- **Processor Platform:** Supports Intel® 8th/9th Generation Core™ i7/i5/i3 and Pentium®/Celeron® processors (Coffee Lake-S) with Intel® Q370 chipset. - **Fanless Design:** Completely fanless thermal solution for silent operation and enhanced reliability in dusty or vibration-prone environments. - **Flexible Expansion:** Configurable with PCIe and/or PCI slots for add-on cards, supporting legacy and modern industrial interfaces. - **High Performance:** Up to 6-core/12-thread CPU support with integrated Intel® UHD Graphics 630 for advanced visual computing. - **Rich I/O Connectivity:** Multiple Gigabit Ethernet ports, USB 3.1/2.0, serial ports, and display outputs (DisplayPort, DVI, VGA). - **Wide Operating Temperature:** Typically -20°C to +60°C (depending on configuration and storage type). - **Industrial-Grade Reliability:** Shock and vibration resistance, wide voltage input, and long product lifecycle support. - **Storage Flexibility:** Supports 2.5" SATA drives, M.2, and optional RAID configurations. - **Power Input:** 9–36 VDC wide-range power input with over-voltage and reverse polarity protection. - **Mounting Options:** Wall-mount, DIN-rail, or desktop installation. - **Software Compatibility:** Supports Windows 10 IoT Enterprise, Linux, and other industrial OS environments.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i7-QM57 fanless 2*PCI MXC-6101D
Core i7-QM57 fanless 2*PCI

- **Processor & Chipset:** Intel® Core™ i7‑620LE 2.0 GHz dual‑core CPU with Intel® QM57 chipset. - **Fanless Operation:** Completely fanless design for silent, maintenance‑free operation; optional hot‑pluggable fan module for high‑power PCI cards. - **Expansion Capability:** Two full‑length PCI slots for add‑on cards (MXC‑6101D variant). - **Display Support:** DVI‑I connector supporting both digital DVI‑D and analog VGA output (up to QXGA 2048 × 1536 resolution). - **Memory:** One DDR3 SO‑DIMM socket, supporting up to 4 GB DDR3‑800/1066 MHz. - **Storage:** Dual SATA ports for 2.5″ HDD/SSD, one eSATA port, and dual CompactFlash sockets (internal and external). - **Networking:** Dual Intel® 82574L Gigabit Ethernet ports (10/100/1000 Mbps). - **Serial Communication:** Four COM ports — two RS‑232/422/485 software‑selectable and two RS‑232. - **USB Connectivity:** Four external USB 2.0 ports and one internal USB 2.0 port on riser card. - **Digital I/O:** 16‑channel isolated digital input and 16‑channel isolated digital output (2500 V RMS isolation). - **Audio:** Realtek ALC262 HD Audio codec (mic‑in and line‑out). - **Power Input:** 9 VDC – 32 VDC wide‑range input with 3‑pin pluggable connector. - **Environmental Robustness:** Operating temperature 0 – 50 °C (standard) or ‑10 – 60 °C (with industrial SSD/RAM). - **Mechanical Design:** Cable‑free internal layout, vibration‑resistant structure, wall‑mountable chassis. - **Certifications:** CE and FCC compliant.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i7-QM57 fanless 1*PCI 1*PCIe MXC-6201D
Core i7-QM57 fanless 1*PCI 1*PCIe

- **Processor & Chipset:** Intel® Core™ i7‑620LE 2.0 GHz dual‑core CPU with Intel® QM57 chipset. - **Fanless, Cable‑Free Design:** Passive cooling architecture for silent, maintenance‑free operation. - **Expansion Capability:** One PCI 32‑bit slot and one PCIe x4 slot for add‑on cards. - **Wide‑Range Power Input:** 9 V DC – 32 V DC input with AT/ATX mode support. - **Display Interfaces:** DVI‑I connector supporting both DVI‑D and analog VGA via Y‑cable; optional 48‑bit LVDS internal header. - **Networking:** Dual Intel® 82574L Gigabit Ethernet controllers supporting 10/100/1000 Mbps. - **Serial Communication:** Two software‑selectable RS‑232/422/485 ports and two RS‑232 ports. - **USB Connectivity:** Four external USB 2.0 ports and one internal USB 2.0 port on riser card. - **Digital I/O:** 16‑channel isolated digital input and 16‑channel isolated digital output (2500 V RMS isolation). - **Storage Options:** Two SATA II/III ports for 2.5″ HDD/SSD, one eSATA port, and dual CompactFlash sockets (internal and external). - **Audio:** Realtek ALC262 HD audio codec with mic‑in and line‑out. - **Environmental Robustness:** Operating temperature 0 – 50 °C (standard) or –10 – 60 °C (extended with industrial SSD/CF). - **Mechanical Reliability:** 5 Grms vibration resistance (SSD/CF), 50 G shock tolerance, CE/FCC compliance. - **Optional Cooling:** Hot‑pluggable fan module for high‑power PCI/PCIe cards. - **Mounting:** Wall‑mount kit included. - **Security:** Internal USB port for license dongles or encryption keys.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i7-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6301D
Core i7-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor Platform:** 3rd Generation Intel® Core™ i7/i5/i3 (Ivy Bridge) processors with Intel® QM77 Mobile PCH. - **CPU Model:** Intel® Core™ i7‑3610QE, Quad‑Core, 2.3 GHz (Turbo up to 3.3 GHz), 6 MB cache. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz. - **Expansion:** Configurable 1 × PCI + 2 × PCIe ×8 or 1 × PCI + 1 × PCIe ×16 (Gen 2) slots. - **Display:** Triple independent display support via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600). - **Storage:** Dual onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD with RAID 0/1; dual CFast sockets (internal + external). - **Networking:** Two Intel® Gigabit Ethernet ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and Intel AMT 8.0/11.0 support. - **I/O Interfaces:** - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232 - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation) - 1 × Mic‑in, 1 × Line‑out (Realtek ALC269 HD Audio) - 1 × PS/2 keyboard, 1 × PS/2 mouse - **Power Input:** 9 – 32 V DC wide‑range input with pluggable connector and remote on/off. - **Design:** Fanless, cable‑free architecture for high reliability and low maintenance. - **Operating Temperature:** - Standard: 0 °C – 50 °C (with HDD) - Extended: –20 °C – 55 °C (with industrial SSD/CFast) - **Certifications:** CE/FCC Class A, UL/cUL, CB, KCC, RoHS, WEEE compliant.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i5-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6302D
Core i5-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **High‑Performance CPU:** Intel® Core™ i5‑3610ME dual‑core processor, 2.7 GHz base frequency (3.3 GHz Turbo), 3 MB cache. - **Chipset:** Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3 1600 MHz. - **Fanless Design:** Completely fanless and cable‑free architecture for silent operation and high reliability in harsh environments. - **Expansion Flexibility:** - 1 × PCI slot - 2 × PCIe x8 slots or 1 × PCIe x16 slot (auto‑switching, PCIe Gen 2) - **Triple Independent Display:** Two DisplayPort 1.1a and one DVI‑I port supporting up to three simultaneous displays. - **Storage:** - 2 × SATA III (6 Gb/s) ports for 2.5″ HDD/SSD - RAID 0/1 support - 2 × CFast sockets (1 external + 1 internal) - **Networking:** - 2 × Intel GbE ports (Intel I210IT + 82579LM) - Teaming, Wake‑on‑LAN, and Intel iAMT 8.0/11.0 support - **I/O Interfaces:** - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232 - 16‑channel isolated DI + 16‑channel isolated DO (1.5 kV isolation) - 1 × Mic‑in, 1 × Line‑out, 1 × PS/2 keyboard, 1 × PS/2 mouse - **Power Input:** 9 – 32 V DC wide‑range input with pluggable connector and remote on/off. - **Operating Temperature:** - Standard: 0 °C – 50 °C - Extended: –20 °C – 60 °C (with industrial SSD/CFast) - **Rugged Construction:** Aluminum alloy chassis, vibration‑resistant, shock‑resistant, and EMC‑compliant. - **Optional Fan Module:** Smart‑controlled fan for additional cooling when high‑power PCI/PCIe cards are installed.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i3-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6303D
Core i3-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor Support:** 3rd Generation Intel® Core™ i7/i5/i3 and Celeron processors (Ivy Bridge architecture). MXC‑6303D specifically integrates the Intel® Core™ i3‑3120ME dual‑core 2.4 GHz CPU with 3 MB cache. - **Chipset:** Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory. - **Display:** Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 @ 60 Hz). - **Expansion:** 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (auto‑switching, PCIe Gen 2). - **Storage:** Two onboard SATA III ports (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external). - **Networking:** 2 × Intel GbE ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and iAMT 8.0. - **I/O Interfaces:** - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232 - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation) - Audio: Mic‑in + Line‑out (Realtek ALC269 HD Audio) - PS/2 keyboard and mouse ports - **Power Input:** 9 – 32 V DC wide‑range input with pluggable 3‑pin connector and optional remote power switch. - **Design:** Completely fanless and cable‑free for high reliability in harsh environments. - **Operating Temperature:** - Standard: 0 °C – 50 °C (with HDD) - Extended: –20 °C – 60 °C (with industrial SSD/CFast) - **Certifications:** CE, FCC Class A, UL/cUL, CB, KCC. - **Mounting:** Wall‑mount kit included.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Celeron-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6305D
Celeron-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor Platform:** Intel® Celeron® 1020E (2.2 GHz, 2 MB cache) with Intel® QM77 Mobile Platform Controller Hub. - **Fanless Architecture:** Completely fanless and cable‑free design for enhanced reliability and silent operation. - **Memory Support:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory. - **Expansion Flexibility:** - 1 × PCI slot - 2 × PCIe ×8 slots or 1 × PCIe ×16 slot (auto‑switching) - PCIe Gen 2 compliance for high‑bandwidth add‑on cards. - **Triple Independent Display:** - 2 × DisplayPort and 1 × DVI‑I output - Resolutions up to 2560 × 1600 (DP1), 1920 × 1600 (DP2), and 1920 × 1200 (DVI‑I). - **Storage Options:** - 2 × SATA III ports for 2.5″ HDD/SSD (6 Gb/s) - RAID 0/1 support for performance or redundancy - 2 × CFast sockets (1 external, 1 internal). - **Networking:** - 1 × Intel® I219 and 2 × Intel® I210IT Gigabit Ethernet ports - Teaming function, Wake‑on‑LAN, and Intel® AMT 11.0 support. - **Rich I/O Interface:** - 2 × RS‑232/422/485 (software‑selectable) - 2 × RS‑232 - 4 × USB 3.0, 2 × USB 2.0, 1 × internal USB 2.0 - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation). - **Audio & Peripheral Support:** - Realtek ALC269 HD Audio (Mic‑in, Line‑out) - PS/2 keyboard and mouse ports. - **Power Input:** Wide‑range 9 – 32 V DC input with pluggable connector and remote on/off switch. - **Environmental Robustness:** - Operating temperature: 0 – 50 °C (standard) - Extended: –20 – 55 °C (with industrial SSD/RAM) - Vibration: 5 Grms (SSD/CFast) - Shock: 50 G, 11 ms half‑sine. - **Compact Rugged Design:** 172.5 (W) × 225 (D) × 213 (H) mm, weight 4.3 kg. - **Certifications:** CE, FCC Class A, UL/cUL, CB, KCC.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i7-QM77 fanless 2*Dport, 1*PCI, 1*PCIe*16 MXC-6311D
Core i7-QM77 fanless 2*Dport, 1*PCI, 1*PCIe*16

- **Processor Platform:** 3rd Generation Intel® Core™ i7/i5/i3 (Ivy Bridge) with Intel® QM77 Mobile PCH. - **CPU:** Intel® Core™ i7‑3610QE, 2.3 GHz base frequency (3.3 GHz Turbo), 6 MB cache, quad‑core. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz. - **Fanless Design:** Completely fanless and cable‑free architecture for silent, maintenance‑free operation and high reliability in harsh environments. - **Expansion:** 1 × PCI and 1 × PCIe x16 slot (auto‑switching to dual x8 when both populated). - **Display Capability:** Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 @ 60 Hz). - **Storage:** Dual onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external). - **Networking:** 3 × Intel® Gigabit Ethernet ports (1 × I219, 2 × I210IT) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 support. - **Serial Communication:** 2 × software‑programmable RS‑232/422/485 and 2 × RS‑232 ports. - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0. - **Digital I/O:** 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation). - **Audio:** Realtek ALC269 HD Audio codec with Mic‑in and Line‑out. - **Power Input:** Wide‑range 9 – 32 V DC input with pluggable connector and remote power switch. - **Operating Temperature:** 0 – 50 °C standard; ‑20 – 55 °C with industrial‑grade SSD/RAM. - **Construction:** Rugged aluminum chassis, wall‑mountable, vibration‑resistant, and shock‑tolerant.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i5-QM77 fanless 2*Dport, 1*PCI, 1*PCIe*16 MXC-6312D
Core i5-QM77 fanless 2*Dport, 1*PCI, 1*PCIe*16

- **Processor Platform:** 3rd Generation Intel® Core™ i5‑3610ME (Dual‑Core, 2.7 GHz base, 3.3 GHz Turbo, 3 MB cache) - **Chipset:** Intel® Mobile Platform Controller Hub QM77 - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz - **Fanless Design:** Completely fanless and cable‑free architecture for high reliability and silent operation - **Expansion Capability:** 1 × PCI and 1 × PCIe x16 slot (Gen 2) for add‑on cards - **Display Support:** Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 resolution) - **Storage:** Two onboard SATA III ports (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external) - **Networking:** Three Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming and Intel AMT 11.0 support - **Serial Communication:** 2 × RS‑232/422/485 (software‑selectable) and 2 × RS‑232 ports - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 - **Digital I/O:** 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation) - **Audio:** Integrated Realtek ALC269 HD audio codec (Line‑out + Mic‑in) - **Power Input:** 9 – 32 V DC wide‑range input with pluggable connector and remote on/off switch - **Operating Temperature:** - Standard: 0 °C – 50 °C - Extended: –20 °C – 60 °C (with industrial SSD/CFast) - **Construction:** Rugged aluminum alloy chassis, wall‑mountable - **Reliability:** Vibration 5 Grms, shock 50 G, ESD ±4 kV (contact) / ±8 kV (air) - **Certifications:** CE, FCC Class A, UL/cUL, CB, KCC

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i3-QM77 fanless 2*Dport, 1*PCI, 1*PCIe*16 MXC-6313D
Core i3-QM77 fanless 2*Dport, 1*PCI, 1*PCIe*16

- **Processor Platform:** Powered by a 3rd‑generation Intel® Core™ i3‑3120ME dual‑core CPU (2.4 GHz, 3 MB cache), paired with the Intel® QM77 Mobile Platform Controller Hub. Supports Intel® HD Graphics 4000 integrated GPU for high‑definition visual output. - **Fanless and Cable‑Free Design:** The MXC‑6313D employs a completely fanless architecture with passive heat dissipation, ensuring silent operation and high reliability in dusty or vibration‑prone environments. The cable‑free internal layout enhances mechanical robustness and thermal stability. - **Expandable Architecture:** Provides one PCI slot and one PCI Express x16 slot (Gen 2), allowing integration of add‑on cards for motion control, data acquisition, or specialized I/O expansion. - **Triple Independent Display Support:** Two DisplayPort connectors and one DVI‑I port enable simultaneous operation of up to three independent displays with resolutions up to 2560 × 1600 (1st DP), 1920 × 1600 (2nd DP), and 1920 × 1200 (DVI‑I). - **Comprehensive I/O Connectivity:** Includes 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0; 2 × RS‑232/422/485 software‑selectable ports and 2 × RS‑232 ports; 3 × Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming and Intel AMT 11.0 support; 16‑channel isolated digital input and 16‑channel isolated digital output. - **Storage Flexibility:** Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation, supporting RAID 0/1. Dual CFast sockets (one internal, one external) for solid‑state storage or OS installation. - **Wide‑Range Power Input:** Accepts 9 – 32 V DC input via pluggable connector with latch and optional remote power switch. - **Industrial‑Grade Reliability:** Operating temperature range of 0 °C – 50 °C (standard) or –20 °C – 60 °C with industrial‑grade SSD/RAM. Vibration tolerance up to 5 Grms (SSD/CFast) and shock resistance up to 50 G. - **Software and OS Support:** Compatible with Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, and Linux distributions.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i7-QM77 fanless 2*Dport, 3*PCI, 1*PCIe*16 MXC-6321D
Core i7-QM77 fanless 2*Dport, 3*PCI, 1*PCIe*16

- **Processor:** Intel® Core™ i7‑3610QE, 2.3 GHz base frequency (3.3 GHz Turbo), 6 MB cache, quad‑core architecture. - **Chipset:** Intel® Mobile Platform Controller Hub QM77. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory. - **Fanless Design:** Completely fanless and cable‑free architecture for silent operation and enhanced reliability in harsh environments. - **Expansion Capability:** - 3 × PCI slots - 1 × PCIe x16 slot (Gen 2) - Supports PCIe x8/x16 configurations for flexible system expansion. - **Display Support:** Three independent displays via 2 × DisplayPort and 1 × DVI‑I interface. - DisplayPort 1: up to 2560 × 1600 @ 60 Hz - DisplayPort 2: up to 1920 × 1600 @ 60 Hz - DVI‑I: up to 1920 × 1200 @ 60 Hz - **Storage:** - 2 × SATA III ports for 2.5″ HDD/SSD (6 Gb/s) - RAID 0/1 support for data redundancy and performance. - 2 × CFast sockets (1 external + 1 internal). - **Networking:** - 1 × Intel® I219 and 2 × Intel® I210IT Gigabit Ethernet ports. - Teaming function and Intel® AMT 11.0 support. - **I/O Interfaces:** - 2 × RS‑232/422/485 (software‑selectable) - 2 × RS‑232 - 4 × USB 3.0, 2 × USB 2.0, 1 × internal USB 2.0 - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation). - Audio: 1 × Mic‑in, 1 × Line‑out. - PS/2 keyboard and mouse ports. - **Power Input:** 9 – 32 V DC wide‑range input with pluggable connectors and remote power switch. - **Operating System Support:** Windows 7/Embedded Standard 7/XP/XP Embedded, Linux. - **Ruggedization:** - Operating temperature: 0 – 50 °C (standard) or –20 – 55 °C (with industrial SSD/RAM). - Vibration: 5 Grms (SSD/CFast), 0.5 Grms (HDD). - Shock: 50 G, 11 ms half‑sine (SSD/CFast). - Humidity: 95 % @ 40 °C (non‑condensing). - **Certifications:** CE, FCC Class A, UL/cUL, CB, KCC.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i5-QM77 fanless 2*Dport, 3*PCI, 1*PCIe*16 MXC-6322D
Core i5-QM77 fanless 2*Dport, 3*PCI, 1*PCIe*16

- **High‑Performance Computing:** Equipped with Intel® Core™ i5‑3610ME dual‑core processor (2.7 GHz base, 3.3 GHz Turbo, 3 MB cache) and Intel® QM77 chipset for enhanced CPU and GPU performance. - **Fanless, Cable‑Free Design:** Completely fanless architecture ensures silent operation and high reliability in dusty or vibration‑prone environments. Optional smart fan module available for high‑power PCI/PCIe cards. - **Wide Operating Temperature:** Standard 0 °C – 50 °C; extended range ‑20 °C – 60 °C with industrial‑grade SSD or CFast storage. - **Flexible Expansion:** Four expansion slots: 3 × PCI and 1 × PCIe × 16 (Gen 2). Supports full‑length add‑on cards up to 174 mm. - **Triple Independent Display:** Two DisplayPort and one DVI‑I output supporting up to 2560 × 1600 (DP1), 1920 × 1600 (DP2), and 1920 × 1200 (DVI‑I). Supports VGA/DVI/HDMI via adapters. - **Rich I/O Interfaces:** - 2 × Intel® GbE LAN (I219 + I210IT) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 - 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 - 2 × RS‑232/422/485 (software‑selectable), 2 × RS‑232 - 16‑CH isolated digital input and 16‑CH isolated digital output (1.5 kV isolation) - Audio (Mic‑in, Line‑out), PS/2 keyboard and mouse ports - **Storage Flexibility:** Two onboard SATA III ports for 2.5″ HDD/SSD with RAID 0/1 and 6 Gb/s transfer rate; two CFast sockets (internal + external). - **Power Input:** Wide‑range 9 – 32 V DC input with pluggable locking connector and optional 160 W AC‑DC adapter. - **Industrial‑Grade Reliability:** Shock resistance up to 50 G (11 ms half‑sine), vibration up to 5 Grms (SSD/CFast), ESD protection ±4 kV contact / ±8 kV air. - **Software Support:** Compatible with Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, and Linux.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i3-QM77 fanless 2*Dport, 3*PCI, 1*PCIe*16 MXC-6323D
Core i3-QM77 fanless 2*Dport, 3*PCI, 1*PCIe*16

- **Processor Platform:** 3rd Generation Intel® Core™ i3‑3120ME (2.4 GHz, 3 MB cache, dual‑core) with Intel® QM77 Mobile Platform Controller Hub. - **Fanless Design:** Completely fanless and cable‑free architecture for silent operation and enhanced reliability in harsh industrial environments. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory. - **Expansion Capability:** Four expansion slots — three PCI and one PCI Express ×16 (Gen 2) — enabling flexible system integration with add‑on cards. - **Display Support:** Triple independent display capability via two DisplayPort connectors and one DVI‑I port, supporting resolutions up to 2560 × 1600. - **Storage Options:** Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation with RAID 0/1 support; dual CFast sockets (one internal, one external). - **Networking:** Three Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming function, Wake‑on‑LAN, and Intel® Active Management Technology (iAMT 11.0). - **I/O Interfaces:** - 2 × RS‑232/422/485 (software‑selectable) - 2 × RS‑232 - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation) - Audio (Mic‑in, Line‑out) - PS/2 keyboard and mouse ports - **Power Input:** Wide‑range 9 – 32 V DC input with pluggable connector and remote power switch support. - **Operating Temperature:** - Standard: 0 °C – 50 °C - Extended: –20 °C – +55 °C (with industrial‑grade SSD/RAM) - **Mechanical Design:** Compact aluminum chassis (173 × 225 × 213 mm), weight 4.3 kg, wall‑mountable. - **Reliability:** Shock‑resistant (50 G, 11 ms), vibration‑tolerant (5 Grms, 5–500 Hz), CE/FCC Class A, UL/cUL, CB, KCC certified.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i7-QM170 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6401D/M4G
Core i7-QM170 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor and Chipset:** - 6th Generation Intel® Core™ i7‑6820EQ (4 cores / 8 threads, 2.8 GHz base, 3.5 GHz turbo, 8 MB cache) - Intel® QM170 Mobile Platform Controller Hub - **Memory:** - Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz - **Expansion Capability:** - 1 × PCI slot - 2 × PCIe Gen3 ×8 or 1 × PCIe Gen3 ×16 (auto‑switching) - 2 × Mini PCIe slots (one with USIM socket for 3G/4G connectivity) - **Display and Graphics:** - Integrated Intel® Gen9 Graphics (GT2e/GT4e) - 2 × DisplayPort 1.3 and 1 × DVI‑I supporting up to 4096 × 2304 @ 60 Hz - Triple independent display support (DisplayPort ×2 + DVI/VGA) - **Storage:** - 2 × front‑mounted hot‑swappable SATA III (6 Gb/s) trays for 2.5″ HDD/SSD - 2 × internal SATA III ports with RAID 0/1/5/10 support - 1 × Type II CFast socket (front) and 1 × internal CFast socket - **I/O Interfaces:** - 6 × USB 3.0 (2 × 1600 mA, 4 × 900 mA) - 1 × internal USB 2.0 port - 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232) - 3 × Intel® GbE ports (2 × I210IT, 1 × I219LM) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 - Optional 16‑channel isolated digital I/O (16 DI + 16 DO) with configurable filters - **Power and Reliability:** - 9 – 32 V DC wide‑range input - Optional 160 W AC‑DC adapter - Fanless operation from –20 °C to +70 °C (with industrial SSD/CFast) - Shock tolerance 50 G, vibration 5 Grms - **Management and Monitoring:** - Built‑in SEMA 3.0 (Smart Embedded Management Agent) - Watchdog Timer, remote power on/off connector

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i5-QM170 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6402D/M4G
Core i5-QM170 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor Platform:** 6th Generation Intel® Core™ i5‑6440EQ (Skylake) CPU, 4 cores / 4 threads, 2.7 GHz base frequency, 3.4 GHz Turbo, 6 MB cache. Integrated Intel® Gen9 HD Graphics (GT2e/GT4e) supporting 4K UHD output. - **Chipset:** Intel® QM170 Mobile Platform Controller Hub. - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Display Support:** Three independent displays via dual DisplayPort 1.3 and one DVI‑I port. Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD). Supports VGA/DVI/HDMI through converter cables. - **Expansion Capability:** 1 × PCI slot and either 2 × PCIe Gen3 x8 or 1 × PCIe Gen3 x16 slot (auto‑switching). 2 × Mini PCIe slots (one with USIM socket for 3G/4G connectivity). - **Storage:** 2 × front‑mounted hot‑swappable SATA III trays (2.5″ HDD/SSD). 2 × internal SATA III ports with RAID 0/1/5/10 support (6 Gb/s). 1 × Type II CFast socket (front or internal). - **Networking:** 3 × Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219). Features include teaming, Wake‑on‑LAN, Intel® iAMT 11.0, PXE boot, and EEE 802.3az. - **I/O Interfaces:** - 6 × USB 3.0 (2 × 1600 mA, 4 × 900 mA) - 1 × internal USB 2.0 - 2 × RS‑232/422/485 (COM1–2, software‑selectable) - 2 × RS‑232 (COM3–4) - 1 × PS/2 keyboard and 1 × PS/2 mouse - Audio in/line out (Realtek ALC262 HD Audio) - Optional 16 × DI + 16 × DO isolated digital I/O with configurable filters and COS interrupt - **Power Input:** 9 – 32 V DC wide‑range input with 3‑pin pluggable connector (V+, V–, GND). Optional 160 W AC‑DC adapter for AC operation. Remote power on/off connector on front panel. - **Environmental Design:** Fanless, cable‑free construction with optional hot‑pluggable fan module. Standard operating range 0 – 50 °C (with HDD). Extended range –20 – 70 °C (with industrial SSD/CFast). Vibration 5 Grms (SSD/CFast), 0.5 Grms (HDD); Shock 50 G 11 ms. Humidity 95 % @ 40 °C non‑condensing. - **Certifications:** CE, FCC Class A EMC; UL/cUL and CB Safety; RoHS and WEEE compliant.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Core i3-QM170 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6403D/M4G
Core i3-QM170 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor and Chipset:** Equipped with Intel® Core™ i3‑6100E dual‑core, four‑thread CPU (2.7 GHz, 3 MB cache) and Intel® QM170 chipset for enhanced performance and low power consumption. - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory. - **Expansion Flexibility:** One PCI slot and two PCIe Gen3 ×8 slots (or one PCIe ×16 slot, auto‑switching) for add‑on cards. Two Mini PCIe slots and one USIM socket for 3G/4G communication modules. - **Display Capabilities:** Supports up to three independent displays via two DisplayPort 1.3 and one DVI‑I port. Maximum resolution up to 4096 × 2304 @ 60 Hz (4K UHD). DisplayPort to VGA/DVI/HDMI conversion supported via adapter cables. - **Storage:** Two front‑mounted hot‑swappable 2.5″ SATA III trays and two internal SATA III ports (6 Gb/s) with RAID 0/1/5/10 support. One internal Type II CFast socket for solid‑state storage. - **Connectivity:** Three Intel® Gigabit Ethernet ports (2 × I210IT, 1 × I219LM) with teaming, Wake‑on‑LAN, and Intel® AMT 11.0 support. Six USB 3.0 ports (two × 1600 mA, four × 900 mA) and one internal USB 2.0 port. Four serial ports: two software‑programmable RS‑232/422/485 and two RS‑232. Optional 16‑channel isolated digital input/output (DI/O) module with configurable digital filters. - **Power and Reliability:** Wide‑range 9–32 V DC input with remote power on/off connector. Optional 160 W AC‑DC adapter. Fanless operation from –20 °C to +70 °C (with industrial SSD/CFast). Built‑in watchdog timer and SEMA 3.0 system management. - **Mechanical Design:** Compact, cable‑free, fanless aluminum chassis (150 × 200 × 225 mm, 4 kg). Wall‑mountable with optional fan module for high‑power PCIe cards.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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2.2.1.1 Coffee Lake-H Fanless Configurable System with PCIe / PCI MXC-6600
Coffee Lake-H Fanless Configurable System with PCIe / PCI

- **Processor Platform:** Powered by Intel® 8th/9th Generation Core™ i7/i5/i3 and Xeon® E processors (Coffee Lake-H series), offering up to 6 cores and 12 threads for high-performance computing. - **Fanless Design:** Completely fanless thermal solution for silent operation and enhanced reliability in harsh or dusty environments. - **Flexible Expansion:** Supports one PCIe x16 or one PCI slot, allowing integration of modern or legacy expansion cards. - **Rich I/O Connectivity:** Multiple USB 3.1/2.0 ports, DisplayPort, DVI-D, COM ports, and dual Gigabit Ethernet interfaces for versatile connectivity. - **Wide Operating Temperature Range:** Designed for industrial environments with extended temperature operation (typically -20°C to +60°C, depending on configuration). - **Rugged Construction:** Aluminum and steel chassis with vibration and shock resistance suitable for factory floors and mobile applications. - **Storage Options:** Supports multiple storage devices including 2.5" SATA drives, M.2 SSDs, and optional RAID configurations. - **Memory Capacity:** Dual-channel DDR4 SO-DIMM slots supporting up to 64 GB of memory for data-intensive applications. - **Power Input Flexibility:** Wide-range DC input (typically 9–36 VDC) for compatibility with industrial power systems. - **Remote Management:** Optional Intel® AMT and TPM 2.0 support for secure remote monitoring and management. - **Long-Term Availability:** Industrial-grade components and extended lifecycle support for long-term deployment.

Manufacturer: Adlink Technology Inc.

Category: Adlink M-Series

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